JPH01107168U - - Google Patents
Info
- Publication number
- JPH01107168U JPH01107168U JP182288U JP182288U JPH01107168U JP H01107168 U JPH01107168 U JP H01107168U JP 182288 U JP182288 U JP 182288U JP 182288 U JP182288 U JP 182288U JP H01107168 U JPH01107168 U JP H01107168U
- Authority
- JP
- Japan
- Prior art keywords
- motherboard
- flexible board
- circuit
- board
- connection lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP182288U JPH01107168U (enExample) | 1988-01-11 | 1988-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP182288U JPH01107168U (enExample) | 1988-01-11 | 1988-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107168U true JPH01107168U (enExample) | 1989-07-19 |
Family
ID=31202045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP182288U Pending JPH01107168U (enExample) | 1988-01-11 | 1988-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107168U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010287630A (ja) * | 2009-06-09 | 2010-12-24 | Sharp Corp | フィルムパッケージ、電子部品実装基板、および電子部品の実装方法 |
-
1988
- 1988-01-11 JP JP182288U patent/JPH01107168U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010287630A (ja) * | 2009-06-09 | 2010-12-24 | Sharp Corp | フィルムパッケージ、電子部品実装基板、および電子部品の実装方法 |