JPH01107148U - - Google Patents

Info

Publication number
JPH01107148U
JPH01107148U JP1988000883U JP88388U JPH01107148U JP H01107148 U JPH01107148 U JP H01107148U JP 1988000883 U JP1988000883 U JP 1988000883U JP 88388 U JP88388 U JP 88388U JP H01107148 U JPH01107148 U JP H01107148U
Authority
JP
Japan
Prior art keywords
integrated circuit
conductive plate
cooling pipe
heat conductive
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988000883U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0543482Y2 (
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988000883U priority Critical patent/JPH0543482Y2/ja
Publication of JPH01107148U publication Critical patent/JPH01107148U/ja
Application granted granted Critical
Publication of JPH0543482Y2 publication Critical patent/JPH0543482Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988000883U 1988-01-08 1988-01-08 Expired - Lifetime JPH0543482Y2 ( )

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988000883U JPH0543482Y2 ( ) 1988-01-08 1988-01-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988000883U JPH0543482Y2 ( ) 1988-01-08 1988-01-08

Publications (2)

Publication Number Publication Date
JPH01107148U true JPH01107148U ( ) 1989-07-19
JPH0543482Y2 JPH0543482Y2 ( ) 1993-11-02

Family

ID=31200286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988000883U Expired - Lifetime JPH0543482Y2 ( ) 1988-01-08 1988-01-08

Country Status (1)

Country Link
JP (1) JPH0543482Y2 ( )

Also Published As

Publication number Publication date
JPH0543482Y2 ( ) 1993-11-02

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