JPH01121863U - - Google Patents
Info
- Publication number
- JPH01121863U JPH01121863U JP19482987U JP19482987U JPH01121863U JP H01121863 U JPH01121863 U JP H01121863U JP 19482987 U JP19482987 U JP 19482987U JP 19482987 U JP19482987 U JP 19482987U JP H01121863 U JPH01121863 U JP H01121863U
- Authority
- JP
- Japan
- Prior art keywords
- weight part
- stopper
- fixed
- distorted
- beam portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001133 acceleration Effects 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000001514 detection method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図は本考案の一実施例図、第２図及び第３
図は従来装置の一例図、第４図は第１図の装置の
製造工程の一実施例図、第５図は第１図の装置の
作用説明図、第６図は本考案の他の実施例図であ
る。
符号の説明、１１……Ｓｉおもり（質量部）、
１２……支持フレーム部（固定部）、１３……ポ
リＳｉ、１４……第１ビーム（第１突起部）、１
５……第２ビーム（第２突起部）、１６……空隙
、１７……ピエゾ抵抗、１８……間隙。
Figure 1 is an embodiment of the present invention, Figures 2 and 3
The figure is an example of a conventional device, FIG. 4 is an example of the manufacturing process of the device in FIG. 1, FIG. 5 is an explanatory diagram of the operation of the device in FIG. This is an example diagram. Explanation of symbols, 11...Si weight (parts by mass),
12... Support frame part (fixed part), 13... Poly Si, 14... First beam (first protrusion), 1
5...Second beam (second protrusion), 16...Gap, 17...Piezo resistance, 18...Gap.
Claims (1)
、該梁部の一端に接続して形成された単一のおも
り部と、上記梁部の他端に接続され上記おもり部
の外周を所定の間隔を開けて取り囲むように形成
された固定部と、上記梁部に形成されたピエゾ抵
抗部とが、半導体基板に形成されている半導体加
速度センサにおいて、加速度検出方向すなわち上
記梁部が歪む方向を垂直方向、それと直角方向を
水平方向とした場合に、上記おもり部から伸びて
上記固定部または固定部に固着されたストツパと
重なる位置まで突出し、かつ上記固定部またはス
トツパと垂直方向で所定間隔を開けて対向するよ
うに設けられた複数の第１突起部と、上記固定部
から伸びて上記おもり部またはおもり部に固着さ
れたストツパと重なる位置まで突出し、上記おも
り部またはストツパと垂直方向で所定間隔を開け
て対向し、かつ上記第１突起部と水平方向で相互
に所定間隔を開けて凹凸状に入り組んだ複数の第
２突起部とを備えたことを特徴とする半導体加速
度センサ。 one or more beam parts that are distorted when acceleration is applied; a single weight part connected to one end of the beam parts; In a semiconductor acceleration sensor formed on a semiconductor substrate, a fixing portion formed to open and surround the beam portion and a piezoresistive portion formed on the beam portion are arranged so that the acceleration detection direction, that is, the direction in which the beam portion is distorted, is perpendicular to the direction in which the beam portion is distorted. , when the direction perpendicular thereto is the horizontal direction, extends from the weight part and projects to a position overlapping with the fixed part or a stopper fixed to the fixed part, and is spaced at a predetermined distance in the vertical direction from the fixed part or stopper. A plurality of first protrusions provided to face each other extend from the fixed part and protrude to a position overlapping with the weight part or a stopper fixed to the weight part, and are spaced at a predetermined interval in the vertical direction from the weight part or the stopper. A semiconductor acceleration sensor comprising: a plurality of second protrusions that open and face each other and are intricately shaped in a concave-convex manner at a predetermined interval from each other in the horizontal direction from the first protrusion.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19482987U JPH0624773Y2 (en) | 1987-12-24 | 1987-12-24 | Semiconductor acceleration sensor |
| US07/285,696 US5121633A (en) | 1987-12-18 | 1988-12-16 | Semiconductor accelerometer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19482987U JPH0624773Y2 (en) | 1987-12-24 | 1987-12-24 | Semiconductor acceleration sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01121863U true JPH01121863U (en) | 1989-08-18 |
| JPH0624773Y2 JPH0624773Y2 (en) | 1994-06-29 |
Family
ID=31485536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19482987U Expired - Lifetime JPH0624773Y2 (en) | 1987-12-18 | 1987-12-24 | Semiconductor acceleration sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0624773Y2 (en) |
-
1987
- 1987-12-24 JP JP19482987U patent/JPH0624773Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0624773Y2 (en) | 1994-06-29 |
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