JPH01140504U - - Google Patents
Info
- Publication number
- JPH01140504U JPH01140504U JP3723788U JP3723788U JPH01140504U JP H01140504 U JPH01140504 U JP H01140504U JP 3723788 U JP3723788 U JP 3723788U JP 3723788 U JP3723788 U JP 3723788U JP H01140504 U JPH01140504 U JP H01140504U
- Authority
- JP
- Japan
- Prior art keywords
- fixed
- spacer
- mount
- chip carrier
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
Description
第１図Ａは本考案の第１実施例側面図、第１図
Ｂはその斜視図、第２図Ａは第２実施例側面図、
第２図Ｂはその斜視図、第３図Ａは第３実施例側
面図、第３図Ｂはその斜視図、第４図は従来の光
半導体モジユールの一例を示す概略構成図、第５
図Ａは従来の光半導体センブリの側面図、第５図
Ｂはその斜視図、第６図はチツプキヤリアの斜視
図、第７図はスペーサの斜視図である。
４……ＬＤチツプ、５……第１レンズ（球レン
ズ）、１２……チツプキヤリア、１３，１３′…
…マウント、１４，１４′……レンズホルダ、１
５……スペーサ、１６，１７，１８……突起。
FIG. 1A is a side view of the first embodiment of the present invention, FIG. 1B is a perspective view thereof, and FIG. 2A is a side view of the second embodiment.
FIG. 2B is a perspective view thereof, FIG. 3A is a side view of the third embodiment, FIG. 3B is a perspective view thereof, FIG. 4 is a schematic configuration diagram showing an example of a conventional optical semiconductor module, and FIG.
Figure A is a side view of a conventional optical semiconductor assembly, Figure 5B is a perspective view thereof, Figure 6 is a perspective view of a chip carrier, and Figure 7 is a perspective view of a spacer. 4... LD chip, 5... First lens (ball lens), 12... Chip carrier, 13, 13'...
...Mount, 14,14'...Lens holder, 1
5...Spacer, 16, 17, 18...Protrusion.
Claims (1)
２とレンズ５が固定されたレンズホルダ１４とを
一体的に固定してなる光半導体アセンブリにおい
て、 前記チツプキヤリア１２をマウント１３に接合
し、 該マウント１３上にスペーサ１５をレーザ溶接
固定するとともに、 該スペーサ１５と前記レンズ５との間に突起１
６，１７，１８を設け、 前記レンズホルダ１４を前記スペーサ１５と前
記突起１６，１７，１８の両方にレーザ溶接固定
したことを特徴とする光半導体アセンブリ。[Claims for Utility Model Registration] Chip carrier 1 to which optical semiconductor element 4 is fixed
2 and a lens holder 14 to which a lens 5 is fixed are integrally fixed, the chip carrier 12 is joined to a mount 13, a spacer 15 is fixed on the mount 13 by laser welding, and the chip carrier 12 is fixed to the mount 13 by laser welding. A protrusion 1 between the spacer 15 and the lens 5
6, 17, 18, and the lens holder 14 is fixed to both the spacer 15 and the projections 16, 17, 18 by laser welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3723788U JPH01140504U (en) | 1988-03-22 | 1988-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3723788U JPH01140504U (en) | 1988-03-22 | 1988-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140504U true JPH01140504U (en) | 1989-09-26 |
Family
ID=31263817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3723788U Pending JPH01140504U (en) | 1988-03-22 | 1988-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140504U (en) |
-
1988
- 1988-03-22 JP JP3723788U patent/JPH01140504U/ja active Pending