JPH0226261U - - Google Patents

Info

Publication number
JPH0226261U
JPH0226261U JP10386188U JP10386188U JPH0226261U JP H0226261 U JPH0226261 U JP H0226261U JP 10386188 U JP10386188 U JP 10386188U JP 10386188 U JP10386188 U JP 10386188U JP H0226261 U JPH0226261 U JP H0226261U
Authority
JP
Japan
Prior art keywords
lead frame
integrated circuit
semiconductor device
thickness
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10386188U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10386188U priority Critical patent/JPH0226261U/ja
Publication of JPH0226261U publication Critical patent/JPH0226261U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP10386188U 1988-08-05 1988-08-05 Pending JPH0226261U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10386188U JPH0226261U (de) 1988-08-05 1988-08-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10386188U JPH0226261U (de) 1988-08-05 1988-08-05

Publications (1)

Publication Number Publication Date
JPH0226261U true JPH0226261U (de) 1990-02-21

Family

ID=31335066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10386188U Pending JPH0226261U (de) 1988-08-05 1988-08-05

Country Status (1)

Country Link
JP (1) JPH0226261U (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817988A (ja) * 1994-06-28 1996-01-19 Hitachi Ltd 樹脂封止型半導体装置及びその製造方法
JP2010045265A (ja) * 2008-08-15 2010-02-25 Techwin Opto-Electronics Co Ltd Ledリードフレームの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817988A (ja) * 1994-06-28 1996-01-19 Hitachi Ltd 樹脂封止型半導体装置及びその製造方法
JP2010045265A (ja) * 2008-08-15 2010-02-25 Techwin Opto-Electronics Co Ltd Ledリードフレームの製造方法
JP4531830B2 (ja) * 2008-08-15 2010-08-25 特新光電科技股▲分▼有限公司 Ledリードフレームの製造方法

Similar Documents

Publication Publication Date Title
JPH0226261U (de)
JPS61144650U (de)
JPS6397241U (de)
JPH0270450U (de)
JPH0245651U (de)
JPS62196349U (de)
JPH0220352U (de)
JPS61114842U (de)
JPH0176040U (de)
JPH0446552U (de)
JPS6230341U (de)
JPS61168638U (de)
JPH03101524U (de)
JPH0472626U (de)
JPH01107150U (de)
JPH01104720U (de)
JPS6172857U (de)
JPH0247061U (de)
JPH0328757U (de)
JPS62163966U (de)
JPH0442745U (de)
JPS62122349U (de)
JPH0244330U (de)
JPH02146437U (de)
JPS6186945U (de)