JPH01120395U - - Google Patents
Info
- Publication number
- JPH01120395U JPH01120395U JP1365588U JP1365588U JPH01120395U JP H01120395 U JPH01120395 U JP H01120395U JP 1365588 U JP1365588 U JP 1365588U JP 1365588 U JP1365588 U JP 1365588U JP H01120395 U JPH01120395 U JP H01120395U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- thick film
- film integrated
- circuit board
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案による厚膜集積回路のシールド
装置の分解斜視図、第２図および第３図の要部拡
大斜視図、第４図ａ，ｂ，ｃおよびｄはその組立
手順を示す斜視図、第５図および第６図は共に従
来の厚膜集積回路のシールド装置の斜視図および
斜視断面図である。
１……厚膜集積回路基板、１ａ……取り付け孔
、２……シールドケース、２ａ……案内、２ｂ…
…突起、３……ゴム端子、４……フラツトパツケ
ージ形ＩＣ、５……チツプ形電子部品、６……上
ケース、６ａ……組立用突起、６ｂ，７ａ……正
面壁、６ｃ，７ｂ……切り欠き、６ｄ……右側壁
、６ｅ，６ｊ……組立用爪、６ｆ……左側壁、６
ｇ……背面壁、６ｈ……案内部、６ｉ……係合爪
、７……下ケース、７ｃ，７ｄ……貫通孔。
Fig. 1 is an exploded perspective view of a thick film integrated circuit shielding device according to the present invention, Figs. 2 and 3 are enlarged perspective views of main parts, and Figs. 4 a, b, c, and d are perspective views showing the assembly procedure. 5 and 6 are a perspective view and a perspective sectional view of a conventional shielding device for a thick film integrated circuit. DESCRIPTION OF SYMBOLS 1... Thick film integrated circuit board, 1a... Mounting hole, 2... Shield case, 2a... Guide, 2b...
...Protrusion, 3...Rubber terminal, 4...Flat package type IC, 5...Chip type electronic component, 6...Top case, 6a...Protrusion for assembly, 6b, 7a...Front wall, 6c, 7b ...Notch, 6d...Right side wall, 6e, 6j...Assembling claw, 6f...Left side wall, 6
g... Rear wall, 6h... Guide section, 6i... Engaging claw, 7... Lower case, 7c, 7d... Through hole.
Claims (1)
の上下両ケースからシールドケースを構成し、一
方のケースの少くとも一側面を開口方向に延長し
た案内部を上記の厚膜集積回路基板の端面に沿わ
せ、他の側面に形成した一箇所以上の組立用突起
を上記の厚膜集積回路基板に設けた取り付け孔に
挿通し、上記の案内部および組立用突起に他の一
方のケースをかぶせて固定したことを特徴とする
厚膜集積回路のシールド装置。 A shield case is constructed from both shallow box-shaped upper and lower cases that sandwich the thick film integrated circuit board from the upper and lower surfaces, and a guide portion extending in the opening direction on at least one side of one case is connected to the thick film integrated circuit board. Insert one or more assembly protrusions formed on the other side along the end face into the mounting holes provided on the thick film integrated circuit board, and insert the other case into the guide portion and assembly protrusion. A thick film integrated circuit shielding device characterized by being covered and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1365588U JPH01120395U (en) | 1988-02-05 | 1988-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1365588U JPH01120395U (en) | 1988-02-05 | 1988-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01120395U true JPH01120395U (en) | 1989-08-15 |
Family
ID=31224147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1365588U Pending JPH01120395U (en) | 1988-02-05 | 1988-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01120395U (en) |
-
1988
- 1988-02-05 JP JP1365588U patent/JPH01120395U/ja active Pending
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