JPH01115267U - - Google Patents

Info

Publication number
JPH01115267U
JPH01115267U JP931188U JP931188U JPH01115267U JP H01115267 U JPH01115267 U JP H01115267U JP 931188 U JP931188 U JP 931188U JP 931188 U JP931188 U JP 931188U JP H01115267 U JPH01115267 U JP H01115267U
Authority
JP
Japan
Prior art keywords
sides
conductive filler
film
circuits
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP931188U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP931188U priority Critical patent/JPH01115267U/ja
Publication of JPH01115267U publication Critical patent/JPH01115267U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例の断面構造を示す図、第
２図は本考案の他の実施例の断面構造を示す図、
第３図は従来例の断面構造を示す図である。 １……フイルム基材、２……導電性フイラー、
３，６……表面回路、４……裏面回路、５，８…
…接続部分、７……レジスト層。

Claims (1)

    【実用新案登録請求の範囲】
  1. フイルム基板の両面に印刷回路を有する両面フ
    イルム回路基板において、導電性フイラーが混入
    されたフイルム基材の両面の回路間の接続が上記
    導電性フイラーを介して形成されてなる両面フイ
    ルム回路基板。
JP931188U 1988-01-27 1988-01-27 Pending JPH01115267U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP931188U JPH01115267U (ja) 1988-01-27 1988-01-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP931188U JPH01115267U (ja) 1988-01-27 1988-01-27

Publications (1)

Publication Number Publication Date
JPH01115267U true JPH01115267U (ja) 1989-08-03

Family

ID=31215946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP931188U Pending JPH01115267U (ja) 1988-01-27 1988-01-27

Country Status (1)

Country Link
JP (1) JPH01115267U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5759398A (en) * 1980-09-26 1982-04-09 Hitachi Chemical Co Ltd Method of welding and conducting flexible printed circuit board
JPS59117291A (ja) * 1982-12-24 1984-07-06 株式会社精工舎 回路基板
JPS61222197A (ja) * 1985-03-20 1986-10-02 シャープ株式会社 両面印刷配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5759398A (en) * 1980-09-26 1982-04-09 Hitachi Chemical Co Ltd Method of welding and conducting flexible printed circuit board
JPS59117291A (ja) * 1982-12-24 1984-07-06 株式会社精工舎 回路基板
JPS61222197A (ja) * 1985-03-20 1986-10-02 シャープ株式会社 両面印刷配線板の製造方法

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