JPH01139429U - - Google Patents

Info

Publication number
JPH01139429U
JPH01139429U JP1988034631U JP3463188U JPH01139429U JP H01139429 U JPH01139429 U JP H01139429U JP 1988034631 U JP1988034631 U JP 1988034631U JP 3463188 U JP3463188 U JP 3463188U JP H01139429 U JPH01139429 U JP H01139429U
Authority
JP
Japan
Prior art keywords
component
substrate
board
main surface
surplus space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988034631U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988034631U priority Critical patent/JPH01139429U/ja
Publication of JPH01139429U publication Critical patent/JPH01139429U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案装置の一実施例の平面図、第２
図は第１図中の―部分の縦断面図、第３図は
従来装置の平面図、第４図は第３図中の―部
分の断面図である。第５図は本考案装置の用途例
を示す紙幣検出装置の部分平面図、第６図は第５
図中の―部分の縦断面図である。 １……基板、２……部品、４……城壁部（補強
材）、５……余剰空間、６……貫通孔。 Fig. 1 is a plan view of one embodiment of the device of the present invention;
The drawings are a vertical cross-sectional view of the part shown in FIG. 1, FIG. 3 is a plan view of the conventional device, and FIG. 4 is a sectional view of the part shown in FIG. FIG. 5 is a partial plan view of a banknote detection device showing an example of the application of the device of the present invention, and FIG.
It is a vertical cross-sectional view of the portion shown in the figure. 1... Board, 2... Parts, 4... Castle wall (reinforcing material), 5... Surplus space, 6... Through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板と、基板の主面から離間して配置されてい
る部品と、前記基板と前記部品との間に余剰空間
が形成されるように前記部品の周囲と前記基板と
の間に設けられている城壁部とを備えてなる部品
取付装置において、前記基板には前記余剰空間が
前記基板主面とは反対側の表面に連通する貫通孔
を備えていることを特徴とする部品取付装置。 a substrate, a component arranged at a distance from a main surface of the substrate, and a component provided between the periphery of the component and the substrate such that a surplus space is formed between the substrate and the component. 1. A component mounting device comprising a castle wall portion, wherein the board is provided with a through hole through which the surplus space communicates with a surface opposite to the main surface of the board.
JP1988034631U 1988-03-16 1988-03-16 Pending JPH01139429U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988034631U JPH01139429U (en) 1988-03-16 1988-03-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988034631U JPH01139429U (en) 1988-03-16 1988-03-16

Publications (1)

Publication Number Publication Date
JPH01139429U true JPH01139429U (en) 1989-09-22

Family

ID=31261331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988034631U Pending JPH01139429U (en) 1988-03-16 1988-03-16

Country Status (1)

Country Link
JP (1) JPH01139429U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023112366A1 (en) * 2021-12-17 2023-06-22 パナソニックＩｐマネジメント株式会社 Mounting board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5973740A (en) * 1982-10-19 1984-04-26 Nippon Denso Co Ltd Device for transducing chemical and physical quantity into electric quantity

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5973740A (en) * 1982-10-19 1984-04-26 Nippon Denso Co Ltd Device for transducing chemical and physical quantity into electric quantity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023112366A1 (en) * 2021-12-17 2023-06-22 パナソニックＩｐマネジメント株式会社 Mounting board

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