JPH01135604A - Cooling device of mold - Google Patents

Cooling device of mold

Info

Publication number
JPH01135604A
JPH01135604A JP29324087A JP29324087A JPH01135604A JP H01135604 A JPH01135604 A JP H01135604A JP 29324087 A JP29324087 A JP 29324087A JP 29324087 A JP29324087 A JP 29324087A JP H01135604 A JPH01135604 A JP H01135604A
Authority
JP
Japan
Prior art keywords
temperature
heat exchanger
cooling liquid
cooling
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29324087A
Other languages
Japanese (ja)
Other versions
JP2522975B2 (en
Inventor
Masayuki Morishima
森島 正行
Toshiaki Kawada
俊明 川田
Naoki Zanmatsu
残松 直樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP29324087A priority Critical patent/JP2522975B2/en
Publication of JPH01135604A publication Critical patent/JPH01135604A/en
Application granted granted Critical
Publication of JP2522975B2 publication Critical patent/JP2522975B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/007Tempering units for temperature control of moulds or cores, e.g. comprising heat exchangers, controlled valves, temperature-controlled circuits for fluids

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Control Of Temperature (AREA)

Abstract

PURPOSE:To make temperature control ranging from low temperature to high temperature possible by automatically changing over from a refrigerating device to a cooling device other than the refrigerating device and vice versa by a method wherein a heat exchanger is jointly provided between a change-over mechanism and branched return flow paths and the refrigerating device is stopped and, at the same time, the change-over mechanism is changed over to the state that cooling liquid is sent back through the heat exchanger, when the temperature of the cooling liquid is higher than the set temperature. CONSTITUTION:A change-over mechanism 18 is provided in a flow path, which runs from a mold 8 to branched return flow paths 14a and 14b. When cooling liquid flows in the direction indicated with the arrow B, it divides from the change-over mechanism 18 and flows to a heat exchanger 19. When the temperature of the cooling liquid is higher than the set temperature, an automatic control device TH puts the contacts of a CM off and those of a V on, resulting in stopping a refrigerating device and, at the same time, in changing-over the change-over mechanism 18 to the state that the cooling liquid is sent back through the heat exchanger 19. By properly setting the set temperature of the automatic control device, the change-over is automatically done to the use of the heat exchanger or to another cooling means, when the temperature of the return cooling liquid is so high as to put a protector in actuation.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、常温よりも高い所定温度に維持する必要のあ
るプラスチック成形用金型の冷ムn菰aりに関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a cold mold for a plastic mold that needs to be maintained at a predetermined temperature higher than room temperature.

〈従来の技術〉 冷媒圧縮機等と共に冷凍サイクルを憤成する蒸発器を、
水またはブラインといった冷却液を貯留するタンク内に
配設して、タンク内の冷却液を冷やすようにした液体冷
却装置については例えば実公昭60−15107号公報
に開示されており、従来公知である。この冷媒圧縮機が
運転可能な冷却液温度は通常40’C以下でおり、これ
よりも高くなると、冷媒圧縮機の吸入ガスの過熱t、f
が過大となって、高圧ガスの温度上昇やモータ巻線温度
の異常上昇を招く慣れが生ずる。
<Conventional technology> An evaporator, which together with a refrigerant compressor and others forms a refrigeration cycle,
A liquid cooling device disposed in a tank for storing a cooling liquid such as water or brine to cool the cooling liquid in the tank is disclosed in, for example, Japanese Utility Model Publication No. 15107/1983, and is conventionally known. . The coolant temperature at which this refrigerant compressor can operate is normally 40'C or below, and if it becomes higher than this, the suction gas of the refrigerant compressor will be overheated t, f.
becomes excessive, leading to a rise in the temperature of the high-pressure gas and an abnormal rise in the temperature of the motor windings.

〈発明が解決しようとする問題点〉 上記した冷凍サイクルを用いた液体冷却装置をプラスチ
ック成形用金型の冷却装置として利用するとき問題とな
る点は、冷媒圧縮機の運転可能としている温度より高目
の冷却液温度に設定されることがあるということである
。本出願人は、先に、このような場合でも何等支障なく
運転可能とする第3図に示す金型冷却装置について案出
し、特許出願を行なった。
<Problems to be Solved by the Invention> A problem that arises when a liquid cooling device using the above-mentioned refrigeration cycle is used as a cooling device for a plastic mold is that the temperature is higher than that at which the refrigerant compressor can operate. This means that it may be set to the eye coolant temperature. The present applicant has previously devised a mold cooling device shown in FIG. 3, which can be operated without any problems even in such cases, and has filed a patent application.

第3図に示す金型冷却装置について簡単に説明すると、
Aは冷媒圧縮機1、凝縮器2、ドライヤー3、蒸発器4
、アキュムレータ5等を連結して構成した冷凍サイクル
の冷媒回路、6はファン、Bはタンク7内に貯留した冷
却液を循環ポンプ8、金型9を経て再びタンク7に戻す
冷却液循環回路である。このタンク7の内部は通液孔1
1を明けた仕切板10によってタンク上室7aとタンク
下室7bとに部分され、タンク下室7aには蒸発器4を
配設し、タンク下室7bには冷却液温度調節用のヒータ
12を配設している。冷却液回路Bは、タンク下室7b
と循環ポンプ8の吸込口とを送り出し配管13によって
接続し、特に金型9からの戻り配管14については、タ
ンク上室7aに繋がる細い戻り配管14aと、タンク下
室7bに繋がる比較的太い戻り配管14bとの分岐戻り
流路となし、且つ後者の戻り配管14bの内側には流量
調整用の抵抗体15と戻り温度検出用の温度セン1ノ′
16を設け、温度センリ16の温度信号は制御回路17
に送られて、冷媒圧縮!a1の運転並びにヒータ12の
オン・オフ時開をリニA7に制御するようにしている。
A brief explanation of the mold cooling device shown in Fig. 3 is as follows.
A is refrigerant compressor 1, condenser 2, dryer 3, evaporator 4
, a refrigerant circuit of a refrigeration cycle configured by connecting an accumulator 5, etc., 6 is a fan, and B is a coolant circulation circuit that returns the coolant stored in the tank 7 to the tank 7 via the circulation pump 8 and the mold 9. be. Inside this tank 7 is a liquid passage hole 1.
The tank is divided into an upper tank chamber 7a and a lower tank chamber 7b by a partition plate 10, and the lower tank chamber 7a is equipped with an evaporator 4, and the lower tank chamber 7b is equipped with a heater 12 for adjusting the coolant temperature. has been set up. The coolant circuit B is located in the tank lower chamber 7b.
and the suction port of the circulation pump 8 are connected by a delivery piping 13. In particular, the return piping 14 from the mold 9 has a thin return piping 14a connected to the tank upper chamber 7a, and a relatively thick return piping 14a connected to the tank lower chamber 7b. It forms a branch return flow path with the pipe 14b, and inside the latter return pipe 14b there is a resistor 15 for adjusting the flow rate and a temperature sensor 1 for detecting the return temperature.
16 is provided, and the temperature signal of the temperature sensor 16 is sent to the control circuit 17.
The refrigerant is compressed! The operation of a1 and the on/off opening of the heater 12 are controlled linearly by A7.

このように、二つの戻り配管14a、 14bの管径の
相異と抵抗体15の動きにより、蒸発器4のあるタンク
上室7aに戻る液量を抑制して、譬え冷却液温度が例え
ば50’Cと高くても、タンク上室7a内の冷却液平均
温度を冷媒圧縮機が運転可能な温度まで下げるようにし
たものであった。
In this way, due to the difference in the pipe diameters of the two return pipes 14a and 14b and the movement of the resistor 15, the amount of liquid returned to the tank upper chamber 7a where the evaporator 4 is located is suppressed, and the coolant temperature is reduced to 50°C, for example. The average temperature of the coolant in the tank upper chamber 7a is lowered to a temperature at which the refrigerant compressor can operate, even if the temperature is as high as 'C.

しかし、第3図の装置においても、冷却液温度を更に上
げて行くと、運転可能限界を超えることは必定である。
However, even in the apparatus shown in FIG. 3, if the coolant temperature is further increased, it is inevitable that the operating limit will be exceeded.

このように冷凍サイクルによる冷却方式では冷却液温度
が高くなると冷媒圧縮機1に負担がかかり、プロテクタ
により停止するが、最悪の場合は故障してしまう。一方
、冷凍サイクルとは冷却方式を異にする空冷式や水冷式
の熱交換装置、就中、空冷式の熱交換装置では、冷却液
と至温との温度差が小さいと冷却能力が低下し、金型の
温度を一定温度に保持できない。動た、冷凍装置とそれ
以外の熱交換装置を併設し、手動で切換えを行なうよう
にすると、任意に切換えが可能な反面、冷媒圧縮機が停
止してしまうような冷却液温度条件下では、使用者とし
ては冷却しているつもりが実は運転中止していて、金型
温度が上昇し、成形品の不良を来たすおそれがあった。
As described above, in the cooling system using the refrigeration cycle, when the coolant temperature becomes high, a load is placed on the refrigerant compressor 1, and the protector stops the compressor 1, but in the worst case, it may break down. On the other hand, in air-cooled and water-cooled heat exchange devices that use a different cooling method than the refrigeration cycle, especially in air-cooled heat exchange devices, the cooling capacity decreases if the temperature difference between the coolant and the maximum temperature is small. , the temperature of the mold cannot be maintained at a constant temperature. If a refrigeration system and other heat exchange equipment are installed together, and the switching is done manually, it is possible to switch at will, but under coolant temperature conditions that would cause the refrigerant compressor to stop, Although the user thought that the machine was being cooled, the operation was actually stopped, causing the temperature of the mold to rise and potentially causing defects in the molded product.

本発明は上記した実情に鑑み、冷凍装置と冷凍装置以外
の冷却装置を自動的に切換えて、低温から高温までの温
度制御を行なえるようにして、使用時のミスをなくすこ
とができる金型冷fJl装置を提供することを、その目
的としている。
In view of the above-mentioned circumstances, the present invention has been developed to automatically switch between a refrigeration device and a cooling device other than the refrigeration device to control the temperature from low to high temperatures, thereby eliminating mistakes during use. Its purpose is to provide a cold fJl device.

〈問題点を解決Jるための手段〉 本発明は、金型から分岐戻り流路に至る流路中に切換装
置を設け、その切換装置と分岐戻り流路との間に熱交換
器を有する熱交換器用流路を併設し、冷却液温度が設定
温度より低いか高いかで冷凍装置のオン・オフ動作並び
に前記熱交換器を経ずに戻ずか熱交換器を経て戻すかの
前記切換装置の切換動作とを行なう自動制御装置を設け
、こうして冷却液温が低温から高温まで安心して使える
ようにした。
<Means for solving the problems> The present invention provides a switching device in the flow path leading from the mold to the branch return flow path, and a heat exchanger is provided between the switching device and the branch return flow path. A flow path for a heat exchanger is also provided, and the refrigeration system is turned on and off depending on whether the coolant temperature is lower or higher than the set temperature, and the switching is made between returning the cooling liquid without going through the heat exchanger or returning it through the heat exchanger. An automatic control device has been installed to switch the device, allowing the system to be used safely from low to high coolant temperatures.

〈実施例〉 本発明になる実施例を第1図に示す。<Example> An embodiment of the present invention is shown in FIG.

第1図において、第3図に示した部分や部材と同じもの
には第3図で使った符号と同じ符号を付すことで対比に
便ならしめている。第1図を第3図と対比することによ
って、つぎの点が理解されよう。すなわち、冷却液を貯
留するタンク7が通液孔11を明けた仕切板10によっ
て上下に部分され、タンク上室7aには冷凍装置の蒸発
器4を、タンク下室7bにはヒータ12を設【プる点、
冷却液循環回路Bはタンク下室7bのみ循環ポンプ8の
吸込口に冷却液送り出し配管13で接続するが、金型9
からの戻り配管14は、タンク上室7aに繋がる細い戻
り配管14aと、タンク下室7bに繋がる比較的太い戻
り配管14bとの分岐戻り流路として、その比較的太い
戻り配管14bの内側には流量調整用の抵抗体15を設
けて、蒸発器4のあるタンク下室7aに戻る冷却液の流
量を抑制している点、更に冷却液の温度センサ16と、
その温度センサ16の検出信号で作動する制御回路17
があって、冷媒圧縮機1の運転並びにヒータ12のオン
・オフを制御している点で、両者は特別変ったところは
ない。
In FIG. 1, parts and members that are the same as those shown in FIG. 3 are given the same reference numerals as those used in FIG. 3 for convenience of comparison. By comparing FIG. 1 with FIG. 3, the following points will be understood. That is, a tank 7 for storing a coolant is divided into upper and lower parts by a partition plate 10 having a liquid passage hole 11, an evaporator 4 of a refrigeration system is installed in an upper tank chamber 7a, and a heater 12 is installed in a lower tank chamber 7b. [pull point,
In the coolant circulation circuit B, only the tank lower chamber 7b is connected to the suction port of the circulation pump 8 by a coolant delivery pipe 13, but the mold 9
The return pipe 14 from the tank serves as a branch return flow path with a thin return pipe 14a connected to the tank upper chamber 7a and a relatively thick return pipe 14b connected to the tank lower chamber 7b. A resistor 15 for flow rate adjustment is provided to suppress the flow rate of the coolant returning to the tank lower chamber 7a where the evaporator 4 is located, and a coolant temperature sensor 16 is also provided.
A control circuit 17 that operates based on the detection signal of the temperature sensor 16
There is no particular difference between the two in that they control the operation of the refrigerant compressor 1 and the on/off of the heater 12.

しかし、第1図の場合は、金型9から分岐戻り流路14
a、14bに至る流路中に、矢印イと矢印口で示した二
つの方向へ戻り冷却液の流路を切換えることができる、
例えば三方電磁弁といった切換袋@18を設けていて、
矢印イの方向に流れる場合は前)ホしたところと同様に
タンク上室78とタンク下室7bとに戻されることにな
る。しかし、矢印口の方向に流れる場合は、その切換装
置18から分れ且つ分岐戻り流路1/Ia。
However, in the case of FIG.
In the flow path leading to a and 14b, the flow path of the cooling liquid can be switched back to the two directions indicated by the arrow A and the arrow opening.
For example, a switching bag @18 such as a three-way solenoid valve is provided,
If it flows in the direction of arrow A, it will be returned to the upper tank chamber 78 and lower tank chamber 7b in the same way as in the previous step (E). However, when the flow is in the direction of the arrowhead, the flow branches off from the switching device 18 and returns to the branch return flow path 1/Ia.

14bを共通とする熱交換器19の流路20に流れたの
ら、最後はタンク上Z7aとタンク下室7bとに戻され
るようになっている。この熱交換器19は空冷式でも水
冷式でもよいが、空冷式の場合は凝縮器2と並べて配設
すると、ファン6の共通化を図ることができる。図示し
たように、パイプ内に抵抗体22を設けたバイパス菅2
1を取付けることによって熱交換器1つ内を通過する冷
却液流量つまり熱交換熱量の調整が可能である。
After flowing into the flow path 20 of the heat exchanger 19, which has a common passage 14b, it is finally returned to the upper tank Z7a and the lower tank chamber 7b. This heat exchanger 19 may be of an air-cooled type or a water-cooled type, but if it is an air-cooled type, if it is arranged side by side with the condenser 2, the fan 6 can be used in common. As shown in the figure, a bypass tube 2 in which a resistor 22 is provided inside the pipe.
1, it is possible to adjust the flow rate of the coolant passing through one heat exchanger, that is, the amount of heat exchanged.

また、第1図の場合は、例えばり−モスタラ1〜といっ
た自動制御装置THを設けている。第2図には自動制御
装置THを含む回路例を示している。第2図において、
スイッチSWをオンとすると、ファン6のモータFMと
循環ポンプ8のモータPMの電気回路は閉回路となるが
、冷媒圧縮機1のモータCMと切換装置18の電磁弁■
については、通常冷媒圧縮機1に負担がかかる約50’
Cの自動制御装置THの設定温度に対して、冷却液温度
の方が低いと、CMの接点をオンとし、■の接点をオフ
とするように自動制御装置THは動作し、これによって
冷凍装置を駆動するとともに冷却液を熱交換器1つを経
ずに戻す状態に切換装置1Bを切換える。反対に、冷却
液温度の方が高いと、CMの接点をオフ、■の接点をオ
ンとし、これによって冷凍装置を停止するとともに冷却
液を熱交換器19を経て戻す状態に切換装置18を切換
える。
In the case of FIG. 1, an automatic control device TH such as Mostara 1 is provided. FIG. 2 shows an example of a circuit including the automatic control device TH. In Figure 2,
When the switch SW is turned on, the electric circuit of the motor FM of the fan 6 and the motor PM of the circulation pump 8 becomes a closed circuit, but the electric circuit of the motor CM of the refrigerant compressor 1 and the solenoid valve of the switching device 18 becomes a closed circuit.
About 50', which normally places a burden on the refrigerant compressor 1
If the coolant temperature is lower than the set temperature of the automatic control device TH in C, the automatic control device TH operates to turn on the CM contact and turn off the contact on the refrigeration system. At the same time, the switching device 1B is switched to a state where the cooling liquid is returned without passing through one heat exchanger. On the other hand, if the coolant temperature is higher, the CM contact is turned off and the contact (■) is turned on, thereby stopping the refrigeration system and switching the switching device 18 to return the coolant through the heat exchanger 19. .

〈発明の効果〉 以上の説明から明らかなように、この発明によれば、自
動制御装置の設定温度を適切に設定しておきざえすれば
、冷媒圧縮機に負担がかかってプロテクタが動くような
高い戻り冷却液温度の場合には、自動的にもう一つの冷
却手段である熱交換器使用に切換ねるから、使用者が稼
動しているものと思っていた冷媒圧縮機が停止していた
ということによるトラブルは一切なくすことができる。
<Effects of the Invention> As is clear from the above explanation, according to the present invention, if the set temperature of the automatic control device is properly set, it will be possible to prevent the protector from moving due to the load on the refrigerant compressor. When the return coolant temperature is high, the system automatically switches to using another cooling method, the heat exchanger, so the refrigerant compressor, which users thought was running, was stopped. Any trouble caused by this can be completely eliminated.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例を示す金型冷却装置の概略
構成図、第2図はその電気回路例、第3図はこの発明に
依らない金型冷却装置の概略構成図である。 4・・・冷凍装置の蒸発器、7・・・タンク、7a・・
・タンク下室、7b・・・タンク下室、9・・・金型、
10・・・仕切板、11・・・通液孔、12・・・ヒー
タ、14a、 14b・・・分岐戻り流路、18・・・
切換装置、19・・・熱交換器、20・・・熱交換器用
流路、Tト(・・・自動間?XJ装置。 特許出願人  三洋電機株式会社
FIG. 1 is a schematic diagram of a mold cooling device showing an embodiment of the present invention, FIG. 2 is an example of its electric circuit, and FIG. 3 is a schematic diagram of a mold cooling device not according to the present invention. 4... Evaporator of refrigeration equipment, 7... Tank, 7a...
- Tank lower chamber, 7b... Tank lower chamber, 9... Mold,
DESCRIPTION OF SYMBOLS 10... Partition plate, 11... Liquid passage hole, 12... Heater, 14a, 14b... Branch return channel, 18...
Switching device, 19... Heat exchanger, 20... Heat exchanger flow path, T (... automatic? XJ device. Patent applicant: Sanyo Electric Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 1、金型冷却用の冷却液が入つているタンクの内部に通
液孔を明けた仕切板を取付け、その仕切板を介してタン
ク上室は冷凍装置の蒸発器が浸漬する冷却部、タンク下
室はヒータを取付けた加熱部となし、そのタンク下室か
ら金型に送って熱交換した冷却液は分岐戻り流路を経て
タンク上室とタンク下室とに戻すようにした金型冷却装
置において、金型から分岐戻り流路に至る流路中に切換
装置を設け、その切換装置と前記分岐戻り流路との間に
熱交換器を有する熱交換器用流路を併設し、冷却液温度
が設定温度より低いとき、前記冷凍装置を駆動するとと
もに冷却液を前記熱交換器を経ずに戻す状態に前記切換
装置を切換え、また、冷却液温度が設定温度より高いと
き、前記冷凍装置を停止するとともに冷却液を前記熱交
換器を経て戻す状態に前記切換装置を切換える自動制御
装置を設けたことを特徴とする金型冷却装置。
1. Install a partition plate with liquid holes inside the tank that contains the coolant for cooling the mold, and through the partition plate, the upper chamber of the tank is connected to the cooling part where the evaporator of the refrigeration equipment is immersed, and the tank. The lower chamber is a heating section equipped with a heater, and the coolant sent from the lower tank chamber to the mold for heat exchange is returned to the upper tank chamber and lower tank chamber through a branch return flow path for mold cooling. In the apparatus, a switching device is provided in the flow path leading from the mold to the branch return flow path, and a heat exchanger flow path having a heat exchanger is provided between the switching device and the branch return flow path, and the cooling liquid is When the temperature is lower than the set temperature, the switching device is switched to a state in which the refrigeration device is driven and the coolant is returned without passing through the heat exchanger, and when the coolant temperature is higher than the set temperature, the refrigeration device is operated. 1. A mold cooling device comprising: an automatic control device for switching the switching device to a state in which the cooling liquid is stopped and the cooling liquid is returned through the heat exchanger.
JP29324087A 1987-11-20 1987-11-20 Mold cooling device Expired - Fee Related JP2522975B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29324087A JP2522975B2 (en) 1987-11-20 1987-11-20 Mold cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29324087A JP2522975B2 (en) 1987-11-20 1987-11-20 Mold cooling device

Publications (2)

Publication Number Publication Date
JPH01135604A true JPH01135604A (en) 1989-05-29
JP2522975B2 JP2522975B2 (en) 1996-08-07

Family

ID=17792248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29324087A Expired - Fee Related JP2522975B2 (en) 1987-11-20 1987-11-20 Mold cooling device

Country Status (1)

Country Link
JP (1) JP2522975B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01214421A (en) * 1988-02-23 1989-08-28 Matsui Seisakusho:Kk Mold temperature regulator
CN104460759B (en) * 2014-10-19 2017-01-25 镇江大成新能源有限公司 Constant-temperature mechanism for low-temperature liquid storage tank

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01214421A (en) * 1988-02-23 1989-08-28 Matsui Seisakusho:Kk Mold temperature regulator
CN104460759B (en) * 2014-10-19 2017-01-25 镇江大成新能源有限公司 Constant-temperature mechanism for low-temperature liquid storage tank

Also Published As

Publication number Publication date
JP2522975B2 (en) 1996-08-07

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