JPH01107129U - - Google Patents

Info

Publication number
JPH01107129U
JPH01107129U JP1988001579U JP157988U JPH01107129U JP H01107129 U JPH01107129 U JP H01107129U JP 1988001579 U JP1988001579 U JP 1988001579U JP 157988 U JP157988 U JP 157988U JP H01107129 U JPH01107129 U JP H01107129U
Authority
JP
Japan
Prior art keywords
cleaning brush
substrate surface
rotating
cleaning
descended
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988001579U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988001579U priority Critical patent/JPH01107129U/ja
Priority to KR1019890000131A priority patent/KR920010691B1/ko
Publication of JPH01107129U publication Critical patent/JPH01107129U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0402Apparatus for fluid treatment
    • H10P72/0406Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP1988001579U 1988-01-08 1988-01-08 Pending JPH01107129U (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988001579U JPH01107129U (enExample) 1988-01-08 1988-01-08
KR1019890000131A KR920010691B1 (ko) 1988-01-08 1989-01-07 접촉완충장치 부착 세정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988001579U JPH01107129U (enExample) 1988-01-08 1988-01-08

Publications (1)

Publication Number Publication Date
JPH01107129U true JPH01107129U (enExample) 1989-07-19

Family

ID=11505425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988001579U Pending JPH01107129U (enExample) 1988-01-08 1988-01-08

Country Status (2)

Country Link
JP (1) JPH01107129U (enExample)
KR (1) KR920010691B1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0352228A (ja) * 1989-07-20 1991-03-06 Tokyo Electron Ltd 洗浄装置
JPH07323266A (ja) * 1994-05-31 1995-12-12 Nisshin Steel Co Ltd 金属帯表面の付着塵埃の吸引除去方法および装置
JPH08141518A (ja) * 1994-09-20 1996-06-04 Dainippon Screen Mfg Co Ltd 回転式基板洗浄装置
JP2021019130A (ja) * 2019-07-22 2021-02-15 株式会社荏原製作所 基板洗浄装置および基板洗浄方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100403517B1 (ko) * 2000-12-29 2003-10-30 (주)케이.씨.텍 웨이퍼 세정 장치
CN111002164B (zh) * 2019-12-09 2020-11-17 国网智能科技股份有限公司 一种变电站触头打磨机构、打磨机器人、系统及方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0352228A (ja) * 1989-07-20 1991-03-06 Tokyo Electron Ltd 洗浄装置
JPH07323266A (ja) * 1994-05-31 1995-12-12 Nisshin Steel Co Ltd 金属帯表面の付着塵埃の吸引除去方法および装置
JPH08141518A (ja) * 1994-09-20 1996-06-04 Dainippon Screen Mfg Co Ltd 回転式基板洗浄装置
JP2021019130A (ja) * 2019-07-22 2021-02-15 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
TWI848150B (zh) * 2019-07-22 2024-07-11 日商荏原製作所股份有限公司 基板清洗裝置及基板清洗方法

Also Published As

Publication number Publication date
KR920010691B1 (ko) 1992-12-12
KR890012358A (ko) 1989-08-26

Similar Documents

Publication Publication Date Title
JPH01107129U (enExample)
JPH0193736U (enExample)
JPS58126758U (ja) 車両用シ−ト
JPS62186427U (enExample)
JPS6367529U (enExample)
JPS62150083U (enExample)
JPS63127867U (enExample)
JPS6341341U (enExample)
JPH03107551U (enExample)
JPS6412013U (enExample)
JPH0165223U (enExample)
JPS6343427U (enExample)
JPS61165904U (enExample)
JPS6295843U (enExample)
JPS63118789U (enExample)
JPS61144548U (enExample)
JPH0160713U (enExample)
JPS62123837U (enExample)
JPS62138444U (enExample)
JPH01141010U (enExample)
JPH0333149U (enExample)
JPH0161871U (enExample)
JPH0371632U (enExample)
JPS6279748U (enExample)
JPH0243826U (enExample)