JPH01118497U - - Google Patents
Info
- Publication number
- JPH01118497U JPH01118497U JP1326988U JP1326988U JPH01118497U JP H01118497 U JPH01118497 U JP H01118497U JP 1326988 U JP1326988 U JP 1326988U JP 1326988 U JP1326988 U JP 1326988U JP H01118497 U JPH01118497 U JP H01118497U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- radiating element
- dissipating body
- heat generating
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 11
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988013269U JPH0617354Y2 (ja) | 1988-02-03 | 1988-02-03 | 発熱素子の取付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988013269U JPH0617354Y2 (ja) | 1988-02-03 | 1988-02-03 | 発熱素子の取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01118497U true JPH01118497U (ko) | 1989-08-10 |
JPH0617354Y2 JPH0617354Y2 (ja) | 1994-05-02 |
Family
ID=31223432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988013269U Expired - Lifetime JPH0617354Y2 (ja) | 1988-02-03 | 1988-02-03 | 発熱素子の取付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0617354Y2 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05206688A (ja) * | 1992-01-24 | 1993-08-13 | Toshiba Corp | 半導体装置とその面実装方法 |
WO2015198770A1 (ja) * | 2014-06-25 | 2015-12-30 | 株式会社村田製作所 | 電子機器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53139277U (ko) * | 1977-04-08 | 1978-11-04 | ||
JPS59119039U (ja) * | 1983-01-31 | 1984-08-11 | 田淵電機株式会社 | 半導体装置の放熱構造体 |
-
1988
- 1988-02-03 JP JP1988013269U patent/JPH0617354Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53139277U (ko) * | 1977-04-08 | 1978-11-04 | ||
JPS59119039U (ja) * | 1983-01-31 | 1984-08-11 | 田淵電機株式会社 | 半導体装置の放熱構造体 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05206688A (ja) * | 1992-01-24 | 1993-08-13 | Toshiba Corp | 半導体装置とその面実装方法 |
WO2015198770A1 (ja) * | 2014-06-25 | 2015-12-30 | 株式会社村田製作所 | 電子機器 |
Also Published As
Publication number | Publication date |
---|---|
JPH0617354Y2 (ja) | 1994-05-02 |