JPS61144664U

JPS61144664U -

Info

Publication number: JPS61144664U
Application number: JP2778085U
Authority: JP
Priority date: 1985-02-26
Filing date: 1985-02-26
Publication date: 1986-09-06

Description

[Brief explanation of the drawing]

第１図は本考案の半導体レーザパツケージの組
付け構造を示す一部切り欠き斜視図、第２図は本
考案の半導体レーザパツケージの斜視図、第３図
は第１図の―線断面図、第４図は第１図に示
す例の後面図、第５図はフレキシブル基板の例の
詳細裏面図、第６図は本考案の他の実施例を示す
斜視図、第７図は従来の半導体レーザパツケージ
の一部切り欠き斜視図である。２１……半導体レーザパツケージ、２２……レ
ンズ鏡枠、２３……（レンズ鏡枠の）端部、２７
……パツケージ本体、２８……第一基準面、２９
……第二基準面、３２……チツプボンデイング面
、３３……レーザチツプ、３４……フレキシブル
基板、３４ａ……折り曲げ可能部、３６……モニ
タ受光素子。 FIG. 1 is a partially cutaway perspective view showing the assembly structure of the semiconductor laser package of the present invention, FIG. 2 is a perspective view of the semiconductor laser package of the present invention, and FIG. 3 is a sectional view taken along the line -- of FIG. 4 is a rear view of the example shown in FIG. 1, FIG. 5 is a detailed rear view of the flexible substrate example, FIG. 6 is a perspective view of another embodiment of the present invention, and FIG. 7 is a conventional semiconductor FIG. 2 is a partially cutaway perspective view of the laser package. 21... Semiconductor laser package, 22... Lens frame, 23... End (of lens frame), 27
... Package body, 28 ... First reference surface, 29
... second reference surface, 32 ... chip bonding surface, 33 ... laser chip, 34 ... flexible substrate, 34a ... bendable part, 36 ... monitor light receiving element.

Claims

[Scope of utility model registration request]

By providing a first reference plane parallel to the axis of the lens barrel and a second reference plane perpendicular to the axis of the lens barrel, and by applying these reference planes to corresponding reference planes on the lens barrel side, respectively. A block-shaped package body is provided, which is positioned in the axial direction and the axis-perpendicular direction with respect to the lens frame, and has a laser chip bonded to a chip bonding surface parallel to the axis of the lens frame, and a flexible substrate is bonded to this package body. A monitor light-receiving element is bonded to a bendable part extending from the tip of the laser chip and positioned behind the laser chip, and the bendable part is elastically applied to the end of the lens frame. A structure for assembling a semiconductor laser package, characterized in that the light-receiving surface of the monitor light-receiving element is held in an inclined state with respect to the optical axis of the laser chip.