JPH01107164U - - Google Patents
Info
- Publication number
- JPH01107164U JPH01107164U JP92688U JP92688U JPH01107164U JP H01107164 U JPH01107164 U JP H01107164U JP 92688 U JP92688 U JP 92688U JP 92688 U JP92688 U JP 92688U JP H01107164 U JPH01107164 U JP H01107164U
- Authority
- JP
- Japan
- Prior art keywords
- bridge part
- base
- circuit board
- printed circuit
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係るプリント基板の分割前で
示す部分平面図、第２図は同基板の分割後で示す
部分平面図、第３，４図は従来例に係るプリント
基板の分割前で示す部分平面図、第５，６図は同
基板の分割後で示す部分平面図である。
１ａ，１ｂ：プリント基板（１ａ：部品実装基
板側、１ｂ：捨て代基板側）、２ａ，２ｂ…：複
数個連続的に設ける割り穴、３ａ，３ｂ…：橋絡
部、４ａ，４ｂ…：部品実装面に掛けて設ける割
り穴、５ａ，５ｂ…：付け根部分。
Figure 1 is a partial plan view of the printed circuit board according to the present invention before division, Figure 2 is a partial plan view of the same circuit board after division, and Figures 3 and 4 are the conventional printed circuit board before division. FIGS. 5 and 6 are partial plan views showing the same substrate after it has been divided. 1a, 1b: Printed circuit board (1a: component mounting board side, 1b: sacrificial board side), 2a, 2b...: Plural continuous split holes, 3a, 3b...: Bridge section, 4a, 4b...: Split holes provided over the component mounting surface, 5a, 5b...: Root portions.
Claims (1)
加え、橋絡部の付け根面付近で部品実装面に掛る
割り穴を設け、これら割り穴で橋絡部の付け根部
分を大きく残存せずに分割成形してなることを特
徴とするプリント基板。 In addition to the continuous split holes that separate the bridge part, we also provide a split hole that hangs over the component mounting surface near the base of the bridge part, so that the base part of the bridge part does not remain large. A printed circuit board characterized by being molded into parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP92688U JPH01107164U (en) | 1988-01-08 | 1988-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP92688U JPH01107164U (en) | 1988-01-08 | 1988-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107164U true JPH01107164U (en) | 1989-07-19 |
Family
ID=31200366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP92688U Pending JPH01107164U (en) | 1988-01-08 | 1988-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107164U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5634363B2 (en) * | 1972-05-26 | 1981-08-10 | ||
| JPS6357765B2 (en) * | 1981-05-31 | 1988-11-14 | Tohoku Riko Kk |
-
1988
- 1988-01-08 JP JP92688U patent/JPH01107164U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5634363B2 (en) * | 1972-05-26 | 1981-08-10 | ||
| JPS6357765B2 (en) * | 1981-05-31 | 1988-11-14 | Tohoku Riko Kk |