JPH01128014A - Production of photosemiconductor device - Google Patents

Abstract

PURPOSE:To minimize clad propagation mode component light and to maximize core propagation mode component light by measuring the clad leak light of an optical fiber and adjusting the relative position of an optical element and the optical fiber so as to minimize the leak light at the time of coupling and assembling said element and fiber. CONSTITUTION:The focus of the light radiated from the optical element 1 is aligned to the end face of the core 3a on the element 1 side side of the optical fiber 3 by adjusting the Z direction of an X-Y-Z stage 9. A photodetector B6 is then provided to the side face of the optical fiber 3 to detect the clad leak light radiated from the side face of the clad 3b of the optical fiber 3. The detected light is amplified by an amplifier 7 and the position in the X-Y directions of the element 1 is adjusted by the X-Y-Z stage 9 while said light is measured by an optical power meter B8. The element 1 is fixed to the position where the clad leak light is minimized. The clad propagation mode component light propagating in the clad 3b is minimized and the core propagation mode component light propagating in the core 3a is maximized if the device is assembled in such a manner.

Description

[Detailed Description of the Invention] [Summary] Regarding the improvement of the coupling method between an optical element of an optical semiconductor device and an optical fiber, it is possible to minimize the clad propagation mode component light and maximize the core propagation mode component light. The purpose of the present invention is to provide a method for manufacturing an optical semiconductor device, which measures the cladding leakage light of the optical fiber when coupling and assembling an optical element and an optical fiber, and measures the cladding leakage light of the optical fiber so that the cladding leakage light is minimized. and the optical fiber are assembled by adjusting their relative positions.

[Industrial application field]

The present invention relates to a method for manufacturing an optical semiconductor device, and particularly to an improvement in a method for coupling an optical element and an optical fiber.

An optical semiconductor device is assembled by coupling an optical element and an optical fiber of about 1e; the method of assembly is to propagate the light emitted from the optical element through the optical fiber, and the light is not coupled to the optical element. The total optical power consisting of the core propagation mode component light and the cladding propagation mode component light emitted from the end face of the optical fiber is detected by a photodetector, the maximum value of the total optical power is determined, and the optical chip is installed at that position. A method is used to fix the mounted stem and optical fiber.

Among the component lights propagated in an optical fiber, the effective one is the core propagation mode component light, and the cladding propagation mode component light is radiated out of the optical fiber and attenuated as the length of the optical fiber increases. , the cladding propagation mode component light is an invalid component as a transmission signal, and if it is possible to remove this cladding propagation mode component light when coupling an optical element and an optical fiber during the manufacture of an optical semiconductor device, When designing a transmission system, it is no longer necessary to take extra margins other than the power required during use.

Under the above circumstances, there is a need for a method of manufacturing an optical semiconductor device that can couple an optical element and an optical fiber so that the core propagation mode component light is maximized.

[Conventional technology]

A conventional method for manufacturing an optical semiconductor device will be explained with reference to FIG.

First, as shown in the figure, the optical element 1 is fixed on the X-Y-Z stage 9 and operated by the drive power supply 2, and the optical fiber 3 is positioned above the lens 1c of the optical element 1.

The Z direction of the X-Y-Z stage 9 is adjusted to focus the light emitted from the optical element 1 onto the end face of the core 3a of the optical fiber 3 on the optical element 1 side.

Next, the X-Y-Z stage 9 is adjusted in the X and Y directions to align the center of the core 3a of the optical fiber 3 with the optical axis of the light emitted from the optical element 1, and the light is detected by the photodetector A4. The light emitted from the end face of the fiber 3 on the photodetector A4 side is detected, the optical power meter A5 indicates the maximum value, and in this state, the optical element 1 and the optical fiber 3 are fixed to complete the optical semiconductor device. Manufacturing is completed.

[Problem that the invention seeks to solve]

The problem with the conventional optical semiconductor device manufacturing method described above is that the core propagation mode component light, which is emitted from the end face of the optical fiber 3 on the photodetector A4 side and propagates through the core 3a, and the core propagation mode component light which propagates through the cladding 3b. The total optical power consisting of the cladding propagation mode component light is detected by the photodetector A4, and the total optical power is measured according to the instruction from the optical power meter A5.

When designing a transmission system, only the power required during use, ie, the value of the core propagation mode component light, is effective, so it is required to maximize this component light.

In view of the above-mentioned circumstances, it is an object of the present invention to provide a method for manufacturing an optical semiconductor device that can minimize the clad propagation mode component light and maximize the core propagation mode component light.

[Means for solving problems]

The above problem is solved by measuring the cladding leakage light of the optical fiber when coupling and assembling the optical element and the optical fiber, and adjusting the relative position of the optical element and the optical fiber so that the cladding leakage light is minimized. This problem is solved by the method of manufacturing an optical semiconductor device according to the present invention, which adjusts and assembles the optical semiconductor device.

[Effect]

That is, in the present invention, when an optical element and an optical fiber are coupled and assembled, the cladding leakage light emitted from the side surface of the cladding of the optical fiber is measured, and the optical element and the optical fiber are connected so that this cladding leakage light is minimized. Since the relative position with the optical fiber is adjusted and assembled, the optical semiconductor device connects the optical element and the optical fiber while maximizing the core propagation mode component light emitted from the end face of the optical fiber on the photodetector side. Manufacturing becomes possible.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG.

First, as shown in the figure, the optical element 1 is fixed on the xyz stage 9 and operated by the drive power supply 2, and the optical fiber 3 is positioned above the lens 1c of the optical element 1.

The Z direction of the XYZ stage 9 is adjusted to focus the light emitted from the optical element 1 onto the end face of the core 3a of the optical fiber 3 on the optical element 1 side.

Next, in the present invention, as shown in FIG. 1, in addition to the conventional method for manufacturing an optical semiconductor device, a photodetector B6 is provided on the side surface of the optical fiber 3, and the light emitted from the side surface of the cladding 3b of the optical fiber 3 is The cladding leakage light is detected, amplified by the amplifier 7, and measured by the optical power meter B8, while the position of the optical element 1 in the X-Y direction is adjusted by the x-y-Z stage 9, and this cladding leakage light is minimized. The optical element 1 is fixed at a position.

When the optical element 1 and the optical fiber 3 are coupled and assembled in such a manner that the cladding leakage light is minimized, the cladding propagation mode component light propagating through the cladding 3b is minimized, and the power required when designing the transmission system is , that is,
Since it is possible to maximize the value of the core propagation mode component light propagating through the core 3a, it is not necessary to take an extra margin other than the power required during use when manufacturing the optical semiconductor device.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, a cladding leakage light measuring mechanism with an extremely simple configuration is provided to measure the cladding leakage light, and by minimizing the value, it is effective in designing a transmission system. It has the advantage of being able to maximize the value of the core propagation mode component light, and can be expected to have significant economic effects, making it extremely useful industrially.

[Brief explanation of the drawing]

FIG. 1 is a side view showing an embodiment of the present invention, and FIG. 2 is a side view showing a conventional method for manufacturing an optical semiconductor device. In the figure, ■ is the optical element, la is the stem, 1b is the optical chip, lc is the lens, 2 is the drive power supply, 3 is the optical fiber, 3a is the core, 3b is the cladding, 4 is the photodetector A, 5 is the light Power meter A1 6 is photodetector B, 7 is amplifier, 8 is optical power meter B. 9 is an X-Y-Z stage; FIG. 1 is a side view showing an embodiment of the present invention;

Claims (1)

[Claims] When coupling and assembling the optical element (1) and the optical fiber (3), the cladding leakage light of the optical fiber (3) is measured, and the cladding leakage light of the optical fiber (3) is measured so that the cladding leakage light is minimized. A method of manufacturing an optical semiconductor device, characterized in that the relative positions of the optical fiber (3) and the optical fiber (3) are adjusted and assembled.