JPH0112898Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a lead wire cutter device that automatically cuts off excess lead wires protruding from the solder surface after the lead wires of electronic components mounted on a printed circuit board are dipped in a solder bath.

Conventional lead wire cutting devices of this type include those shown in FIGS. 1A, 1B, 2C and 2. In the drawing, A is a printed circuit board, B is an electronic component mounted on the printed circuit board A, and C is a lead wire of the electronic component B protruding from the solder surface of the printed circuit board A. D is a guide that supports the printed circuit board A and moves it to a predetermined location. E is a disc-shaped cutter blade having a cutting edge on its outer periphery, and this cutter blade E rotates in the horizontal direction about a vertical rotation axis F. In addition,
Katsuta Blade E is not limited to two pieces,
Any number of photos is fine.

Next, the effect will be explained. First, as shown by A in Fig. 1, the printed circuit board A supported by the guide D is dipped into an automatic soldering bath.
Solder the lead wire C of electronic component B that protrudes from the solder surface of. Next, if the above-mentioned printed circuit board A is moved horizontally toward the cutter blade E as shown by the arrow in FIG. The line C is cut by the cutting edge of the cutter blade E, as shown by C in FIG.

The conventional lead wire cutter device is constructed as described above, but when the printed circuit board A is soldered in an automatic soldering tank, it warps upward due to the high heat of the solder, etc., as shown in Figure 1 (b). There are cases. In this state, if the excess lead wire C is cut by the horizontally rotating cutter blade E, the printed circuit board A
When the lead wire C is cooled and becomes flat, the central portion of the cut lead wire C becomes longer as shown by C in FIG. 1, and variations occur in the other portions. When such a printed circuit board A is assembled into a set, there is a risk that the long lead wire C may come into contact with the case. To prevent this, an insulator or the like must be placed between the board and the case, which increases the assembly work. Sexuality becomes worse.

In addition, the following devices existed as devices for cutting such lead wires (for example, Japanese Utility Model Application No. 54-66291). In this conventional technology, the rotation axis of the cutter remains perpendicular to the conveyance direction of the printed circuit board to which electronic components are soldered, and the cutter position can be adjusted vertically and horizontally to form a single cutter. Therefore, an attempt is made to cut off excess lead wires over a wide area.

Therefore, when it is desired to cut lead wires over a wide area, it is sufficient to provide as many cutter blades as necessary, as in the prior art shown in FIG. 2 above. However, when cutting the lead wires of a warped printed circuit board, it is impossible to eliminate variations in the length of the lead wires simply by adjusting the number and position of the cutters. This means that the angle of the rotation axis of the cutter is fixed perpendicular to the printed circuit board being transported, so if the printed circuit board is warped, the length of the lead wire to be cut will vary. be.

Therefore, such drawbacks cannot be solved by the idea or means of adjusting the position of the cutter in the vertical and horizontal directions.

In addition, for example, Japanese Utility Model Publication No. 50-33747 was published as a method for neatly cutting uneven lead wires. In this technology, the ground surface on the side through which the lead wires of the printed circuit board pass is formed flat, and the axis of the drive shaft on the ground surface is aligned in a direction in which the upper end of the shaft is tilted forward with respect to the feeding surface of the printed circuit board. It was constructed to be inclined. For this reason, the ground surface escapes from the lead wires of the printed circuit board and does not rub against the bottom surface of the printed circuit board. However, in this conventional technology,
When mounting lead wires on a printed circuit board, no means have been proposed to solve the problem of upward warping of the printed circuit board due to the high heat of solder, etc. after it is dipped in a solder bath. It had the same drawbacks.

The present invention is an attempt to eliminate the above-mentioned drawbacks, and is based on a completely opposite concept to the conventional idea of adjusting the position of a cutter blade while maintaining its fixed vertical axis of rotation. , a lead wire cutting device that uses a disk-shaped cutter blade that rotates horizontally to cut off the excess lead wires protruding from the solder surface after soldering the lead wires of electronic components mounted on a printed circuit board. The rotation axis of the blade can be tilted outward by any angle from perpendicular to the printed circuit board to perpendicular to the direction of movement, thereby eliminating variations in the length of the lead wires cut by the cutter blade. It is an object of the present invention to provide a lead wire cutting device that reduces the number of lead wires as much as possible.

Hereinafter, the present invention will be explained based on the embodiments shown in the drawings. 3A, 3B, and 3C are explanatory diagrams showing a lead wire being cut by the lead wire cutter device according to the present invention, and FIG. 4 is a plan view showing the main parts of the cutter device.

In the drawing, 1 is a printed board, 2 is an electronic component mounted on the board 1, and 3 is a lead wire of the electronic component 2 protruding from the solder surface of the printed board 1. 4 is a guide that supports the printed circuit board 1 and moves it to a predetermined location. Reference numeral 5 denotes a disc-shaped cutter blade having a cutting edge on the outer periphery, and this cutter blade 5 normally guides the printed circuit board 1.
The rotating shaft 6 is rotated in the horizontal direction by a rotating shaft 6 perpendicular to the printed circuit board 1, and the rotating shaft 6 is rotated outward by an arbitrary angle θ in a direction perpendicular to the moving direction of the printed circuit board 1 from the vertical axis A-A'. can be tilted to Although there are two cutter blades 5 in the drawing,
Any number of sheets may be used without being limited to this.

Next, the effect will be explained. First, as shown in FIG.
solder. Next, the above printed circuit board 1
When the lead wire 3 is moved horizontally toward the cutter blade 5 as shown by the arrow in FIG. Here, as shown in FIG.
If you tilt it outward by a predetermined angle θ from A′,
Since the cutter blade 5 and the solder surface of the warped printed circuit board 1 are approximately parallel to each other, the lengths of all the lead wires 3 after cutting are approximately the same and there is no variation, as shown by C in FIG.

As described above, in the present invention, after soldering the lead wires 3 of the electronic component 2 mounted on the printed circuit board 1,
In a lead wire cutting device in which the extra lead wire 3 protruding from the solder surface is cut by a horizontally rotating disc-shaped cutter blade 5, the rotating shaft 6 of the cutter blade 5 is placed perpendicular to the printed circuit board 1. It is designed so that it can be tilted outward by an arbitrary angle θ in a direction perpendicular to the direction of movement.

Therefore, by arbitrarily tilting the angle of the rotating shaft 6 of the cutter blade 5 according to the warpage of the printed circuit board 1, the printed circuit board 1 and the cutter blade 5 can be set parallel to each other. As a result, the lengths of all the lead wires 3 after the lead wires 3 are cut become substantially uniform, and there is no variation in the lengths of the lead wires 3. Therefore, it can be easily incorporated into a set without using an insulator.

[Brief explanation of the drawing]

Fig. 1 A, B, and C are explanatory diagrams of the cutting operation by a conventional lead wire cutter device, Fig. 2 is a plan view showing the main parts of the lead wire cutter device, and Fig. 3 A,
B and C are explanatory diagrams of the cutting operation by the lead wire cutter device according to the present invention, and FIG. 4 is a front view showing the main parts of the lead wire cutter device. 1...Printed circuit board, 2...Electronic components, 3...
Lead wire, 5... cutter blade, 6... rotation axis, θ... angle.

Claims (1)

[Scope of utility model registration request] After soldering the lead wires of electronic components mounted on a printed circuit board, the lead wire cutting device uses a horizontally rotating disc-shaped cutter blade to cut off the excess lead wires protruding from the solder surface. A lead wire cutting device characterized in that the rotation axis of the lead wire cutter can be tilted outward by an arbitrary angle from a state perpendicular to a printed circuit board in a direction perpendicular to a direction of movement.