JPH01120344U - - Google Patents
Info
- Publication number
- JPH01120344U JPH01120344U JP1988016226U JP1622688U JPH01120344U JP H01120344 U JPH01120344 U JP H01120344U JP 1988016226 U JP1988016226 U JP 1988016226U JP 1622688 U JP1622688 U JP 1622688U JP H01120344 U JPH01120344 U JP H01120344U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- heat sink
- insulating container
- dimension
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988016226U JPH01120344U (enExample) | 1988-02-08 | 1988-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988016226U JPH01120344U (enExample) | 1988-02-08 | 1988-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01120344U true JPH01120344U (enExample) | 1989-08-15 |
Family
ID=31228969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988016226U Pending JPH01120344U (enExample) | 1988-02-08 | 1988-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01120344U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162550A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 樹脂封止型半導体装置およびその製造方法 |
-
1988
- 1988-02-08 JP JP1988016226U patent/JPH01120344U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162550A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 樹脂封止型半導体装置およびその製造方法 |