JPH01110495U - - Google Patents
Info
- Publication number
- JPH01110495U JPH01110495U JP514888U JP514888U JPH01110495U JP H01110495 U JPH01110495 U JP H01110495U JP 514888 U JP514888 U JP 514888U JP 514888 U JP514888 U JP 514888U JP H01110495 U JPH01110495 U JP H01110495U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- conductor pattern
- printed wiring
- wiring board
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP514888U JPH0617331Y2 (ja) | 1988-01-19 | 1988-01-19 | 金属基板を用いたプリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP514888U JPH0617331Y2 (ja) | 1988-01-19 | 1988-01-19 | 金属基板を用いたプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01110495U true JPH01110495U (fi) | 1989-07-26 |
| JPH0617331Y2 JPH0617331Y2 (ja) | 1994-05-02 |
Family
ID=31208269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP514888U Expired - Lifetime JPH0617331Y2 (ja) | 1988-01-19 | 1988-01-19 | 金属基板を用いたプリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617331Y2 (fi) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03201498A (ja) * | 1989-12-28 | 1991-09-03 | Matsushita Electric Ind Co Ltd | 金属基板の層間接続方法 |
-
1988
- 1988-01-19 JP JP514888U patent/JPH0617331Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03201498A (ja) * | 1989-12-28 | 1991-09-03 | Matsushita Electric Ind Co Ltd | 金属基板の層間接続方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0617331Y2 (ja) | 1994-05-02 |