JPH01119660A - Partial dry plating method - Google Patents
Partial dry plating methodInfo
- Publication number
- JPH01119660A JPH01119660A JP27551387A JP27551387A JPH01119660A JP H01119660 A JPH01119660 A JP H01119660A JP 27551387 A JP27551387 A JP 27551387A JP 27551387 A JP27551387 A JP 27551387A JP H01119660 A JPH01119660 A JP H01119660A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- color
- dry plating
- dry
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims description 28
- 239000000758 substrate Substances 0.000 claims abstract description 36
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 12
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 12
- 239000003086 colorant Substances 0.000 claims abstract description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000003960 organic solvent Substances 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 230000000873 masking effect Effects 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 238000004299 exfoliation Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 238000005406 washing Methods 0.000 description 11
- 239000010936 titanium Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 238000002845 discoloration Methods 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000013535 sea water Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 210000004243 sweat Anatomy 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
金属・合金又は種々の湿式メッキを被覆した金属・合金
の表面の選択的所定部分に乾式メッキ層を形成する方法
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of forming a dry plating layer on a selective predetermined portion of the surface of a metal/alloy or a metal/alloy coated with various wet platings.
本発明は、金属・合金又は種々の湿式メッキを被覆した
金属・合金からなる基板表面の選択的所定の部分に乾式
メッキを行う方法に於いて、予め所定の部分に有機系レ
ジストを塗付し焼成硬化後席クロムメッキ層又は黒ルテ
ニウムメッキ層を被覆し、その後に有機レジストを有機
溶剤により溶解除去し、基板色と湿式メッキ色の2色の
基板表面を形成し、しかる該表面後に乾式メッキ層を形
成し、ついで湿式メッキ被膜を剥離除去することにより
、選択的所定部分への乾式メッキ又は、基板色と乾式メ
ッキ色との2色を有する装飾的価値の高い部分を提供す
るところにある。The present invention is a method of selectively dry plating a predetermined portion of the surface of a substrate made of a metal/alloy or a metal/alloy coated with various wet plating, in which an organic resist is applied to the predetermined portion in advance. A chromium plating layer or a black ruthenium plating layer is coated after baking and hardening, and then the organic resist is dissolved and removed using an organic solvent to form a substrate surface in two colors, the substrate color and the wet plating color, and then dry plating is performed after the surface is coated. By forming a layer and then peeling off the wet plating film, it is possible to selectively dry plate a predetermined area or to provide an area with high decorative value having two colors, the substrate color and the dry plating color. .
従来の選択的所定部分の乾式メッキ法は、■基板全面に
乾式メッキ層を形成した後、乾式メッキ眉不要部分を機
械的に除去する方法。The conventional dry plating method for selectively predetermined areas is: (1) After forming a dry plating layer on the entire surface of the board, the unnecessary areas of the dry plating are mechanically removed.
■基板全面に乾式メッキ層を形成した後、乾式メッキ層
を必要とする部分に有機質レジストを塗付し焼成硬化後
、不要部分の乾式メッキ層を化学的に溶解除去した後、
レジストを溶解除去する方法。■After forming a dry plating layer on the entire surface of the board, apply an organic resist to the areas that require a dry plating layer, and after curing by baking, chemically dissolve and remove the dry plating layer in unnecessary areas.
How to dissolve and remove resist.
■基板表面の乾式メッキネ要部分に予め無機系耐熱塗料
を塗付し焼成硬化した後、乾式メッキ層を形成させ、そ
の後無機系耐熱塗料を溶剤により溶解除去する方法。■A method in which an inorganic heat-resistant paint is applied in advance to the important parts of the board surface for dry plating, baked and hardened, a dry plating layer is formed, and then the inorganic heat-resistant paint is dissolved and removed using a solvent.
■公開特許公報昭61−117269の如く、基板全面
にニッケルメッキ又は銅メッキ又はその合金のメッキ層
を形成した後、乾式メッキネ要部分に有機質レジストを
塗付し焼成硬化後メッキ層を溶解除去し、その後有機質
レジストを溶解除去し、ついで乾式メッキ層を形成させ
た後、メッキ層を溶解除去する方法などが知られている
。■As shown in Japanese Patent Publication No. 61-117269, after forming a plating layer of nickel plating, copper plating, or an alloy thereof on the entire surface of the board, applying an organic resist to the important parts of the dry plating method and dissolving and removing the plating layer after baking and hardening. There is a known method in which the organic resist is then dissolved and removed, a dry plating layer is formed, and then the plating layer is dissolved and removed.
しかしこれらの方法には下記の欠点がある。 However, these methods have the following drawbacks.
■の方法では残しておきたい乾式メッキ層を傷めずに不
要部分を除去することは量産上非常に困難であり、基板
表面形状が複雑になれば更に困難度を増す。又、基板表
面に種々の湿式メッキ層を形成した後に行う場合は、機
械加工により該湿式メッキ層の厚み減少が発生しメッキ
厚み保証ができない等の問題がある。With method (2), it is extremely difficult to remove unnecessary parts without damaging the dry plating layer that should be left in place in terms of mass production, and this becomes even more difficult as the surface shape of the substrate becomes more complex. Furthermore, if this is carried out after various wet plating layers have been formed on the surface of the substrate, there is a problem that the thickness of the wet plating layer decreases due to machining, making it impossible to guarantee the plating thickness.
■の方法では残しておきたい乾式メッキ層の面積が小さ
いほど有利であるが、小さくなればなるほどレジスト塗
付が困難であり、しかも基板表面とレジストとの密着性
が低下する。又、乾式メッキ層の剥離には弗酸系の薬品
を用いることが多く、乾式メッキ層の剥離除去の際にレ
ジスト膜下のオーバーエッチやレジスト膜の剥離が多発
する。In method (2), the smaller the area of the dry plating layer that is to be left, the more advantageous it is, but the smaller the area, the more difficult it is to apply the resist, and the adhesiveness between the substrate surface and the resist deteriorates. Furthermore, hydrofluoric acid-based chemicals are often used to remove the dry plating layer, which often causes overetching under the resist film and peeling of the resist film when removing the dry plating layer.
■の方法では乾式メッキ層の面積が大きいほど有利であ
るが、乾式メッキ時に発生する熱により、レジスト的に
内在するガスや、レジストの分解ガスにより乾式メッキ
層に干渉色や色ムラが発生する。又、レジスト膜のカケ
や剥離の発生も有り目的外観を損う。In method (2), the larger the area of the dry plating layer, the more advantageous it is, but due to the heat generated during dry plating, interference colors and color unevenness occur in the dry plating layer due to the gas inherent in the resist and the decomposition gas of the resist. . Additionally, the resist film may chip or peel, impairing the intended appearance.
■の方法ではレジスト塗付後のニッケルメッキ層等のメ
ッキ層剥離時にレジスト膜下へのオーバーエッチが発生
する。又、乾式メッキ時に発生する熱によりニッケル、
銅又はその合金が基板表面に熱拡散し、基板表面の変色
が発生する。又、乾式メッキ後のニッケルメッキ層等の
メッキ層剥離除去に長時間を要し作業効率が悪い。等の
問題があった。本発明はこのような問題点を解決するも
ので、選択的所定部分への乾式メッキ又は基板表面色と
乾式メッキ色との2色を有する装飾的価値の高い部分を
提供するところにある。In method (2), over-etching occurs under the resist film when a plating layer such as a nickel plating layer is peeled off after resist application. In addition, due to the heat generated during dry plating, nickel,
Copper or its alloy thermally diffuses onto the substrate surface, causing discoloration of the substrate surface. In addition, it takes a long time to peel off and remove a plating layer such as a nickel plating layer after dry plating, resulting in poor work efficiency. There were other problems. The present invention solves these problems by selectively performing dry plating on predetermined areas or by providing areas with high decorative value that have two colors: the substrate surface color and the dry plating color.
本発明は前項の問題点を解決するための部分乾式メッキ
法で、金属・合金又は種々の湿式メッキを被覆した金属
・合金からなる基板表面の選択的所定の部分に乾式メッ
キ層を形成する部分乾式メツニド法に於いて、予め所定
の部分に有機系レジストを塗付し焼成硬化後、黒クロム
メッキ又は黒ルテニウムメッキの湿式メッキ被膜を被覆
し、その後に有機系レジストを有機溶剤にて溶解除去し
、基板色と湿式メッキ色の基板表面を形成し、しかる後
に該表面に乾式メッキ層を形成し、次いで湿式メッキ被
膜を剥離除去することを特徴とする方法である。レジス
トは市販のオフセット用インキでも可能であるため、シ
ルク印刷、タコ印刷が可能であり複雑形状部の塗付も容
易に塗付することができる。The present invention is a partial dry plating method for solving the problems mentioned above, in which a dry plating layer is formed on selective predetermined portions of the surface of a substrate made of metals/alloys or metals/alloys coated with various wet platings. In the dry method, an organic resist is applied to a predetermined area in advance, and after hardening by baking, a wet plating film of black chrome plating or black ruthenium plating is applied, and then the organic resist is dissolved and removed using an organic solvent. This method is characterized by forming a substrate surface of a substrate color and a wet plating color, then forming a dry plating layer on the surface, and then peeling off the wet plating film. Since the resist can be made of commercially available offset ink, silk printing and tacho printing are possible, and complex-shaped parts can be easily coated.
本発明の上記方法によれば、乾式メッキ時の部分マスク
に黒クロムメッキ層又は黒ルテニウムメッキ層を用いた
ことにより、
■メッキ時の部分マスク用レジストは市販の耐酸性用で
可能である。According to the above method of the present invention, by using a black chrome plating layer or a black ruthenium plating layer as a partial mask during dry plating, (1) a commercially available acid-resistant resist can be used as the resist for the partial mask during plating.
■乾式メッキ時に発生する熱によるガス発生がなく乾式
メッキ色に干渉色を生じない。■There is no generation of gas due to the heat generated during dry plating, and there is no interference color in the dry plating color.
■黒クロムメッキ層及び黒ルテニウムメッキ層は、化学
的に安定であるため乾式メッキ時に発生する熱により基
板表面との熱拡散が起こらず、基板表面色の変色が発生
しない。■The black chrome plating layer and the black ruthenium plating layer are chemically stable, so the heat generated during dry plating does not cause heat diffusion to the substrate surface, and no discoloration of the substrate surface occurs.
■乾式メッキ後の黒クロムメッキ層又は黒ルテニウムメ
ッキ層の剥離除去は熱拡散層がないため容易である。■ Peeling and removal of the black chrome plating layer or black ruthenium plating layer after dry plating is easy because there is no heat diffusion layer.
以下本発明について実施例に基づいて説明する。The present invention will be explained below based on examples.
〔実施例1〕
第1図は本発明の部分乾式メッキ法による金色と灰黒色
からなる2色仕上げの時計ケース加ニレイアウドを示す
表面処理断面図であり、(a)〜(f)の各ステップ図
に基づいて説明する。[Example 1] Fig. 1 is a cross-sectional view of the surface treatment showing a watch case layout with a two-color finish of gold and gray-black by the partial dry plating method of the present invention, and each step of (a) to (f) is shown. This will be explained based on the diagram.
(a)SUS304からなる時計ケースに、23にのA
u−Ni合金メッキを被覆した。(a) In the watch case made of SUS304,
Coated with u-Ni alloy plating.
(b)Ti系の灰黒色イオンブレーティング層を形成し
たい部分に、シルク印刷を用いて有機系レジストを塗付
し焼成硬化した。(b) An organic resist was applied using silk printing to a portion where a Ti-based gray-black ion blating layer was to be formed, and baked and hardened.
(C)アルカリ脱脂→水洗→アルカリ洗浄→水洗→酸洗
浄→水洗→純水洗浄の順で一般的なメッキ前処理を行っ
た後、黒クロムメッキ1μを被覆した。(C) A general plating pretreatment was performed in the order of alkaline degreasing → water washing → alkaline cleaning → water washing → acid washing → water washing → pure water washing, and then a 1μ black chrome plating was applied.
(d)レジスト剥離液に浸漬してレジスト被膜を剥離し
、黒色と金色の2色からなる基板表面を得た。(d) The resist film was peeled off by immersion in a resist stripping solution to obtain a substrate surface having two colors, black and gold.
(e)有機溶剤による洗浄の後、イオンブレーティング
を行い、Ti系の灰黒色イオンブレーティング層を形成
した。(e) After cleaning with an organic solvent, ion blating was performed to form a Ti-based gray-black ion blating layer.
(f)工業用濃リン酸液中において、電圧5vで陽極電
界を行い、黒クロムメッキ層及び該層上に積層された灰
黒色イオンブレーティング層を完全に剥離除去した。こ
の際金色部に変色を生じたため(1+1)塩酸液中に浸
漬し変色を除去した。・この方法により処理した金色と
灰黒色からなる2色仕上げの時計ケースは、人工汗耐食
試験(40°C×湿度90%X24H’)、人工海水耐
食試験(40℃×湿度90%X24)I’)、折り曲げ
試験(90°折り曲げ)、熱シラツク試験(200°C
X10m1n加熱→水冷)、耐摩耗試験(2色境界部が
牛皮上に接触するようにセットし、500gの荷重をか
けて5cmストロークにて3万回擦りつける)、外観(
色調、2色境界線ビクツキ、ブルー色イオンブレーティ
ング部のピンホール)を行い、上記試験結果はすべて時
計ケースとしての品質を満足するものであった。上記方
法に於いて、イオンブレーティングの条件は、イオンブ
レーティングに先だちアルゴンガスを10Pa、基板へ
の印加電圧0.5Kvでイオンボンバードメントを行い
、基板表面のクリーニングを行い、ついでアルゴンガス
を排出し真空室内を3XIO−”Paに戻した後改めて
反応性ガスとして窒素ガスおよびアセチレンガスを1対
3の割合で2×10−’Paまで導入し基板電圧を0.
3Kv、5mA印加し、プラズマを発生させ金属チタン
をボード加熱方式で加熱蒸発させチタンと窒素および炭
素の化合物である灰黒色の硬質被膜を積層する方法によ
り被覆した。(f) An anodic electric field was applied at a voltage of 5 V in an industrial concentrated phosphoric acid solution to completely peel off and remove the black chromium plating layer and the gray-black ion blating layer laminated thereon. At this time, discoloration occurred in the golden portion, so the discoloration was removed by immersing it in (1+1) hydrochloric acid solution.・The watch case with a two-color finish consisting of gold and gray-black treated using this method has been tested in artificial sweat corrosion resistance test (40°C x 90% humidity x 24H') and artificial seawater corrosion resistance test (40°C x 90% humidity x 24H') I '), bending test (90° bending), thermal shock test (200°C
x10m1n heating → water cooling), abrasion resistance test (set so that the border between the two colors is in contact with the cowhide, apply a load of 500g, and rub 30,000 times with a 5cm stroke), appearance (
The above test results all satisfied the quality as a watch case. In the above method, the conditions for ion blating are that prior to ion blating, ion bombardment is performed with argon gas at 10 Pa and a voltage applied to the substrate of 0.5 Kv, the substrate surface is cleaned, and then the argon gas is exhausted. After returning the inside of the vacuum chamber to 3XIO-'Pa, nitrogen gas and acetylene gas were again introduced as reactive gases at a ratio of 1:3 to 2x10-'Pa, and the substrate voltage was reduced to 0.
3 Kv and 5 mA were applied to generate plasma, and metal titanium was heated and evaporated using a board heating method, and a gray-black hard coating made of a compound of titanium, nitrogen, and carbon was laminated.
〔実施例2〕
第2図は本発明の部分乾式メッキ法による白色とブルー
色からなる2色仕上げの加ニレイアウドを示す表面処理
断面図であり、(a)〜(f)の各ステップ図に基づい
て説明する。[Example 2] Figure 2 is a cross-sectional view of the surface treatment showing a two-color finish of white and blue using the partial dry plating method of the present invention. I will explain based on this.
(a)黄銅材料からなる時計ケースに電気メッキにより
ニッケルメッキ3μを施し、ついでパラジウム−ニッケ
ル合金メッキ3μmを施した。(a) A watch case made of brass material was electroplated with 3 μm of nickel plating, and then plated with a palladium-nickel alloy of 3 μm.
(b)Ti系のブルー色イオンブレーティング層を形成
したい部分に、タコ印刷を用いて有機系レジストを塗付
し焼成硬化した。(b) An organic resist was applied using tacho printing to a portion where a Ti-based blue ion blating layer was to be formed, and baked and hardened.
(C)アルカリ樹脂→水洗→アルカリ洗浄→水洗→酸洗
浄→水洗→純水洗浄の順で一般的なメッキ前処理を行っ
た後、黒ルテニウムメッキ0.5μを被覆した。(C) A general plating pretreatment was performed in the order of alkaline resin → water washing → alkaline washing → water washing → acid washing → water washing → pure water washing, and then a black ruthenium plating of 0.5μ was coated.
(d)レジスト剥離液に浸漬してレジスト被膜を剥離し
、黒色と白色の2色からなる基板表面を得た。(d) The resist film was peeled off by immersion in a resist stripping solution to obtain a substrate surface having two colors, black and white.
(e)有機溶剤による洗浄の後、イオンブレーティング
を行い、Ti系のブルー色イオンブレーティング層を形
成した。(e) After cleaning with an organic solvent, ion blating was performed to form a Ti-based blue ion blating layer.
(f)1%苛性ソーダ溶液中において、電圧6■で陽極
電解を行い、黒ルテニウムメッキ層及び該層上に積層さ
れたブルー色イオンブレーティング層を完全に剥離除去
した。この際、白色部に変色を生じたため(1+1)塩
酸液中に浸漬し変色を除去した。この方法により処理し
た白色とブルー色からなる2色仕上げの時計ケースは、
〔実施例1〕と同様の人工汗耐食試験、人工海水耐食試
験、折り曲げ試験、熱シヨツク試験、耐摩耗性試験、外
観を行った結果、時計ケースとしての品質を満足するも
のであった。上記方法に於いて、イオンブレーティング
の条件は、〔実施例1〕と同様にイオンボンバードメン
トを行った後、反応性ガスとして酸素ガスを2X10−
’Paまで導入し、基板電圧を0.3Kv印加し、プラ
ズマを発生させ金属チタンをボード加熱方式で加熱蒸発
させチタンと酸素の化合物であるブルー色の硬質被膜を
積層する方法により被覆した。(f) Anodic electrolysis was carried out at a voltage of 6 cm in a 1% caustic soda solution to completely peel off and remove the black ruthenium plating layer and the blue ion blating layer laminated thereon. At this time, since discoloration occurred in the white part, the discoloration was removed by immersing it in (1+1) hydrochloric acid solution. The watch case has a two-color finish of white and blue treated using this method.
The same artificial sweat corrosion resistance test, artificial seawater corrosion resistance test, bending test, heat shock test, abrasion resistance test, and appearance as in [Example 1] were conducted, and the results showed that the quality as a watch case was satisfied. In the above method, the conditions for ion blasting are as follows: After performing ion bombardment in the same manner as in [Example 1], oxygen gas is added as a reactive gas at 2×10 −
'Pa, a substrate voltage of 0.3 Kv was applied, plasma was generated, metallic titanium was heated and evaporated by a board heating method, and a blue hard coating made of a compound of titanium and oxygen was laminated.
以上述べたように本発明によれば、金属・合金又は種々
の湿式メッキを被覆した金属又は合金からなる基板表面
の選択的所定部分への乾式メッキ法に於いて、予め所定
の部分に有機系レジストを塗付し焼成硬化後、黒クロム
メッキ又は黒ルテニウムメッキを被覆し、その後に有機
系レジストを有機溶剤にて溶解除去し、基板色と湿式メ
ッキ色の基板表面を形成し、しかる後に該表面に乾式メ
ッキ層を形成し、ついで湿式メッキ被膜を剥離除去する
ことにより、従来のレジスト膜下のオーバーエッチやレ
ジスト膜の剥離、又は乾式メッキ時に発生する熱による
乾式メッキ層の干渉色の発生や基板表面とマスキング用
メッキ被膜との熱拡散による基板表面の変色等の欠点を
克服し、選択的所定部分への乾式メッキ又は基板表面色
と乾式メッキ色との2色を有する装飾的価値の高い部品
を安価に提供することが可能となる効果を有する。As described above, according to the present invention, in the dry plating method on selective predetermined portions of the surface of a substrate made of a metal/alloy or a metal or alloy coated with various wet plating, organic After applying the resist and curing it by baking, cover with black chrome plating or black ruthenium plating, and then dissolve and remove the organic resist with an organic solvent to form a substrate surface of the substrate color and wet plating color. By forming a dry plating layer on the surface and then peeling off the wet plating film, it is possible to prevent overetching under the conventional resist film, peeling of the resist film, or interference color of the dry plating layer due to the heat generated during dry plating. It overcomes disadvantages such as discoloration of the substrate surface due to heat diffusion between the substrate surface and the masking plating film, and enables selective dry plating on predetermined areas or decorative value having two colors, the substrate surface color and the dry plating color. This has the effect of making it possible to provide expensive parts at low cost.
適用に当っては時計ケースのみならず、メガネフレーム
、ライター、装飾バンド用バックル、ネクタイピン等の
装飾部品にて適用可能である。It can be applied not only to watch cases, but also to decorative parts such as eyeglass frames, lighters, buckles for decorative bands, and tie clips.
第1図(a) 〜(f)、第2図(a) 〜(f)は本
発明による部分乾式メッキ法の実施例の加ニレイアウド
を示す表面処理断面図である。
1・・・ステンレス(SUS304)素材2・・・Au
−Ni合金メッキ層
3・・・有機系レジスト
4・・・黒クロムメッキ層
5・・・Ti系灰黒色イオンブレーティング層6・・・
黄銅素材
7・・・ニッケルメッキ層+パラジウムーニッケル合金
メッキ層
8・・・Ti系ブルー色イオンブレーティング暦9・・
・黒ルテニウムメッキ層
以上
出願人 セイコーエプソン株式会社
代理人弁理士 最上 霧−他1名
−9・2zノ
y、:jFIGS. 1(a) to (f) and FIGS. 2(a) to 2(f) are surface treatment cross-sectional views showing an embodiment of the partial dry plating method according to the present invention. 1... Stainless steel (SUS304) material 2... Au
-Ni alloy plating layer 3...Organic resist 4...Black chromium plating layer 5...Ti-based gray-black ion blating layer 6...
Brass material 7...Nickel plating layer + palladium-nickel alloy plating layer 8...Ti-based blue ion brating calendar 9...
・Applicant for black ruthenium plating layer and above Seiko Epson Co., Ltd. Representative Patent Attorney Kiri Mogami - 1 other person - 9.2znoy, :j
Claims (1)
又は合金からなる基板表面の選択的所定の部分に乾式メ
ッキ層を形成する部分乾式メッキ法に於いて、予め所定
の部分に有機系レジストを塗付し焼成硬化後、黒クロム
メッキ又は黒ルテニウムメッキを被覆し、その後に有機
系レジストを有機溶剤により溶解除去し、基板色と湿式
メッキ色の2色の基板表面を形成し、しかる後該表面に
乾式メッキ層を形成し、次いで湿式メッキ被膜を剥離除
去することを特徴とする部分乾式メッキ法。(1) In the partial dry plating method in which a dry plating layer is selectively formed on a predetermined portion of the surface of a substrate made of a metal or alloy coated with a metal or alloy or various types of wet plating, an organic resist is applied to a predetermined portion in advance. After baking and curing, black chrome plating or black ruthenium plating is applied, and the organic resist is then dissolved and removed using an organic solvent to form a substrate surface with two colors: the substrate color and the wet plating color. A partial dry plating method characterized by forming a dry plating layer on the surface and then peeling and removing the wet plating film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27551387A JPH01119660A (en) | 1987-10-30 | 1987-10-30 | Partial dry plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27551387A JPH01119660A (en) | 1987-10-30 | 1987-10-30 | Partial dry plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01119660A true JPH01119660A (en) | 1989-05-11 |
Family
ID=17556522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27551387A Pending JPH01119660A (en) | 1987-10-30 | 1987-10-30 | Partial dry plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01119660A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03281786A (en) * | 1990-03-29 | 1991-12-12 | Kowa Eng Kk | Ornament with multicolored pattern film |
JPH0428885A (en) * | 1990-05-24 | 1992-01-31 | Kowa Eng Kk | Ornament with multicolor pattern film |
US8211286B2 (en) | 2007-03-28 | 2012-07-03 | Umicore Galvotechnik GmbH | Electrolyte and method for depositing decorative and technical layers of black ruthenium |
-
1987
- 1987-10-30 JP JP27551387A patent/JPH01119660A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03281786A (en) * | 1990-03-29 | 1991-12-12 | Kowa Eng Kk | Ornament with multicolored pattern film |
JPH0428885A (en) * | 1990-05-24 | 1992-01-31 | Kowa Eng Kk | Ornament with multicolor pattern film |
US8211286B2 (en) | 2007-03-28 | 2012-07-03 | Umicore Galvotechnik GmbH | Electrolyte and method for depositing decorative and technical layers of black ruthenium |
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