JPH01108940U - - Google Patents
Info
- Publication number
- JPH01108940U JPH01108940U JP271088U JP271088U JPH01108940U JP H01108940 U JPH01108940 U JP H01108940U JP 271088 U JP271088 U JP 271088U JP 271088 U JP271088 U JP 271088U JP H01108940 U JPH01108940 U JP H01108940U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chip
- utility
- sealed
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP271088U JPH01108940U (sh) | 1988-01-13 | 1988-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP271088U JPH01108940U (sh) | 1988-01-13 | 1988-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01108940U true JPH01108940U (sh) | 1989-07-24 |
Family
ID=31203715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP271088U Pending JPH01108940U (sh) | 1988-01-13 | 1988-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01108940U (sh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100467897B1 (ko) * | 1996-12-24 | 2005-01-24 | 닛토덴코 가부시키가이샤 | 반도체 장치 및 이의 제조방법 |
-
1988
- 1988-01-13 JP JP271088U patent/JPH01108940U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100467897B1 (ko) * | 1996-12-24 | 2005-01-24 | 닛토덴코 가부시키가이샤 | 반도체 장치 및 이의 제조방법 |
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