JPH01130554U - - Google Patents
Info
- Publication number
- JPH01130554U JPH01130554U JP2599188U JP2599188U JPH01130554U JP H01130554 U JPH01130554 U JP H01130554U JP 2599188 U JP2599188 U JP 2599188U JP 2599188 U JP2599188 U JP 2599188U JP H01130554 U JPH01130554 U JP H01130554U
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- lead wire
- external
- lead
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988025991U JPH0528778Y2 (hu) | 1988-03-01 | 1988-03-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988025991U JPH0528778Y2 (hu) | 1988-03-01 | 1988-03-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01130554U true JPH01130554U (hu) | 1989-09-05 |
JPH0528778Y2 JPH0528778Y2 (hu) | 1993-07-23 |
Family
ID=31247208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988025991U Expired - Lifetime JPH0528778Y2 (hu) | 1988-03-01 | 1988-03-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0528778Y2 (hu) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5756531U (hu) * | 1980-09-19 | 1982-04-02 |
-
1988
- 1988-03-01 JP JP1988025991U patent/JPH0528778Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5756531U (hu) * | 1980-09-19 | 1982-04-02 |
Also Published As
Publication number | Publication date |
---|---|
JPH0528778Y2 (hu) | 1993-07-23 |