JPH01127259U - - Google Patents
Info
- Publication number
- JPH01127259U JPH01127259U JP2173688U JP2173688U JPH01127259U JP H01127259 U JPH01127259 U JP H01127259U JP 2173688 U JP2173688 U JP 2173688U JP 2173688 U JP2173688 U JP 2173688U JP H01127259 U JPH01127259 U JP H01127259U
- Authority
- JP
- Japan
- Prior art keywords
- rectifier
- nut
- molded
- resin
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2173688U JPH01127259U (de) | 1988-02-23 | 1988-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2173688U JPH01127259U (de) | 1988-02-23 | 1988-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127259U true JPH01127259U (de) | 1989-08-31 |
Family
ID=31239227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2173688U Pending JPH01127259U (de) | 1988-02-23 | 1988-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127259U (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011028969A (ja) * | 2009-07-24 | 2011-02-10 | Yazaki Corp | 金属板及びボルトの合成樹脂部材への固定構造、及び、それを有するコネクタ |
| JP2014056982A (ja) * | 2012-09-13 | 2014-03-27 | Mitsubishi Electric Corp | パワー半導体装置およびその製造方法 |
| WO2017017749A1 (ja) * | 2015-07-27 | 2017-02-02 | 三菱電機株式会社 | 半導体装置 |
-
1988
- 1988-02-23 JP JP2173688U patent/JPH01127259U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011028969A (ja) * | 2009-07-24 | 2011-02-10 | Yazaki Corp | 金属板及びボルトの合成樹脂部材への固定構造、及び、それを有するコネクタ |
| JP2014056982A (ja) * | 2012-09-13 | 2014-03-27 | Mitsubishi Electric Corp | パワー半導体装置およびその製造方法 |
| WO2017017749A1 (ja) * | 2015-07-27 | 2017-02-02 | 三菱電機株式会社 | 半導体装置 |
| JPWO2017017749A1 (ja) * | 2015-07-27 | 2017-11-02 | 三菱電機株式会社 | 半導体装置 |
| US10304748B2 (en) | 2015-07-27 | 2019-05-28 | Mitsubishi Electric Corporation | Semiconductor device |