JPH01138698U - - Google Patents
Info
- Publication number
- JPH01138698U JPH01138698U JP3263888U JP3263888U JPH01138698U JP H01138698 U JPH01138698 U JP H01138698U JP 3263888 U JP3263888 U JP 3263888U JP 3263888 U JP3263888 U JP 3263888U JP H01138698 U JPH01138698 U JP H01138698U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing section
- hole processing
- hole
- small hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3263888U JPH01138698U (enExample) | 1988-03-14 | 1988-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3263888U JPH01138698U (enExample) | 1988-03-14 | 1988-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01138698U true JPH01138698U (enExample) | 1989-09-21 |
Family
ID=31259187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3263888U Pending JPH01138698U (enExample) | 1988-03-14 | 1988-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01138698U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108818724A (zh) * | 2018-06-05 | 2018-11-16 | 江西旭昇电子有限公司 | 单元板内无定位孔的线路板成型方法 |
-
1988
- 1988-03-14 JP JP3263888U patent/JPH01138698U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108818724A (zh) * | 2018-06-05 | 2018-11-16 | 江西旭昇电子有限公司 | 单元板内无定位孔的线路板成型方法 |
| CN108818724B (zh) * | 2018-06-05 | 2020-06-05 | 江西旭昇电子有限公司 | 单元板内无定位孔的线路板成型方法 |