JPH01135884A - Copper foil adhesive for copper-clad laminated boar - Google Patents
Copper foil adhesive for copper-clad laminated boarInfo
- Publication number
- JPH01135884A JPH01135884A JP29263687A JP29263687A JPH01135884A JP H01135884 A JPH01135884 A JP H01135884A JP 29263687 A JP29263687 A JP 29263687A JP 29263687 A JP29263687 A JP 29263687A JP H01135884 A JPH01135884 A JP H01135884A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- resin
- epoxy resin
- adhesive
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 8
- 239000011889 copper foil Substances 0.000 title claims description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 18
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 9
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 9
- 229920003986 novolac Polymers 0.000 claims abstract description 5
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229930003836 cresol Natural products 0.000 claims abstract description 3
- 239000011342 resin composition Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical compound NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 abstract description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- 239000004640 Melamine resin Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は９ｗ４張積層板積層板の製造において、銅箔用
として用いる接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an adhesive used for copper foil in the production of 9W4 laminate laminates.
祇フェノール銅張積層板の製造において、従来銅箔用接
着剤は、ポリビニルブチラールとレゾール樹脂の混合物
を主成分としてきた。エポキシ樹脂を用いた例は、特公
昭６０−５４８６０号公報に示されているようにエポキ
シ１１！１脂、ポリビニルブチラール、メラミン樹脂の
混合物がある。また、フェノキシ樹脂を用いた例は、゛
特開昭５６−１０４９２５号公報に記載さｎているよう
にエポキシ樹脂、アミン系硬化剤、フェノキシ樹脂の混
合物の例がある。特開昭６１−４５５５０に述べらｎて
いるように、エポキシ樹脂にフェノール樹脂、ポリビニ
ルブチラール、フェノキシ樹脂を混合する例がある。In the production of Miophenol copper-clad laminates, conventional copper foil adhesives have mainly consisted of a mixture of polyvinyl butyral and resol resin. An example of using an epoxy resin is a mixture of epoxy 11!1 resin, polyvinyl butyral, and melamine resin, as shown in Japanese Patent Publication No. 60-54860. Further, as an example of using a phenoxy resin, there is an example of a mixture of an epoxy resin, an amine curing agent, and a phenoxy resin, as described in JP-A-56-104925. As described in JP-A No. 61-45550, there are examples of mixing epoxy resin with phenol resin, polyvinyl butyral, and phenoxy resin.
（発明が解決しようとする問題点）
特公昭６０−５４８６０号公報及び％開昭６１−４３５
５０号公報に示されている方法は、何れもポリビニルブ
チラールを用いているため、混合物の低粘度化及び溶剤
を低減して固形分を多くするには限度があり、接着剤ｔ
−＠箔に塗布する工程あるいは乾燥工程において、多量
の溶剤揮発による接着剤層の発泡、塗布量の安定性、塗
布速度及び作業時の安全性を確保し難い。また、特開昭
５６−１０４９２５号公報に示さｎている接着剤は、プ
リプレグに含浸している樹脂がフェノール樹脂の場合、
はんだ耐熱性、剥離強度特に高温におけろ剥離強度の何
ｎも低く良好な特性が得らｎない。(Problems to be solved by the invention) Japanese Patent Publication No. 60-54860 and %Kokai No. 61-435
Since the methods shown in Publication No. 50 all use polyvinyl butyral, there is a limit to how much the solid content can be increased by lowering the viscosity of the mixture and reducing the amount of solvent.
-@During the process of coating on foil or the drying process, foaming of the adhesive layer occurs due to volatilization of a large amount of solvent, and it is difficult to ensure stability of coating amount, coating speed, and safety during work. In addition, the adhesive shown in JP-A No. 56-104925, when the resin impregnated into the prepreg is a phenolic resin,
Solder heat resistance and peel strength, especially at high temperatures, are so low that good properties cannot be obtained.
（問題点を解決するための手段） 以上の問題点にがんが一２Ａ検討の結果仝発明を得た。(Means for solving problems) As a result of research into the above-mentioned problems, the invention was obtained.
本発明は、基材にフェノール樹脂全含授した主成分がエ
ポキシ樹脂と２エノキシ樹８百とから成る銅張積層板用
銅箔接着剤である。The present invention is a copper foil adhesive for copper-clad laminates, the main components of which are epoxy resin and 2-enoxy resin, with the base material fully impregnated with phenolic resin.
本発明で用いるエポキシ樹脂はクレゾールノボラック型
エボキン樹脂（そｎを水飽したものであってもよい）が
好１しく、ビスフェノールＡ型エポキシ州月行、フェノ
ールノボラック型エポキシ樹脂でははんだ耐熱性が若干
低下する場合がある。フェノキシ位（脂は通常市販さｎ
てい、Ｂものでよ＜、分子ｉ４１０．０００〜８ Ｑ、
０００程度のものが好ましい。混合比率はエポキシ樹
脂５０〜９０重量部に対してフェノキシ樹脂１０へ５０
ｆｆＭｆＭ部とするのがはんだ耐熱性、は（離強度の両
％件のバランスがとｎ、好ましい。The epoxy resin used in the present invention is preferably cresol novolac type evoquine resin (it may be saturated with water), and bisphenol A type epoxy resin and phenol novolac type epoxy resin have slightly less soldering heat resistance. It may decrease. Phenoxy position (fat is usually commercially available)
Yes, B is <, molecule i410.000~8 Q,
A value of about 000 is preferable. The mixing ratio is 10 to 50 parts of phenoxy resin to 50 to 90 parts by weight of epoxy resin.
It is preferable to use the ffMfM part as it has good solder heat resistance (a good balance between both the separation strength and n).
硬化剤はジシアンジアミドを用いるのがはく離強度を向
上させ好筐しいが、その他の硬化剤でも差支えない。硬
化剤はエポキシ樹脂に対して１〜１０重ｔ％の割付で用
いろ。また硬化促進剤を用いる場合はイミダゾール又は
その篩尋体が好ましく、エポキシ樹脂に対して１〜５重
債％の割付で用いる。It is preferable to use dicyandiamide as the curing agent since it improves the peel strength, but other curing agents may also be used. Use the curing agent in an amount of 1 to 10% by weight based on the epoxy resin. When a curing accelerator is used, imidazole or its sieve is preferably used, and is used in an amount of 1 to 5% relative to the epoxy resin.
前記生成分の外にメラミン樹脂を加えてもよく、その場
合メチロールメラミンのメチロール基全メタノールやブ
タノールでエーテル化したものが良く、その配付鷺は他
の樹脂の固形分に対して１〜３０％が好筐しい。Melamine resin may be added in addition to the above-mentioned product. In that case, it is preferable to etherify all the methylol groups of methylolmelamine with methanol or butanol, and the distribution amount is 1 to 30% of the solid content of other resins. I like it.
溶剤は、エポキシ樹脂及びフェノキシ樹脂をメチルエチ
ルケトンて溶解し、硬化剤及び硬化促進剤をメチルセロ
ソルブでＦｌｕｆｆる。As the solvent, epoxy resin and phenoxy resin are dissolved with methyl ethyl ketone, and the curing agent and curing accelerator are flushed with methyl cellosolve.
これら全固形分が約７０％となるように混曾攪拌して得
た接着剤を銅箔に塗布し、約１３０℃で１０分間乾燥し
て接着剤付き鋼箔とする。The adhesive obtained by mixing and stirring so that the total solid content is about 70% is applied to copper foil, and dried at about 130° C. for 10 minutes to obtain an adhesive-coated steel foil.
（作用）
本発明の接着剤は、その粘度が従来の９０００ ｃｐｓ
と異なり１０００〜３０００ｃｐｓであるために、接着
剤を＠箔に塗布する工程における塗布速度向上に寄与す
ることとなった。(Function) The adhesive of the present invention has a viscosity of 9000 cps compared to the conventional adhesive.
Unlike that, it was 1000 to 3000 cps, which contributed to improving the coating speed in the process of applying the adhesive to the foil.
また、接着剤固形分を従来の２５％から約７０％まで増
し、溶剤の揮発による接着剤層の発泡、接着剤塗布量の
安定性、作条時の安全性等の問題を解消することができ
た。In addition, the solid content of the adhesive has been increased from the conventional 25% to approximately 70%, eliminating problems such as foaming of the adhesive layer due to solvent volatilization, stability of adhesive application amount, and safety during construction. did it.
実施例１
ジシアンジアミド１０部（重量部、以下同じ）イミダゾ
ール５部をメチルセロソルブで溶解した後、メチルエチ
ルケトンで調製しながらエポキシ樹脂ＹＤＣＮ−７０３
（東部化成製タレゾールノボラック型）７０部、フェノ
キシ樹脂Ｙｐ−ｓａｃ（東部化成製、分子量的３０００
０）３０部を溶解した。Example 1 After dissolving 10 parts of dicyandiamide (parts by weight, same hereinafter) and 5 parts of imidazole in methyl cellosolve, epoxy resin YDCN-703 was prepared while preparing with methyl ethyl ketone.
(Talesol novolac type manufactured by Tobu Kasei Co., Ltd.) 70 parts, phenoxy resin Yp-sac (manufactured by Tobu Kasei Co., Ltd., molecular weight 3000
0) 30 parts were dissolved.
得た接着剤全銅箔に塗布乾燥して接着剤付き鋼箔を得た
。こｒＬｔ−プリプレグと重ね甘わせ加熱加圧成形して
銅張積層板とした。The obtained adhesive was applied to the entire copper foil and dried to obtain an adhesive-coated steel foil. This was layered with rLt-prepreg and heated and pressed to form a copper-clad laminate.
得た積層板の試験値を表１に示す。Table 1 shows the test values of the obtained laminate.
実施例２
ジシアンジアミド１０部、イミダゾール５部をメチルセ
ロソルブに溶解した後、ブチル化メラミン樹脂（１竺化
成ポリマー＆ｌ）５部ｔ−ｍえた他は、実施例１と同様
にした。Example 2 The same procedure as in Example 1 was carried out, except that 10 parts of dicyandiamide and 5 parts of imidazole were dissolved in methyl cellosolve, and then 5 parts of butylated melamine resin (1st grade chemical polymer &l) was added.
得た積層板の試験値全表１に示す。All test values of the obtained laminate are shown in Table 1.
比較例
ポリビニルブチラール樹脂６０部をメチルエチルケトン
、トルエン、メタノールの混ｆｍ剤に溶解した後、レゾ
ール型フェノール樹脂を４０部加えて得た接着剤を実施
例１と同様にして銅張積層板を得た。Comparative Example After dissolving 60 parts of polyvinyl butyral resin in a mixed FM agent of methyl ethyl ketone, toluene, and methanol, 40 parts of resol type phenol resin was added to obtain an adhesive.A copper-clad laminate was obtained in the same manner as in Example 1. .
得た積層板の試験値を表１に示す。Table 1 shows the test values of the obtained laminate.
表１ ※１ Ｂ型粘度計による。Table 1 *1 Based on a B-type viscometer.
※２ ＪＩＳ Ｃ６４８１による（２６０℃泪心半
円心半田槽 ＪＩＳ Ｃ（５４８１による。*2 According to JIS C6481 (260℃ semi-circular soldering bath) According to JIS C (5481).
※４ ＪＩＳ Ｃ５４８１による。（常態絶縁抵抗
）（発明の効果）
本発明による接着剤を用いた銅張積層板の特性は、表１
に示すように、はんだ耐熱性、剥離、強度、絶縁抵抗の
何几も向上することｔ−確認した。*4 According to JIS C5481. (Normal insulation resistance) (Effects of the invention) The characteristics of the copper-clad laminate using the adhesive according to the invention are shown in Table 1.
As shown in Figure 2, it was confirmed that the soldering heat resistance, peeling, strength, and insulation resistance were significantly improved.
また、本発明によって、接着剤の低粘度化による塗布工
程時間の短縮が可能となった。かつ、溶剤全低減して固
形分を増すことによって、塗布工程及び乾燥工程におけ
る仕上がりの安定性あるいは作業の安全性を確保できる
こととなった。Furthermore, the present invention has made it possible to shorten the coating process time by lowering the viscosity of the adhesive. In addition, by reducing the total amount of solvent and increasing the solid content, it is possible to ensure the stability of the finish and the safety of work in the coating process and drying process.
代理人弁理士 廣 瀬 章 、、、７＞、。Representative Patent Attorney Akira Hirose...7>.
−み゛ −、ノー-Mi゛ -, no
Claims (2)
物を主成分とすることを特徴とする銅張積層板用銅箔接
着剤。(1) A copper foil adhesive for copper-clad laminates, characterized in that the main component is a resin composition containing an epoxy resin and a phenoxy resin.
樹脂であることを特徴とする特許請求の範囲第１項記載
の銅張積層板用銅箔接着剤。(2) The copper foil adhesive for copper-clad laminates according to claim 1, wherein the epoxy resin is a cresol novolac type epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62292636A JPH0759693B2 (en) | 1987-11-19 | 1987-11-19 | Copper foil adhesive for copper clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62292636A JPH0759693B2 (en) | 1987-11-19 | 1987-11-19 | Copper foil adhesive for copper clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01135884A true JPH01135884A (en) | 1989-05-29 |
| JPH0759693B2 JPH0759693B2 (en) | 1995-06-28 |
Family
ID=17784354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62292636A Expired - Lifetime JPH0759693B2 (en) | 1987-11-19 | 1987-11-19 | Copper foil adhesive for copper clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0759693B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH021789A (en) * | 1988-02-24 | 1990-01-08 | Matsushita Electric Works Ltd | Epoxy resin adhesive and electrical circuit board |
| CN1296450C (en) * | 2000-10-06 | 2007-01-24 | 索尼化学株式会社 | Binder and electric apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4839832A (en) * | 1971-09-22 | 1973-06-12 |
-
1987
- 1987-11-19 JP JP62292636A patent/JPH0759693B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4839832A (en) * | 1971-09-22 | 1973-06-12 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH021789A (en) * | 1988-02-24 | 1990-01-08 | Matsushita Electric Works Ltd | Epoxy resin adhesive and electrical circuit board |
| JPH0529667B2 (en) * | 1988-02-24 | 1993-05-06 | Matsushita Denko Kk | |
| CN1296450C (en) * | 2000-10-06 | 2007-01-24 | 索尼化学株式会社 | Binder and electric apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0759693B2 (en) | 1995-06-28 |
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