JPH01110446U - - Google Patents
Info
- Publication number
- JPH01110446U JPH01110446U JP552988U JP552988U JPH01110446U JP H01110446 U JPH01110446 U JP H01110446U JP 552988 U JP552988 U JP 552988U JP 552988 U JP552988 U JP 552988U JP H01110446 U JPH01110446 U JP H01110446U
- Authority
- JP
- Japan
- Prior art keywords
- resin package
- lead frame
- integrated circuit
- periphery
- tie bars
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP552988U JPH01110446U (ko) | 1988-01-20 | 1988-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP552988U JPH01110446U (ko) | 1988-01-20 | 1988-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01110446U true JPH01110446U (ko) | 1989-07-26 |
Family
ID=31208981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP552988U Pending JPH01110446U (ko) | 1988-01-20 | 1988-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01110446U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017060970A1 (ja) * | 2015-10-06 | 2017-04-13 | 三菱電機株式会社 | 半導体装置の製造方法 |
-
1988
- 1988-01-20 JP JP552988U patent/JPH01110446U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017060970A1 (ja) * | 2015-10-06 | 2017-04-13 | 三菱電機株式会社 | 半導体装置の製造方法 |
| CN108140583A (zh) * | 2015-10-06 | 2018-06-08 | 三菱电机株式会社 | 半导体装置的制造方法 |
| US10490422B2 (en) | 2015-10-06 | 2019-11-26 | Mitsubishi Electric Corporation | Manufacturing method for semiconductor device |
| CN108140583B (zh) * | 2015-10-06 | 2021-06-11 | 三菱电机株式会社 | 半导体装置的制造方法 |