JPH01119056U - - Google Patents
Info
- Publication number
- JPH01119056U JPH01119056U JP1464088U JP1464088U JPH01119056U JP H01119056 U JPH01119056 U JP H01119056U JP 1464088 U JP1464088 U JP 1464088U JP 1464088 U JP1464088 U JP 1464088U JP H01119056 U JPH01119056 U JP H01119056U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film thickness
- thickness distribution
- locus
- diagram showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は、本発明実施例による補償板の形状を
示す説明図、第２図は、基板電極回転型のスパツ
タ装置を示す説明図、第３図は、従来の補償板の
形状を示す説明図、第４図は、補償板の有無によ
る膜厚の分布を示すグラフ、第５図は、基板にス
パツタ絶縁層を形成した実施例を示す断面図、第
６図は、ターゲツトの真上の基板上の膜厚分布を
示す図、第７図は、ターゲツトの真上にある基板
上の軌跡を示す説明図である。
１……基板電極、２……ターゲツト、３……遮
蔽板、４……基板、５……台形状の補償板、６…
…極薄膜、７……スパツタ膜、８……レジスト、
９……ターゲツトの真上にある基板上の位置、１
０，１１……基板上の各点の軌跡、１２……本発
明実施例による形状の補償板、１３……基板中心
部の軌跡。
FIG. 1 is an explanatory diagram showing the shape of a compensating plate according to an embodiment of the present invention, FIG. 2 is an explanatory diagram showing a substrate electrode rotating type sputtering device, and FIG. 3 is an explanatory diagram showing the shape of a conventional compensating plate. 4 is a graph showing the distribution of film thickness depending on the presence or absence of a compensator, FIG. 5 is a cross-sectional view showing an example in which a sputtered insulating layer is formed on a substrate, and FIG. FIG. 7, which is a diagram showing the film thickness distribution on the substrate, is an explanatory diagram showing the locus on the substrate directly above the target. DESCRIPTION OF SYMBOLS 1... Substrate electrode, 2... Target, 3... Shielding plate, 4... Substrate, 5... Trapezoidal compensation plate, 6...
...Ultra-thin film, 7...Spatter film, 8...Resist,
9...Position on the board directly above the target, 1
0, 11... Locus of each point on the substrate, 12... Compensation plate shaped according to the embodiment of the present invention, 13... Locus of the center of the substrate.
Claims (1)
の膜厚分布を均一に保持するため、回転による基
板中心部の軌跡付近の補償板縁部が、外側に湾曲
して膨らんだ形状を有する、スパツタ装置の膜厚
分布補償板。 In order to maintain a uniform film thickness distribution on the substrate in a substrate electrode rotating type sputtering device, the edge of the compensating plate near the locus of the center of the substrate due to rotation has an outwardly curved shape. Film thickness distribution compensation plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1464088U JPH01119056U (en) | 1988-02-08 | 1988-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1464088U JPH01119056U (en) | 1988-02-08 | 1988-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01119056U true JPH01119056U (en) | 1989-08-11 |
Family
ID=31226022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1464088U Pending JPH01119056U (en) | 1988-02-08 | 1988-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01119056U (en) |
-
1988
- 1988-02-08 JP JP1464088U patent/JPH01119056U/ja active Pending
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