JPH01130554U - - Google Patents
Info
- Publication number
- JPH01130554U JPH01130554U JP1988025991U JP2599188U JPH01130554U JP H01130554 U JPH01130554 U JP H01130554U JP 1988025991 U JP1988025991 U JP 1988025991U JP 2599188 U JP2599188 U JP 2599188U JP H01130554 U JPH01130554 U JP H01130554U
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- lead wire
- external
- lead
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988025991U JPH0528778Y2 (ja�@�@) | 1988-03-01 | 1988-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988025991U JPH0528778Y2 (ja�@�@) | 1988-03-01 | 1988-03-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01130554U true JPH01130554U (ja�@�@) | 1989-09-05 |
| JPH0528778Y2 JPH0528778Y2 (ja�@�@) | 1993-07-23 |
Family
ID=31247208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988025991U Expired - Lifetime JPH0528778Y2 (ja�@�@) | 1988-03-01 | 1988-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528778Y2 (ja�@�@) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5756531U (ja�@�@) * | 1980-09-19 | 1982-04-02 |
-
1988
- 1988-03-01 JP JP1988025991U patent/JPH0528778Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5756531U (ja�@�@) * | 1980-09-19 | 1982-04-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0528778Y2 (ja�@�@) | 1993-07-23 |