JPH01145149U - - Google Patents
Info
- Publication number
- JPH01145149U JPH01145149U JP4263288U JP4263288U JPH01145149U JP H01145149 U JPH01145149 U JP H01145149U JP 4263288 U JP4263288 U JP 4263288U JP 4263288 U JP4263288 U JP 4263288U JP H01145149 U JPH01145149 U JP H01145149U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- input terminal
- housed
- sets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Description
第1図は本考案の発光ダイオード装置の回路図
、第2図は一具体的構造例の平面図、第3図は第
2図の縦断面図である。第4図ないし第6図は従
来の発光ダイオード装置の異なる例の回路図であ
る。
1a,1b……発光ダイオード、2a,2b…
…保護ダイオード、3a,3b……入力端子。
FIG. 1 is a circuit diagram of a light emitting diode device of the present invention, FIG. 2 is a plan view of a specific structural example, and FIG. 3 is a longitudinal sectional view of FIG. 2. 4 to 6 are circuit diagrams of different examples of conventional light emitting diode devices. 1a, 1b... Light emitting diode, 2a, 2b...
...protection diode, 3a, 3b...input terminal.
Claims (1)
列接続したもの二組を互いに逆方向に並列接続し
、その接続点を入力端子として、同一パツケージ
に収容したことを特徴とする発光ダイオード装置
。 A light emitting diode device characterized in that two sets of light emitting diodes and protection diodes connected in series in the forward direction are connected in parallel in opposite directions and housed in the same package with the connection point serving as an input terminal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4263288U JPH01145149U (en) | 1988-03-29 | 1988-03-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4263288U JPH01145149U (en) | 1988-03-29 | 1988-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01145149U true JPH01145149U (en) | 1989-10-05 |
Family
ID=31269041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4263288U Pending JPH01145149U (en) | 1988-03-29 | 1988-03-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01145149U (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5647581B2 (en) * | 1974-04-24 | 1981-11-10 | ||
JPS6151763B2 (en) * | 1980-11-26 | 1986-11-10 | Olympus Optical Co | |
JPH01173660A (en) * | 1987-12-28 | 1989-07-10 | Stanley Electric Co Ltd | Two-color radiating led |
-
1988
- 1988-03-29 JP JP4263288U patent/JPH01145149U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5647581B2 (en) * | 1974-04-24 | 1981-11-10 | ||
JPS6151763B2 (en) * | 1980-11-26 | 1986-11-10 | Olympus Optical Co | |
JPH01173660A (en) * | 1987-12-28 | 1989-07-10 | Stanley Electric Co Ltd | Two-color radiating led |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH01145149U (en) | ||
JPS62178551U (en) | ||
JPS6252957U (en) | ||
JPS6390871U (en) | ||
JPS6212966U (en) | ||
JPS6315077U (en) | ||
JPS62162859U (en) | ||
JPS62112165U (en) | ||
JPS60109344U (en) | chipped semiconductor device | |
JPS63145353U (en) | ||
JPS63155191U (en) | ||
JPS61140976U (en) | ||
JPS6212967U (en) | ||
JPS6365941U (en) | ||
JPS62182441U (en) | ||
JPS6151764U (en) | ||
JPS62145350U (en) | ||
JPS6359354U (en) | ||
JPS63198229U (en) | ||
JPH0191361U (en) | ||
JPS63145352U (en) | ||
JPS6036697U (en) | Matrix connection structure of light emitting diode | |
JPS61123552U (en) | ||
JPH01116466U (en) | ||
JPS63102264U (en) |