JPH0112339Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a conductive adhesive tape, and more particularly to an adhesive tape used for adhering conductors.

Conventionally, soldering has been used exclusively to connect and bond electrical circuit components, but when bonding, high heat from the melting of the solder is applied to the components, so care must be taken when connecting components that are susceptible to thermal shock. can be,
In addition, since high heat is required, the work is dangerous, requires a certain degree of skill, and is troublesome.

Therefore, attempts have been made to use conductive adhesive tapes to adhesively bond electrical circuit components. Metal foils, metal fabrics, etc. have been used, but in the case of the former, it is necessary to mix a considerable amount of metal powder in order to impart conductivity, and this mixing causes the adhesive to deteriorate. In the latter case, since the adhesive layer is an insulator, complete conductivity cannot be obtained after adhesion, and the desired sufficient conductivity cannot be obtained. Another drawback was that it was difficult to obtain because it had adhesive properties. It has also been proposed to provide a conductive wire in the adhesive layer so that a portion of the conductive wire is exposed from the layer (for example, Japanese Patent Laid-Open No. 56-63705). There was a risk that the wire would be buried in the adhesive, and there was a drawback that the reliability of conductivity was lacking.

In view of the above-mentioned drawbacks, this invention was devised for the purpose of providing a conductive adhesive tape with excellent conductivity and adhesive properties. It is characterized by the fact that it is sewn on.

This invention will be explained below using examples.

FIG. 1 is an enlarged sectional view of a main part of an embodiment of this invention.

The conductive adhesive tape 1 of this invention has a structure in which conductive fibers 4 are sewn by a sewing machine or the like onto a base material 3 such as a nonwoven fabric, plastic film, or plastic sheet, which has adhesive layers 2 on the front and back sides. There is.

As the conductive fiber 4, thin metal wires such as gold, platinum, silver, and copper are used as those having the best conductivity, but metal-plastic threads with metal plating or vapor deposition on the surface, or carbon Fiber fibers may also be used.

Then, the diameter of the conductive fiber 4 and the adhesive layer 2
The layer thickness is such that the adhesive layer 2 is larger as shown in the figure, and the conductive fibers 4 are exposed on the surface of the adhesive layer 2 before adhesive use. is desirable.

In order to expose the conductive fibers 4 on the adhesive layer 2, as shown in FIG. The conductive fibers 4 may be temporarily attached and sewn thereon using a sewing machine or the like, and the release papers 5, 5 may be peeled off when used, leaving the conductive fibers 4.

When bonded using the conductive adhesive tape 1 of this invention, the adhesive layer has viscoelasticity and the conductive fibers are plastically deformed, so when bonded by pressure, the conductive fibers Since a part of it is exposed and most of it is buried in the adhesive, the electrical conductivity is maintained in the partially exposed part, and at the same time, the adhesiveness is not impaired.

Note that the above-mentioned adhesive layers 2, 2 can be similarly implemented as hot-melt adhesive layers.

This idea is structured as above,
Even when making connections between terminals, it is now possible to use double-sided adhesive tape to bond the connections, making the connection work very easy, and the conductive fibers have good conductivity and provide sufficient current carrying effect. In addition, since the conductive fibers are sewn to the base material, they do not move due to external forces applied during adhesion and provide reliable conductivity. has.

[Brief explanation of drawings]

FIG. 1 is an enlarged sectional view of a main part of the embodiment, and FIG. 2 is a perspective view showing how the embodiment is used. 1... Conductive adhesive tape, 2... Adhesive layer, 3
... Tape base material, 4 ... Conductive fiber, 5 ... Release paper.

Claims (1)

[Claims for Utility Model Registration] (1) A conductive adhesive tape characterized by conductive fibers sewn onto a base material having an adhesive layer on the front and back sides. (2) The conductive adhesive tape according to claim 1, wherein the conductive fibers are thin metal wires. (3) The electrically conductive adhesive tape according to claim 1, wherein the electrically conductive fibers are made of plastic with a surface metal coating. (4) The conductive adhesive tape according to claim 1, wherein the conductive fibers are carbon fiber fibers.