JPH01139479U - - Google Patents
Info
- Publication number
- JPH01139479U JPH01139479U JP3445188U JP3445188U JPH01139479U JP H01139479 U JPH01139479 U JP H01139479U JP 3445188 U JP3445188 U JP 3445188U JP 3445188 U JP3445188 U JP 3445188U JP H01139479 U JPH01139479 U JP H01139479U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- mounting structure
- substrate
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 6
Landscapes
- Vibration Dampers (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の原理を説明するための図、第
２図は本考案の実施例を示す図、第３図は本考案
の実施例の作用を説明するための図、第４図は本
考案の他の実施例を示す図、第５図は従来のハイ
ブリツド集積回路の実装構造を示す図である。
図において、１は基板、３はリード端子、５は
ハイブリツド集積回路、６はプリント配線板、７
は緩衝部材、８は受け部材、を示す。
Fig. 1 is a diagram for explaining the principle of the invention, Fig. 2 is a diagram showing an embodiment of the invention, Fig. 3 is a diagram for explaining the operation of the embodiment of the invention, and Fig. 4 is a diagram for explaining the operation of the embodiment of the invention. FIG. 5, which is a diagram showing another embodiment of the present invention, is a diagram showing a mounting structure of a conventional hybrid integrated circuit. In the figure, 1 is a board, 3 is a lead terminal, 5 is a hybrid integrated circuit, 6 is a printed wiring board, and 7
8 indicates a buffer member, and 8 indicates a receiving member.
Claims (1)
けられたハイブリツド集積回路５が、その基板１
をプリント配線板６に平行となるように実装され
るハイブリツド集積回路の実装構造において、 上記基板１の下面に断面がくさび状の板又は円
錐状のピン等よりなる緩衝部材７を設けると共に
、プリント配線板６側に前記緩衝部材７を弾性的
に挾持する受け部材８を設けて成るハイブリツド
集積回路の実装構造。[Claims for Utility Model Registration] A hybrid integrated circuit 5 in which a plurality of lead terminals 3 are provided in a direction perpendicular to a substrate 1 is connected to the substrate 1.
In the mounting structure of a hybrid integrated circuit, which is mounted parallel to a printed wiring board 6, a buffer member 7 made of a plate with a wedge-shaped cross section or a conical pin, etc. is provided on the lower surface of the board 1, and A mounting structure for a hybrid integrated circuit comprising a receiving member 8 for elastically holding the buffer member 7 on the wiring board 6 side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3445188U JPH01139479U (en) | 1988-03-17 | 1988-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3445188U JPH01139479U (en) | 1988-03-17 | 1988-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139479U true JPH01139479U (en) | 1989-09-22 |
Family
ID=31261159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3445188U Pending JPH01139479U (en) | 1988-03-17 | 1988-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139479U (en) |
-
1988
- 1988-03-17 JP JP3445188U patent/JPH01139479U/ja active Pending
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