JPH01115171U - - Google Patents

Info

Publication number

JPH01115171U

JPH01115171U JP19759187U JP19759187U JPH01115171U JP H01115171 U JPH01115171 U JP H01115171U JP 19759187 U JP19759187 U JP 19759187U JP 19759187 U JP19759187 U JP 19759187U JP H01115171 U JPH01115171 U JP H01115171U

Authority

JP

Japan

Prior art keywords

terminal

wiring board

connection structure

copper foil

hole

Prior art date

1987-12-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
• 239000011889 copper foil Substances 0.000 claims description 3
• 229910000679 solder Inorganic materials 0.000 description 3
• 238000010586 diagram Methods 0.000 description 1

Cited By (2)