JPH01142181U - - Google Patents
Info
- Publication number
- JPH01142181U JPH01142181U JP1988038052U JP3805288U JPH01142181U JP H01142181 U JPH01142181 U JP H01142181U JP 1988038052 U JP1988038052 U JP 1988038052U JP 3805288 U JP3805288 U JP 3805288U JP H01142181 U JPH01142181 U JP H01142181U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- fitted
- dielectric material
- completed
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003989 dielectric material Substances 0.000 claims 2
- 239000000696 magnetic material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988038052U JPH01142181U (en:Method) | 1988-03-23 | 1988-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988038052U JPH01142181U (en:Method) | 1988-03-23 | 1988-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01142181U true JPH01142181U (en:Method) | 1989-09-28 |
Family
ID=31264621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988038052U Pending JPH01142181U (en:Method) | 1988-03-23 | 1988-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01142181U (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019124119A1 (ja) * | 2017-12-21 | 2019-06-27 | 東京エレクトロン株式会社 | 基板支持部材、基板処理装置及び基板搬送装置 |
-
1988
- 1988-03-23 JP JP1988038052U patent/JPH01142181U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019124119A1 (ja) * | 2017-12-21 | 2019-06-27 | 東京エレクトロン株式会社 | 基板支持部材、基板処理装置及び基板搬送装置 |
| JPWO2019124119A1 (ja) * | 2017-12-21 | 2020-12-24 | 東京エレクトロン株式会社 | 基板支持部材、基板処理装置及び基板搬送装置 |
| US12321098B2 (en) | 2017-12-21 | 2025-06-03 | Tokyo Electron Limited | Substrate support member, substrate treatment apparatus, and substrate transfer apparatus |