JP2000043832A - Method and apparatus for releasing electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a release device capable of smoothly releasing electronic parts from the adhesive tape of a series of electronic parts without damaging electronic parts. SOLUTION: The apparatus comprises a conveyer device for conveying a series of electronic parts 2 having a plurality of electronic parts 4 adhered on the entire surface of a continuous adhesive tape 3 along its longitudinal direction, a release wheel 6 being a release member formed to be driven to exert force to the electronic part 4 in the sharing direction relative to its adhesive surface in the surface side with the electronic parts 4 of a series of electronic parts 2 adhered thereto, and a released parts or projection configured in accordance with individual electronic part 4, and release member moving device for allowing the release wheel 6 to be moved in the direction intersecting the longitudinal direction of a series of electronic parts 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for separating electronic components from a series of electronic components having a plurality of electronic components attached to a long adhesive tape.

[0002]

2. Description of the Related Art In the production and mounting of electronic components such as chip-type inductors, for example, a series of electronic components is used in which electronic components are pasted on a carrier tape made of an adhesive tape. Conventionally, when an electronic component is peeled from such a series of electronic components, a peeling method shown in FIG. 8 has been devised.

As shown in FIG. 8A, a plurality of electronic components 52 are adhered on a long adhesive tape 51 to form a series of electronic components 53. The electronic component chain 53 is a roll 5
4 and a roll (not shown), and is moved in the direction of arrow A shown.

[0004] A sensor 55 is disposed in a portion after passing through the roll 54. The sensor 55 includes an adhesive tape 51
It is provided for detecting the position of the upper electronic component 52. The peeling unit 56 is positioned below the electronic component 52 to be peeled based on the position information detected by the sensor 55. The peeling unit 56 has a concave portion 56a opened upward. The recess 56 a has a shape corresponding to the outer shape of the electronic component 52.

Next, as shown in FIG. 8B, the peeling unit 56 is moved upward, and the electronic component 5 is placed in the recess 56a.
2 is stored. Thereafter, the peeling unit 56 is moved to its axis 5
6b, thereby separating the electronic component 52 from the adhesive tape 51. Thereafter, the peeling unit 5
The electronic component 52 accommodated in the concave portion 56a of the peeling unit 56 is transferred to a production line (not shown) or a printed circuit board.

[0006]

In the conventional method of separating the electronic component 52, the position of the electronic component 52 is detected by the sensor 55. However, if the accuracy of the position at which the electronic component 52 is stuck on the adhesive tape 51 is not sufficient, the electronic component 52 cannot be accurately stored in the recess 56 a of the peeling unit 56 even if the position is detected by the sensor 55. There was something. As a result, the electronic component 52 cannot be peeled from the adhesive tape 51, or the electronic component 52 collides with the peeling unit 56, and the electronic component 52
May be damaged. Therefore, the adhesive tape 5
1, the electronic component 52 had to be positioned and attached with high accuracy.

Further, as described above, since the peeling unit 56 must be operated while the electronic component train 53 is being conveyed, it is necessary to control the peeling unit 56 and the electronic component train 53 with high precision. 52 could not be sped up. Another problem is that the cost is high.

[0008] In addition, when the peeling unit 56 is used, the electronic component 52 is peeled by rotating the electronic component 52 with respect to the adhesive tape 51. Therefore, a force for twisting the electronic component 52 is applied to the electronic component 52, and there is a possibility that some of the electronic components may be damaged.

In particular, as shown in FIGS. 9A and 9B, when a chip-type coil is used as an electronic component, the chip-type coil is easily damaged. In other words, the chip type coil has a relatively small diameter winding portion 57.
a at both ends of the flange portions 57b, 57 having a relatively large diameter.
c having a core 57. The outer surface of one flange portion 57 b of the core 57 is adhered to the adhesive tape 51.

Therefore, as shown in FIG.
When the accuracy of the attaching position of 7 is not sufficient, the peeling unit 5
6 may collide with the lower flange portion 57c and be damaged.

Further, as shown in FIG. 9B, when the peeling unit 56 is rotated after the core 57 is housed in the concave portion 56a of the peeling unit 56, the flange portions 57b,
A large torsional force is applied to the core 57 by the inner wall of the concave portion 56a. As a result, breakage was likely to occur at the boundary between the winding part 57a and the funnel parts 57b and 57c. Further, the above-mentioned problem becomes more conspicuous when the speed of the step of peeling the electronic component 52 or the chip-type coil is increased.

An object of the present invention is to solve the above-mentioned drawbacks of the prior art, and to smoothly separate an electronic component from a series of electronic components having a plurality of electronic components attached to an adhesive tape without causing damage to the electronic component. An object of the present invention is to provide an electronic component peeling apparatus and a peeling method that can perform a peeling operation at high speed.

[0013]

According to a first aspect of the present invention, there is provided an electronic component peeling apparatus comprising a plurality of electronic components attached to one surface of a long adhesive tape along a longitudinal direction. A transport device that transports the electronic components in the longitudinal direction,
On the surface side on which the electronic components of the electronic component series are attached, the electronic component series is configured to be moved in a different direction or at a different speed from the transport of the electronic component series, and has a shape corresponding to each electronic component. A peeling member having a concave portion formed therein and a peeling member moving device for moving the peeling member are provided.

In the invention described in claim 2, the peeling member has an annular electronic component storage section in which a plurality of recesses are formed in a circumferential direction dispersedly, and the peeling member moving device has an annular shape. The electronic component storage unit is configured to move in a circumferential direction, and the transport device is configured to move the electronic component series in a radial direction of the annular electronic component storage unit.

According to a third aspect of the present invention, there is provided an electronic component peeling apparatus, wherein the electronic component is pressed toward the concave portion from a surface opposite to a surface on which the electronic components connected to the electronic component are attached. And a pushing member for performing the operation.

According to a fourth aspect of the present invention, there is provided a method for separating electronic components, wherein a plurality of electronic components are attached to one surface of a long adhesive tape, and the method is different from the transport of the electronic components. A peeling member having a concave portion corresponding to the shape of the electronic component is moved in the direction or at a different speed, and the electronic component is brought into contact with the wall surface of the concave portion, and a force is applied in a shearing direction to a portion where the electronic component and the adhesive tape are adhered. And peeling the electronic component from the adhesive tape.

According to the fifth aspect of the present invention, when the electronic component is peeled off, the side on which the electronic component is attached is opposite to the side on which the electronic component is connected so that the electronic component can enter the recess. The pressing member presses the series of electronic components.

According to the present invention, as the electronic component, a core portion having a relatively small diameter and a pair of flange portions provided at both ends of the core portion and having a relatively large diameter are provided. Chip type coil is used.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be clarified by describing non-limiting embodiments of the present invention with reference to the drawings.

FIG. 2 is a perspective view showing the appearance of an electronic component peeling apparatus according to one embodiment of the present invention. In the peeling device 1, the electronic component chain 2 is supplied in the illustrated arrow B direction, that is, along the length direction of the electronic component chain 2. Electronic components series 2
Has a structure in which a plurality of electronic components 4 are attached to the upper surface of an adhesive tape 3 at predetermined intervals along the length direction. The electronic component chain 2 is transported by a drive source (not shown),
Twisted above the stage 1a of the peeling device 1,
At the center of the stage 1a, it is conveyed in the direction of arrow C shown in the inverted state. That is, at the center of the stage 1a, the electronic component chain 2 is transported such that the surface to which the electronic component 4 is attached is on the lower side. Here, the cross-sectional structure of the electronic component series 2 will be described in more detail with reference to FIG.

Although schematically shown in FIG. 2, the electronic component 4 has a chip-shaped coil shape in this embodiment, as shown in FIG. 1A. That is, the electronic component 4
Has a winding portion 4a having a relatively small diameter and a pair of flange portions 4b and 4c formed so as to be continuous with both ends of the winding portion 4a and having a relatively large diameter. Flange part 4
b is attached to the adhesive tape 3, and the electronic component 4 is attached to the adhesive tape 3.

A base film 5 is laminated on the adhesive surface of the adhesive tape 3. The base film 5 is made of a suitable synthetic resin such as polypropylene or paper,
Through holes 5a are formed at predetermined intervals. The adhesive surface of the adhesive tape 3 is exposed at the portion where the through hole 5a is formed, and the electronic component 4 is attached to the adhesive surface as described above.

Returning to FIG. 2, a peeling wheel 6 as a peeling member is disposed on the stage 1a. Details of the peeling wheel 6 will be described with reference to FIG. The peeling wheel 6 has a disk-like shape, and has an annular electronic component housing 7 on the outer peripheral portion. In the electronic component storage 7,
A plurality of recesses 8 according to the shape of the electronic component 4 are formed in a distributed manner in the circumferential direction.

That is, in the peeling wheel 6, an outer peripheral portion of the disk-shaped main body 6a is protruded upward to form an annular electronic component housing portion 7. The concave portion 8 has a shape extended in the radial direction of the peeling wheel 6 so as to open to the inner peripheral wall 7a and the outer peripheral wall 7b of the electronic component storage portion 7. The width of the recess 8, that is, the width in the direction orthogonal to the radial direction, is equal to or slightly larger than the outer dimension of the electronic component 4.

The peeling wheel 6 is driven to rotate in the direction of arrow D in FIG. 3 by a driving source (not shown). An appropriate drive source such as a motor can be used as the peeling member moving device that rotates the peeling wheel 6.

In FIG. 3, at a portion indicated by a two-dot chain line E, the electronic component chain 2 is moved along the radial direction of the peeling wheel 6. On the other hand, the peeling wheel 6 is rotated in the direction of arrow D as described above. Therefore, the peeling wheel 6
Is moved in a direction crossing the length direction of the electronic component chain 2.

A pushing member 9 for pressing the electronic component chain 2
However, among the plurality of recesses 8 of the peeling wheel 6, they are arranged on the recesses 8 at positions where the electronic components 4 are supplied from the electronic component chain 2.

Next, a method of peeling an electronic component using the electronic component peeling apparatus 1 of the present embodiment will be described with reference to FIG. FIG. 1 is a cross-sectional view as viewed from the direction of arrow A in FIG.

In FIG. 1A, the electronic component chain 2 is conveyed from the spine of FIG. 1A toward the front of the paper. The electronic component 4 is attached to the lower surface of the adhesive tape 3,
The inner size of the recess 8 provided in the peeling wheel 6 is slightly larger than the outer size of the electronic component 4.

Therefore, when the electronic component 4 is positioned above the concave portion 8, the pressing member 9 is lowered to cause the pressing member 9 to bend the adhesive tape 3 downward (FIG. 1B).
And FIG. 4). As a result, the electronic component 4 is stored in the recess 8.

On the other hand, the peeling wheel 6 is rotated in the direction of arrow D in FIG. Therefore, as shown in FIG. 1C, the rotation of the peeling wheel 6 causes the recess 8 to push the electronic component 4 in the lateral direction. As a result, a force in the shearing direction acts on a portion where the adhesive tape 3 and the electronic component 4 are adhered, and the electronic component 4 is peeled from the adhesive tape 3.
Therefore, the electronic component 4 is stored in the recess 8.

Next, after the peeling of the electronic component 4 is completed, the peeling wheel 6 is rotated in the direction of the arrow D so that the center of the width of the electronic component row 2 is aligned with the center of the next concave portion 8 in the width direction. You. Thereafter, the next electronic component 4 is stored in the next recess 8 by the same operation as described above.

In the peeling apparatus 1 of this embodiment, the electronic component 4
Is simply pressed by the side wall 8a of the recess 8 and peeled off by the force applied in the shear direction to the adhesive surface. Therefore, even when, for example, a chip-type coil as shown in FIG. 1 is used as the electronic component 4, no torsional force is applied to the electronic component 4 itself. Therefore, the electronic component 4 is hardly damaged.

In the above embodiment, as the peeling member,
Although the peeling wheel 6 is used, the peeling member of the present invention can be moved in a direction intersecting with the transport direction of the electronic component chain 2 and exert a force in the shearing direction on the adhesive surface between the electronic component and the adhesive tape. An appropriate type of peeling member can be used.

For example, in the peeling member 11 shown in FIG. 5, an endless transport belt 13 is stretched between a pair of rolls 12a and 12b. One of the rolls 12a and 12b may be driven to rotate, or both may be driven to rotate. By the rolls 12a and 12b, the transport belt 13
It is driven in the direction indicated by arrow E.

On the other hand, protrusions 13a are formed on the outer surface of the conveyor belt 13 at predetermined intervals and extend in the width direction of the conveyor belt 13. The protrusion 13 a is slightly smaller than the height of the electronic component 4.

When the peeling member 11 is used, the arrow F in FIG.
As shown by, an electronic component chain 2 is supplied. That is,
The electronic component attached to the lower surface of the electronic component chain 2 enters the recess 15 between the protrusions 13a. At this time,
By moving the transport belt 13 in the direction of arrow E shown in the figure, the electronic component 4 is moved in the direction of arrow E by the side wall of the projection 13a. Therefore, a force also acts on the adhesive surface of the electronic component with the adhesive tape in the shearing direction, and the electronic component is separated from the adhesive tape.

Thus, the peeling wheel 6 shown in FIG.
Instead of the rotary peeling member, a direct acting peeling member 11 may be used. The shape of the projection 13a is not limited to a rectangular parallelepiped as shown in FIG.
The shape of the cylindrical protrusion 13b shown in FIG. 6A, the prismatic protrusion 13c shown in FIG. 6B, or the hemispherical protrusion 13d shown in FIG. 6C can be arbitrarily changed. it can.

Further, as shown in FIG. 5, the peeling member 11 is not limited to the one in which the rotation centers of the rolls 12a and 12b are arranged in the horizontal direction, and as shown in FIG.
The rolls 12a and 12b may be arranged such that the rotation axes of the rolls 12a and 12b face the vertical direction. In this case, the transport belt 13 is transported in a state where its width direction coincides with the up-down direction. Therefore, the electronic component 4 housed between the projections 13a, 13a falls downward from between the projections 13a, 13a simultaneously with the separation.

The peeling wheel 6 shown in FIG.
And in the peeling members 11 and 11 shown in FIG.
The recesses 8 and 15 are arranged in a direction
Has been moved, but the concave portion 15 may be transported in the same direction as the transport direction of the electronic component chain 2. That is, in the case of transporting in the same direction, the moving speed of the concave portion 15 is made different from the transport speed of the electronic component series 2 so that the side wall of the concave portion 15 causes the adhesive surface between the electronic component 4 and the adhesive tape 3 to be sheared in the shearing direction. Can be applied to the electronic component 4 and the electronic component 4 can be peeled off without applying a torsional force.

[0041]

According to the first aspect of the present invention, the electronic component strip is transported in the longitudinal direction by the transport device, and the electronic component strip is conveyed in the length direction on the side of the electronic component strip to which the electronic component is attached. The peeling member is moved so as to apply a force in the shearing direction to the adhesive portion between the electronic component and the adhesive tape, the side wall of the concave portion of the peeling member is brought into contact with the electronic component, and the adhesive surface between the electronic component and the adhesive tape is A force acts in the shear direction. Therefore, the electronic component is easily peeled off from the adhesive tape by the force acting in the shearing direction. In this case, since no torsional force is applied to the electronic component, the electronic component is less likely to be damaged.

Therefore, since no excessive force acts on the electronic component, the operation for separating the electronic component from the adhesive tape of the series of electronic components can be speeded up, and the electronic component can be efficiently separated. Becomes

According to the second aspect of the present invention, the peeling member comprises:
It has an annular electronic component storage section, and the annular electronic component storage section is moved in the circumferential direction by the peeling member moving device. On the other hand, the transport device is configured to move the series of electronic components along the radial direction of the annular electronic component storage unit. Therefore, in a state where the conveyed electronic components of the series of electronic components enter the concave portion of the annular electronic component storage portion, the annular electronic component storage portion is moved in the circumferential direction, and the electronic component is moved by the side wall of the concave portion. A force in the shearing direction acts on the electronic component, whereby the electronic component is easily peeled off from the adhesive tape.

According to the third aspect of the present invention, a pushing member is provided for pressing the electronic component toward the concave portion from the surface opposite to the surface on which the electronic components are attached. Therefore, at the time of peeling, the electronic component can more reliably enter between the concave portions or the protrusions of the peeling member.

In the method for peeling an electronic component according to the present invention, a force in the shear direction of the electronic component is applied to a series of electronic components having a plurality of electronic components attached to one surface of a long adhesive tape. The electronic component is peeled off from the adhesive tape by moving the peeling member having the concave portion corresponding to the shape of the electronic component so that the electronic component comes into contact with the wall surface of the concave portion and exerts a force in the shearing direction. Therefore, similarly to the first aspect of the present invention, no torsional force is applied to the electronic component.
Electronic components are unlikely to be damaged.

Further, since it is only necessary to apply a force in the shearing direction to the adhesive part between the electronic component and the adhesive tape, it is easy to control the moving speed of the peeling member and the transport speed of the series of electronic components, and the speed of the peeling operation is high. Can be achieved.

According to the fifth aspect of the present invention, the pushing of the electronic component connecting member from the surface opposite to the side on which the electronic component is attached is performed so that the electronic component connecting member can enter the recess. , The electronic component is securely housed in the recess.

According to the present invention, as an electronic component, a chip having a relatively small-diameter core portion and a pair of relatively large-diameter flange portions provided at both ends of the core portion. Although a type coil is used, such an inductor is easily damaged by torsional force, but since a torsional force is not applied at the time of peeling, by using the electronic component peeling method according to the present invention, the chip type coil is removed from the adhesive tape. It can be peeled off without difficulty.

[Brief description of the drawings]

FIGS. 1A to 1C are cross-sectional views illustrating a step of peeling an electronic component in one embodiment of the present invention.

FIG. 2 is an external perspective view of an electronic component peeling apparatus according to one embodiment of the present invention.

FIG. 3 is a perspective view for explaining a main part of an electronic component peeling apparatus according to one embodiment of the present invention.

FIG. 4 is a perspective view for explaining the operation of a pushing member in the electronic component peeling apparatus according to one embodiment of the present invention.

FIG. 5 is a perspective view for explaining another example of the peeling member.

6 (a) to 6 (c) are perspective views showing modifications of the protrusion of the peeling member shown in FIG.

FIG. 7 is a perspective view for explaining still another example of the peeling member.

FIGS. 8A and 8B are side cross-sectional views illustrating a conventional electronic component peeling apparatus.

FIGS. 9A and 9B are cross-sectional views for explaining steps of peeling a chip coil from an adhesive tape in a conventional peeling device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Peeling apparatus 2 ... Electronic component series 3 ... Adhesive tape 3a ... Adhesive surface 4 ... Electronic component 5 ... Base film 6 ... Peeling wheel as a peeling member 7 ... Toroidal electronic component storage part 8 ... Depression 11 ... Peeling member 12a , 12b Roll 13 Transport belt 13a Projection

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takiji Kitagawa 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term in Murata Manufacturing Co., Ltd. (Reference) 3E058 AA10 BA05 CB10

Claims (6)

[Claims] 1. A transport device for transporting a series of electronic components having a plurality of electronic components attached to one surface of a long adhesive tape along a longitudinal direction in a longitudinal direction of the series of electronic components; On the surface side on which the electronic components are attached, a concave portion having a shape corresponding to each electronic component is formed so as to be moved in a different direction or at a different speed from the transportation of the series of electronic components. An exfoliation device for an electronic component, comprising: an exfoliation member that has been removed; and an exfoliation member moving device that moves the exfoliation member. 2. The peeling member has an annular electronic component storage section in which a plurality of recesses are formed in a circumferential direction in a distributed manner, and the peeling member moving device moves the annular electronic component storage section in a circumferential direction. 2. The electronic component according to claim 1, wherein the transport device is configured to move the series of electronic components along a radial direction of the annular electronic component storage unit. 3. Peeling device. 3. A pressing member for pressing the electronic component toward the recess from a surface opposite to a surface on which the electronic components of the electronic component series are attached. An electronic component peeling apparatus according to any one of claims 1 and 2. 4. A concave portion corresponding to the shape of an electronic component in a direction or at a different speed from a direction in which the electronic component sequence is conveyed, wherein a plurality of electronic components are attached to one surface of a long adhesive tape. Moving the peeling member having the electronic component into contact with the wall surface of the concave portion, applying a force in a shearing direction to a portion where the electronic component and the adhesive tape are adhered, and peeling the electronic component from the adhesive tape. A method of peeling an electronic component. 5. When the electronic component is peeled off, the electronic component is pressed by a pushing member from a surface opposite to the side on which the electronic component is attached so that the electronic component can enter the recess. Characterized by pressing a series of parts,
The method for peeling an electronic component according to claim 4. 6. A chip type coil having a relatively small-diameter core portion and a pair of relatively large-diameter flange portions provided at both ends of the core portion as the electronic component. The method for stripping an electronic component according to claim 4.