JPH01135095A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH01135095A JPH01135095A JP29204187A JP29204187A JPH01135095A JP H01135095 A JPH01135095 A JP H01135095A JP 29204187 A JP29204187 A JP 29204187A JP 29204187 A JP29204187 A JP 29204187A JP H01135095 A JPH01135095 A JP H01135095A
- Authority
- JP
- Japan
- Prior art keywords
- smear
- pressure
- multilayer printed
- hole
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 5
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 2
- 238000007598 dipping method Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000007654 immersion Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント配線板の製造に係り、特に、小径穴の
スミア除去に好適なプリント配線板の製造方法に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the manufacture of printed wiring boards, and particularly to a method of manufacturing printed wiring boards suitable for removing smear from small diameter holes.
往水のスミア除去は、通常の気圧下において。 Smear removal of incoming water is done under normal atmospheric pressure.
衾億戚等のスミア除去処理液に浸漬する方法で行なって
いた。これに関する公知例として特開昭５７−８４１９
４に記載のものがあげられる。また、処理液を用いない
プラズマ処理による方法でも行７：ｃりていた。This was done by immersing it in a smear removal treatment solution, such as a smear-removal solution. As a publicly known example of this, JP-A-57-8419
Examples include those listed in 4. Further, row 7: c was also obtained using a method using plasma processing without using a processing liquid.
上記従来技術の処理液浸漬法では、０．６φ以下の小径
大に気泡が残存し、処理液が浸入しに（いという問題が
ありた。またプラズマ処理法では、量産に不適である、
装置が高価であるという問題があった。In the conventional treatment liquid immersion method described above, there was a problem in that bubbles remained in small diameters of 0.6φ or less, making it difficult for the treatment liquid to penetrate.In addition, the plasma treatment method was unsuitable for mass production.
There was a problem that the equipment was expensive.
本発明の目的は、小径スルホールのスミア除去を安価で
かつ高品質で行ない得る方法を提供することにある。An object of the present invention is to provide a method for removing smear from small-diameter through holes at low cost and with high quality.
上記目的は、処理液浸漬法において、外部気圧を１００
Ｔｏｒｒ以下に減圧することにより達成される〔作用〕
減圧した後、処理液に浸漬することにより、浸漬後のス
ルホール内は、真空となり、処理液は浸入しやすくなる
。さらに、ｌ！！償したまま減圧を解除することにより
、浸入しやすさは向上する。The above purpose is to reduce the external pressure to 100% in the treatment liquid immersion method.
[Operation] Achieved by reducing the pressure to Torr or less By immersing the through hole in the processing liquid after reducing the pressure, the inside of the through hole after immersion becomes a vacuum, and the processing liquid can easily enter. Furthermore, l! ! By releasing the reduced pressure while the water is being hydrated, the ease of infiltration is improved.
以下、本発明の一実施例を第１図及び第２図により説明
する。第２図に示すように、真空チャンバー１、真空ポ
ンプ２、処理槽３、基板固定治具５からなるスミア除去
装置内において、ガラスエポキシを基材とする多層プリ
ント基板６に、０．３φ以下の小径スルホール７を穴明
したものを、基板固定治具５にセットする。真空チャン
バー１を密閉した後、真空ポンプ２により、真空チャン
バー１内を１００Ｔｏｒｒ以下に減圧する。その後、纂
１図に示す圧力プロファイルの如（、磯覚１ｉｔ ４に
多層プリント基板６を、基板固定治具５を下降させるこ
とにより浸漬し、１〜５秒後に、減圧を解除する。その
後、３０〜６ｏ＄後に、基＆固定治具な上昇させること
により浸漬を終了する。以下、公知の方法により多層プ
リント基板を完成させるものである。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. As shown in FIG. 2, in a smear removal device consisting of a vacuum chamber 1, a vacuum pump 2, a processing tank 3, and a substrate fixing jig 5, a multilayer printed circuit board 6 made of glass epoxy is coated with a diameter of 0.3 mm or less. The small-diameter through hole 7 is drilled and set in the board fixing jig 5. After the vacuum chamber 1 is sealed, the pressure inside the vacuum chamber 1 is reduced to 100 Torr or less using the vacuum pump 2. Thereafter, the multilayer printed circuit board 6 is immersed in the Isogaku 1it 4 by lowering the board fixing jig 5 as shown in the pressure profile shown in Figure 1, and after 1 to 5 seconds, the reduced pressure is released. After 30 to 6 ounces, the immersion is completed by raising the base and fixing jig.Hereafter, the multilayer printed circuit board is completed by a known method.
さて、浸漬後のスルホール内が真空になれば、何故処理
液が授入しやすいかについて、第３図を用いて説明する
。Now, with reference to FIG. 3, we will explain why it is easier to inject the processing liquid if the inside of the through hole becomes vacuum after immersion.
第３図において、 気泡体積 浸漬前 Ｖ 浸ａ後 Ｖ’ 気泡圧力 浸漬前 Ｐ 浸漬後 Ｐ′ 処理液（４１の密度 ｄ 浸漬深さ ん 重力加速度 ！ とすると、 Ｐ Ｖ ：＝ Ｐ’ Ｖ’ Ｐ ＝ Ｐ。In Figure 3, Air bubble volume before immersion V After immersion a V’ Bubble pressure before immersion P After immersion P' Processing liquid (density of 41 d Immersion depth Gravitational acceleration! Then, P V := P’ V’ P = P.
Ｐ’＝几＋ｄｌｋ
ここでｄ ＝ １００ ＱｋｇＡｎ” （水）、！１＝
９．８ｍｈ２．ｈ＝０．５ｍとすると、通常のＰｏ＝１
気圧＝ ７６０Ｔｏｒｒ ＝１０１５００Ｐａ のと
き、
また減圧時、７％ ＝ １０ Ｔｏｒｒ ＝ １５３０
Ｐａのとき、となる。これらから減圧浸漬（７６’０Ｔ
ｏｒｒ→１０Ｔｏｒｒうのみで、気泡の体積は０．９５
から肌２１に減少する。P'=几+dlk where d=100 QkgAn” (Wed), !1=
9.8mh2. If h=0.5m, normal Po=1
When atmospheric pressure = 760 Torr = 101500 Pa, and when depressurizing, 7% = 10 Torr = 1530
When Pa, it becomes. From these, vacuum immersion (76'0T)
orr → 10 Torr, the volume of bubbles is 0.95
It decreases from 21 to 21.
次忙浸漬中に圧力を元に戻せば、何故上記浸入度が向上
するかについて説明する。The reason why the above-mentioned degree of penetration improves if the pressure is returned to the original level during the next immersion will be explained.
復圧後の気泡圧カニＰ′
復圧後の気圧 ： Ｐ、１
とすると、上記と同様に、
Ｐ’＝几’十ｄｌｋ
ｐ’Ｖ’＝ ｐ’Ｖ’
＝ ０．０５９ Ｖ’
＝ ０．０１２ Ｖ
以上のように、復、圧（１０τｏｒｒ →７６０Ｔｏｒ
ｒ ） Ｙることにより、体積は更に減少するｔ Ｏ，
２１→０．０１２）ことがわかる。この様子を第４図及
び第５図に示す。第４図は減圧時の気泡（８）であり、
第５図は復圧後の気泡１８′）である。Bubble pressure after restoration P' Pressure after restoration: P, 1 As above, P' = 几'10 dlk p'V' = p'V' = 0.059 V' = 0 .012 V As mentioned above, the pressure (10τorr →760 Torr
r ) Y, the volume further decreases t O,
21→0.012). This situation is shown in FIGS. 4 and 5. Figure 4 shows bubbles (8) during depressurization,
FIG. 5 shows the bubbles 18') after the pressure is restored.
なお第６図は圧力とスミア発生率の関係を示した図で、
１００Ｔｏｒｒ以下で鎖著な効果が表われ、また上記復
圧があった方が、よりよい効果か出ていることかわかる
。Figure 6 is a diagram showing the relationship between pressure and smear occurrence rate.
A significant effect appears below 100 Torr, and it can be seen that the effect is even better when the pressure is restored.
本発明によれば、部側なプラズマ装置を用いることなく
、小径スルホールのスミアを除去することか可ηにであ
る。According to the present invention, it is possible to remove smear from small-diameter through holes without using a special plasma device.
第１図は本発明の一実施例の圧カブａファイルＷＪ２図
は本発明の装置概略図、第３図は第２図の要部抜すい図
、第４図及び第５図は気泡状態図、ｍ６図は圧力とスミ
ア発生率の関係図である。
１・・・真空チャンバー ２・・・真空ポンプ３・・・
処理槽 ４・・・磯懺酸５・・・基板固定治具
６・・・多層プリント板７・・・小径スルホール
８・・・気泡Ａノ乙Fig. 1 is a pressure cube a file WJ2 of an embodiment of the present invention. Fig. 3 is a schematic diagram of the apparatus of the present invention. Fig. 3 is a cut-out diagram of the main parts of Fig. 2. Fig. 4 and Fig. 5 are bubble state diagrams. , m6 diagram is a relationship diagram between pressure and smear occurrence rate. 1... Vacuum chamber 2... Vacuum pump 3...
Processing tank 4... Isosanic acid 5... Board fixing jig 6... Multilayer printed board 7... Small diameter through hole
8...Bubble A no B
Claims (1)
において、スミア除去処理液浸漬の一部または全体を、
１００Ｔｏｒｒ以下の減圧環境下で行なうことを特徴と
するプリント配線板の製造方法。1. In the smear removal process in the production of multilayer printed wiring boards, part or all of the smear removal treatment solution is
A method for manufacturing a printed wiring board, characterized in that the manufacturing method is carried out in a reduced pressure environment of 100 Torr or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29204187A JPH01135095A (en) | 1987-11-20 | 1987-11-20 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29204187A JPH01135095A (en) | 1987-11-20 | 1987-11-20 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01135095A true JPH01135095A (en) | 1989-05-26 |
Family
ID=17776768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29204187A Pending JPH01135095A (en) | 1987-11-20 | 1987-11-20 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135095A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107899622A (en) * | 2017-11-03 | 2018-04-13 | 深圳市纯水号水处理科技有限公司 | A kind of anti-device fault based on resin adsorption experiment |
-
1987
- 1987-11-20 JP JP29204187A patent/JPH01135095A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107899622A (en) * | 2017-11-03 | 2018-04-13 | 深圳市纯水号水处理科技有限公司 | A kind of anti-device fault based on resin adsorption experiment |
| CN107899622B (en) * | 2017-11-03 | 2020-06-30 | 深圳市纯水一号水处理科技有限公司 | Anti-layer-breaking device based on resin adsorption experiment |
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