JPH01113339U - - Google Patents
Info
- Publication number
- JPH01113339U JPH01113339U JP1988008512U JP851288U JPH01113339U JP H01113339 U JPH01113339 U JP H01113339U JP 1988008512 U JP1988008512 U JP 1988008512U JP 851288 U JP851288 U JP 851288U JP H01113339 U JPH01113339 U JP H01113339U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- evaluation
- bonding pad
- edge
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W72/932—
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988008512U JPH01113339U (enExample) | 1988-01-26 | 1988-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988008512U JPH01113339U (enExample) | 1988-01-26 | 1988-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113339U true JPH01113339U (enExample) | 1989-07-31 |
Family
ID=31214453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988008512U Pending JPH01113339U (enExample) | 1988-01-26 | 1988-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113339U (enExample) |
-
1988
- 1988-01-26 JP JP1988008512U patent/JPH01113339U/ja active Pending