JPH0110935Y2 - - Google Patents
Info
- Publication number
- JPH0110935Y2 JPH0110935Y2 JP1987162126U JP16212687U JPH0110935Y2 JP H0110935 Y2 JPH0110935 Y2 JP H0110935Y2 JP 1987162126 U JP1987162126 U JP 1987162126U JP 16212687 U JP16212687 U JP 16212687U JP H0110935 Y2 JPH0110935 Y2 JP H0110935Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- heat
- base
- fins
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 25
- 238000005219 brazing Methods 0.000 claims description 7
- 238000004512 die casting Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162126U JPH0110935Y2 (US20110009641A1-20110113-C00185.png) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162126U JPH0110935Y2 (US20110009641A1-20110113-C00185.png) | 1987-10-23 | 1987-10-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63112350U JPS63112350U (US20110009641A1-20110113-C00185.png) | 1988-07-19 |
| JPH0110935Y2 true JPH0110935Y2 (US20110009641A1-20110113-C00185.png) | 1989-03-29 |
Family
ID=31089089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162126U Expired JPH0110935Y2 (US20110009641A1-20110113-C00185.png) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0110935Y2 (US20110009641A1-20110113-C00185.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5262473B2 (ja) * | 2008-09-09 | 2013-08-14 | 富士通株式会社 | 電子機器及びそのコンポーネント |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56141461U (US20110009641A1-20110113-C00185.png) * | 1980-03-25 | 1981-10-26 |
-
1987
- 1987-10-23 JP JP1987162126U patent/JPH0110935Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63112350U (US20110009641A1-20110113-C00185.png) | 1988-07-19 |
