JPWO2019124119A1 - 基板支持部材、基板処理装置及び基板搬送装置 - Google Patents
基板支持部材、基板処理装置及び基板搬送装置 Download PDFInfo
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Abstract
Description
本願は、2017年12月21日に日本国に出願された特願2017−244724号に基づき、優先権を主張し、その内容をここに援用する。
Static Discharge)耐性の低下とあいまって、ウェハ上に形成された酸化膜の破壊、接合部の破壊、配線膜の溶断等といった問題が発生するおそれがある。
ひとつは、放電電荷量は少ないものの、急峻なピークを持つ電流が短期間(例えば数ns以下)に流れるもので、時定数が少ないためにESD保護素子(抵抗やダイオード、トランジスタ等)が応答できず、保護対象である内部回路に急峻な電位変化が発生し、例えば前述の酸化膜の破壊や、あるいは完全な破壊が発生しなくとも、潜在的な機能不良の原因となる可能性がある電流波形である。
他のひとつは、放電電荷量が多く、大電流が長時間(例えば100ns程度)流れるもので、ESD保護素子が十分に応答できる時定数であるものの、ESD保護素子へ大電流が流れることでジュール発熱が生じ、熱的破壊によって前述の接合部の破壊や配線膜の溶断を発生させる可能性がある電流波形である。
先ず、本実施形態にかかる液処理装置を備えた基板処理システムの構成について説明する。図1は、基板処理システム1の構成の概略を模式的に示す平面図である。図2及び図3は、各々基板処理システム1の内部構成の概略を模式的に示す正面図と背面図である。基板処理システム1では、基板としてのウェハWに所定の処理を行う。
次に、以上のように構成された基板処理システム1を用いて行われるウェハ処理について説明する。
次に本発明の実施形態にかかる液処理装置、例えばレジスト塗布装置32の構成について説明する。図4は、レジスト塗布装置32の構成の概略を模式的に示す縦断面図、図5はレジスト塗布装置32の構成の概略を模式的に示す水平断面図である。
ウェハ搬送装置70の搬送アーム70aによってウェハWがレジスト塗布装置32に搬入されると、搬入されたウェハWは、搬送アーム70aから予め昇降して待機していた昇降ピン211a、211b、211cに受け渡される。続いて、昇降ピン211a、211b、211cが下降し、ウェハWはスピンチャック200に保持される。
このように、インダクタ部を設けることにより、ウェハW接触点と接地点の間のインピーダンスは大きくなり、ウェハW上のデバイスを流れる電流も制限される。これに対し従来手法のようにウェハ接触点と接地点の間の直流抵抗値を大きくするほど、つまり極端にいえば絶縁性を高めるほど、ウェハW上のデバイスを流れる電流を制限できるが、他方でウェハW上の電荷は漏洩しづらくなる。したがって実施の形態のように、電荷がゆっくり漏洩しやすい程度まで、直流抵抗値をなるべく小さくすると同時に、インダクタ部で急峻(ps〜数nsオーダー)な電流が流れにくいようにインピーダンスを大きくすることで、急峻なピークを持つESD電流が短期間に流れる場合に対しても適切に対応でき、それに起因する電気特性不良の発生を防止することができる。
70 ウェハ搬送装置
70a 搬送アーム
210 基板支持部
211a、211b、211c 昇降ピン
212 リング体
214 アース接続部
220 接触支持部
221 導電材部
222 磁性体コア
240 カップ体
W ウェハ
Claims (8)
- 基板を支持する基板支持部材であって、
導電性を有する導電部と、
前記導電部の外側に設けられたインダクタ部と、を有し、
前記導電部には、前記基板と接触して前記基板を支持する接触支持部が形成され、
前記導電部における、前記インダクタ部を挟んだ前記接触支持部の反対側は、直接的または間接的に接地される基板支持部材。 - 請求項1に記載の基板支持部材において、
前記インダクタ部は、前記導電部の外周に設けられた磁性体コアである。 - 請求項1に記載の基板支持部材において、
前記インダクタ部は、絶縁部材の表面上に導電部材でスパイラルパターンを形成した、スパイラルインダクタである。 - 請求項1に記載の基板支持部材において、
前記インダクタ部は、前記導電部の外周に設けられた磁性体コアと、絶縁部材の表面上に導電部材でスパイラルパターンを形成した、スパイラルパターンを有するスパイラルインダクタと、を有する。 - 請求項1に記載の基板支持部材において、
前記基板支持部材は、基板の載置台上で基板を昇降させる昇降ピンであり、
前記導電部は前記昇降ピンの本体であり、
前記接触支持部は当該昇降ピンの頂上部である。 - 請求項1に記載の基板支持部材において、
前記基板支持部材は、基板の搬送に用いられる搬送アームであり、
前記導電部は前記搬送アームの本体であり、
前記接触支持部は前記搬送アームの上面に設けられたパッドである。 - 基板を載置台上で処理する基板処理装置であって、
前記基板の載置台上で前記基板を昇降させる複数の昇降ピンを有し、
前記昇降ピンのうちの少なくとも1本は、導電性を有する本体と、前記本体の外側に設けられたインダクタ部と、を有し、
前記本体には、前記基板と接触して前記基板を支持する頂上部が形成され、
前記本体における、前記インダクタ部を挟んだ前記頂上部の反対側は、直接的または間接的に接地される。 - 基板を搬送する際に用いられる搬送アームを有する基板搬送装置であって、
前記搬送アームは導電性を有する本体と、前記本体の外側に設けられたインダクタ部と、前記搬送アームの上面に設けられた複数の支持パッドを備え、
これら支持パッドのうち、少なくとも1つの支持パッドは、前記基板と接触して前記基板を支持するパッドであり、かつ前記本体における、前記インダクタ部を挟んだ前記パッドの反対側は、直接的または間接的に接地される。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017244724 | 2017-12-21 | ||
JP2017244724 | 2017-12-21 | ||
PCT/JP2018/045120 WO2019124119A1 (ja) | 2017-12-21 | 2018-12-07 | 基板支持部材、基板処理装置及び基板搬送装置 |
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KR20200095544A (ko) | 2020-08-10 |
JP7050090B2 (ja) | 2022-04-07 |
CN111466017A (zh) | 2020-07-28 |
KR102652636B1 (ko) | 2024-04-01 |
CN111466017B (zh) | 2023-10-20 |
TWI800573B (zh) | 2023-05-01 |
TW201929143A (zh) | 2019-07-16 |
WO2019124119A1 (ja) | 2019-06-27 |
US20210173306A1 (en) | 2021-06-10 |
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