JPH01135774U - - Google Patents
Info
- Publication number
- JPH01135774U JPH01135774U JP3241588U JP3241588U JPH01135774U JP H01135774 U JPH01135774 U JP H01135774U JP 3241588 U JP3241588 U JP 3241588U JP 3241588 U JP3241588 U JP 3241588U JP H01135774 U JPH01135774 U JP H01135774U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- electronic components
- printed wiring
- insulating layers
- layers formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3241588U JPH01135774U (it) | 1988-03-10 | 1988-03-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3241588U JPH01135774U (it) | 1988-03-10 | 1988-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01135774U true JPH01135774U (it) | 1989-09-18 |
Family
ID=31258892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3241588U Pending JPH01135774U (it) | 1988-03-10 | 1988-03-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135774U (it) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5444764A (en) * | 1977-09-16 | 1979-04-09 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
| JPS5444765A (en) * | 1977-09-16 | 1979-04-09 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
| JPS5792895A (en) * | 1980-12-02 | 1982-06-09 | Nippon Telegraph & Telephone | Method of laminating printed board |
| JPS5895894A (ja) * | 1981-12-02 | 1983-06-07 | シャープ株式会社 | 多層回路配線基板の製造方法 |
| JPS6236900A (ja) * | 1984-08-06 | 1987-02-17 | イビデン株式会社 | 複合プリント配線板の製造方法 |
-
1988
- 1988-03-10 JP JP3241588U patent/JPH01135774U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5444764A (en) * | 1977-09-16 | 1979-04-09 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
| JPS5444765A (en) * | 1977-09-16 | 1979-04-09 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
| JPS5792895A (en) * | 1980-12-02 | 1982-06-09 | Nippon Telegraph & Telephone | Method of laminating printed board |
| JPS5895894A (ja) * | 1981-12-02 | 1983-06-07 | シャープ株式会社 | 多層回路配線基板の製造方法 |
| JPS6236900A (ja) * | 1984-08-06 | 1987-02-17 | イビデン株式会社 | 複合プリント配線板の製造方法 |