JPH01140144U - - Google Patents
Info
- Publication number
- JPH01140144U JPH01140144U JP3704888U JP3704888U JPH01140144U JP H01140144 U JPH01140144 U JP H01140144U JP 3704888 U JP3704888 U JP 3704888U JP 3704888 U JP3704888 U JP 3704888U JP H01140144 U JPH01140144 U JP H01140144U
- Authority
- JP
- Japan
- Prior art keywords
- temperature measuring
- measuring element
- support structure
- element support
- core material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011162 core material Substances 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 238000009529 body temperature measurement Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第１図は従来の測温素子支持構造体の測温取付
状態を示す図、第２図は本考案に係る測温素子支
持構造体の組立図、第３図は本考案の測温素子支
持構造体を構成する外筒部の平面図、第４図は本
考案の測温素子支持構造体を構成する芯材の平面
図、第５図は芯材の平面展開図である。
符号の説明、１０……測温素子支持構造体、１
１……外筒部、１２……貫通孔、１３……芯材、
１４……貫通孔、１５……スパイラル溝、２０…
…ダクト、２１……従来の測温素子支持構造体。
Fig. 1 is a diagram showing the temperature measurement mounting state of a conventional temperature measurement element support structure, Fig. 2 is an assembled diagram of the temperature measurement element support structure according to the present invention, and Fig. 3 is a diagram showing the temperature measurement element support of the present invention. FIG. 4 is a plan view of the outer cylinder part constituting the structure, FIG. 4 is a plan view of the core material constituting the temperature measuring element support structure of the present invention, and FIG. 5 is a plan development view of the core material. Explanation of symbols, 10... Temperature measuring element support structure, 1
1... Outer cylinder part, 12... Through hole, 13... Core material,
14...Through hole, 15...Spiral groove, 20...
...Duct, 21... Conventional temperature measuring element support structure.
Claims (1)
持構造体であつて、前記測温素子支持構造体は測
温素子の設置位置に流体流路に平行な貫通孔を有
することを特徴とする測温素子支持構造体。 ２ 前記測温素子支持構造体は、測温素子の導線
を収容するための溝を有する芯材とその芯材を覆
う筒状の外筒部からなることを特徴とする実用新
案登録請求項１記載の測温素子支持構造体。[Claims for Utility Model Registration] 1. A temperature measuring element support structure that supports a temperature measuring element in a fluid flow path, the temperature measuring element support structure being parallel to the fluid flow path at the installation position of the temperature measuring element. A temperature measuring element support structure characterized by having a through hole. 2. Utility model registration claim 1, characterized in that the temperature measuring element support structure comprises a core material having a groove for accommodating the conductor of the temperature measuring element, and a cylindrical outer cylinder part covering the core material. The temperature measuring element support structure described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3704888U JPH01140144U (en) | 1988-03-18 | 1988-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3704888U JPH01140144U (en) | 1988-03-18 | 1988-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140144U true JPH01140144U (en) | 1989-09-26 |
Family
ID=31263632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3704888U Pending JPH01140144U (en) | 1988-03-18 | 1988-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140144U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008051789A (en) * | 2006-07-28 | 2008-03-06 | Toray Eng Co Ltd | Mounting structure for temperature sensor to flow path forming body |
-
1988
- 1988-03-18 JP JP3704888U patent/JPH01140144U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008051789A (en) * | 2006-07-28 | 2008-03-06 | Toray Eng Co Ltd | Mounting structure for temperature sensor to flow path forming body |
| JP4695570B2 (en) * | 2006-07-28 | 2011-06-08 | 東レエンジニアリング株式会社 | Mounting structure of microreactor temperature sensor to microreactor channel formation body |
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