JPH01143165U - - Google Patents

Info

Publication number
JPH01143165U
JPH01143165U JP3939788U JP3939788U JPH01143165U JP H01143165 U JPH01143165 U JP H01143165U JP 3939788 U JP3939788 U JP 3939788U JP 3939788 U JP3939788 U JP 3939788U JP H01143165 U JPH01143165 U JP H01143165U
Authority
JP
Japan
Prior art keywords
wafer
semiconductor laser
roller
cleaving
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3939788U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3939788U priority Critical patent/JPH01143165U/ja
Publication of JPH01143165U publication Critical patent/JPH01143165U/ja
Pending legal-status Critical Current

Links

JP3939788U 1988-03-25 1988-03-25 Pending JPH01143165U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3939788U JPH01143165U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-03-25 1988-03-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3939788U JPH01143165U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-03-25 1988-03-25

Publications (1)

Publication Number Publication Date
JPH01143165U true JPH01143165U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-10-02

Family

ID=31265902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3939788U Pending JPH01143165U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-03-25 1988-03-25

Country Status (1)

Country Link
JP (1) JPH01143165U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022153830A (ja) * 2021-03-30 2022-10-13 昭和電工マテリアルズ株式会社 支持部材の製造方法、及び、半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022153830A (ja) * 2021-03-30 2022-10-13 昭和電工マテリアルズ株式会社 支持部材の製造方法、及び、半導体装置の製造方法

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