JPH01105524A - Electronic parts with fuse - Google Patents
Electronic parts with fuseInfo
- Publication number
- JPH01105524A JPH01105524A JP26078687A JP26078687A JPH01105524A JP H01105524 A JPH01105524 A JP H01105524A JP 26078687 A JP26078687 A JP 26078687A JP 26078687 A JP26078687 A JP 26078687A JP H01105524 A JPH01105524 A JP H01105524A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- terminal
- frame part
- window frame
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 abstract description 16
- 239000011347 resin Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 230000004927 fusion Effects 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000218691 Cupressaceae Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Landscapes
- Fuses (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、民生用および産業用電子機器用に使用される
小型のヒユーズ内蔵型電子部品に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a small electronic component with a built-in fuse used for consumer and industrial electronic equipment.
(従来の技術) 最近、タンタル固体電解コンデン°すは、小型。(Conventional technology) Recently, tantalum solid electrolytic capacitors are becoming smaller.
大容量であるという特徴を有しており、最近の電子機器
の小型化の動向には適したコンデンサであり、最近は菊
にチップタイプの需要が旺盛で、民生機器は勿論、自動
車、コンピュータへと需要は拡大している。This capacitor is characterized by its large capacity and is suitable for the recent trend of miniaturization of electronic devices.Recently, there is a strong demand for chip type capacitors, which are used not only in consumer devices but also in automobiles and computers. And demand is expanding.
従来のヒユーズ内蔵型の固体電解コンデンサは、第5図
に示すように、−船釣な方法で作られたコンデンサ素子
21の陽極導出線22を、溶接などの手段により陽極端
子23に接続し、一方、コンデンサ素子陰極部24と陰
極端子25の間を一定の間隔をあけ、この間を絶縁被覆
していない低融点合金(ヒユーズ)26を介して半田付
けなどの手段で接続し、樹脂外装27シている。このヒ
ユーズ内蔵コンデンサは、素子、内部でショート故障が
発生したときに大電流が流れ、そのとき発生する熱によ
り低融点合金26が溶融する原理を利用しているので、
溶融した金属が容易に溶断されるためには、接続点から
接続点のr5は長い距離が必要であり、このため相、コ
ンデンサ素子陰極部と陰極端子との間は一定の間隔をと
っていた。A conventional solid electrolytic capacitor with a built-in fuse, as shown in FIG. On the other hand, a certain distance is left between the capacitor element cathode part 24 and the cathode terminal 25, and the gap is connected by means such as soldering via a low melting point alloy (fuse) 26 without insulation coating, and the resin exterior 27 is ing. This capacitor with a built-in fuse utilizes the principle that when a short circuit occurs inside the element, a large current flows and the low melting point alloy 26 melts due to the heat generated.
In order for the molten metal to be easily fused, it is necessary to have a long distance r5 from the connection point to the connection point, and for this reason, a certain distance was maintained between the phase, the cathode part of the capacitor element, and the cathode terminal. .
(発明が解決しようとする問題点)
上記従来の構成では、電子部品として大型になる欠点が
あり、また、接続点と接続点の位置がずれると低融点合
金の長さが異なってくるので、故障が発生してからの溶
断時間が変わり、溶断特性にばらつきを生じさせる欠点
があった。(Problems to be Solved by the Invention) The conventional configuration described above has the disadvantage that it becomes a large electronic component, and if the positions of the connection points are shifted, the lengths of the low melting point alloys will differ. The fusing time after a failure occurs varies, which has the disadvantage of causing variations in fusing characteristics.
本発明の目的は、従来の欠点を解消し、電子部品素子端
子部と外部端子との接続構成を工夫して、ばらつきの小
さい安定した溶断特性をもち、かつ小型のヒユーズ機構
内蔵型電子部品を提供することである。The purpose of the present invention is to eliminate the conventional drawbacks, improve the connection structure between the electronic component element terminal part and the external terminal, and create a small electronic component with a built-in fuse mechanism that has stable fusing characteristics with little variation. It is to provide.
(問題点を解決するための手段)
本発明のヒユーズ付電子部品は、切り裂き窓を設けた端
子部の窓部にヒユーズ部材を載置し、両端を端子部と連
結すると共に、窓枠とヒユーズ部材とを折り曲げ加工し
てL字状態と゛し、部品素子を載置し、ヒユーズ部材と
接続し、窓枠を切り裂き部品全体を外装したものであり
、また、接続部位以外絶縁処理を施したヒユーズを用い
たものである。(Means for Solving the Problems) The electronic component with a fuse of the present invention includes a fuse member placed on the window of a terminal section provided with a cutout window, both ends of which are connected to the terminal section, and a window frame and the fuse. The parts are bent to form an L-shape, the component elements are mounted, the fuse is connected, the window frame is cut out, and the entire part is exteriorized, and the fuse is insulated except for the connection parts. It uses
(作 用)
上記構成により、ヒユーズ部材の両端部を残して絶縁被
覆されているため、L字もπ造が可能となり、そのため
、スペース内に長いヒユーズ部材を用いることができ1
部品の小型化ができる。(Function) With the above configuration, since both ends of the fuse member are covered with insulation, the L-shape can also be made into a π structure, and therefore a long fuse member can be used in the space.
Parts can be made smaller.
(実施例)
本発明の一実施例を第1図ないし第4図に基づいて説明
する。(Example) An example of the present invention will be described based on FIGS. 1 to 4.
第1図は本発明のヒユーズ付電子部品の正面断面図であ
る。同図において、1はコンデンサ素子、2は内部リー
ド、3は陽極外部端子、4は表面絶縁被覆層、5はヒユ
ーズ部材であり、6はL字構造の陰極外部端子である。FIG. 1 is a front sectional view of an electronic component with a fuse according to the present invention. In the figure, 1 is a capacitor element, 2 is an internal lead, 3 is an anode external terminal, 4 is a surface insulation coating layer, 5 is a fuse member, and 6 is an L-shaped cathode external terminal.
陽極外部端子3と陰極外部端子6は、定寸法、定位置に
棧7で連結され対向している。8は導電性接着剤等によ
る接続材である。The anode external terminal 3 and the cathode external terminal 6 are connected by a lever 7 and face each other in a fixed size and a fixed position. 8 is a connecting material such as a conductive adhesive.
第2図(1)、(2)、(3)は本発明のヒユーズ付電
子部品の工法を示す概略図であり、(A)は要部拡大図
である。FIGS. 2(1), (2), and (3) are schematic diagrams showing the construction method of an electronic component with a fuse according to the present invention, and FIG. 2(A) is an enlarged view of the main part.
第2図(1)のように打ち抜かれたコムを用い、第2図
(2)のように陰極外部端子6の窓枠部にヒユーズ部材
5を載置、溶接し、そののち、第2図(3)のごとく陰
極外部端子6の一部およびヒユーズ部材5の一部に可撓
性速硬化性の絶縁層を形成したのち、この陰極外部端子
6の窓枠部を第2図(3)の(A)拡大図のようにL生
加工する6次に、第1図に示したように、接続材8(導
電性接着剤。Using a punched comb as shown in FIG. 2 (1), the fuse member 5 is placed and welded on the window frame of the cathode external terminal 6 as shown in FIG. 2 (2), and then After forming a flexible, quick-curing insulating layer on a part of the cathode external terminal 6 and a part of the fuse member 5 as shown in (3), the window frame portion of this cathode external terminal 6 is formed as shown in FIG. 2 (3). 6 Next, as shown in FIG. 1, the connecting material 8 (conductive adhesive) is applied.
ペースト状錫鉛合金等)を介してコンデンサ素子1を載
せ、陽極リード2と陽極外部端子3を溶接したのち、コ
ンデンサ素子1と陰極外部端子6を接続する。最後に、
切断分離部9で陰極外部端子6の窓枠部を切断分離し、
外装樹脂10で外装する。The capacitor element 1 is placed on the capacitor element 1 via a paste (tin-lead alloy, etc.), the anode lead 2 and the anode external terminal 3 are welded, and then the capacitor element 1 and the cathode external terminal 6 are connected. lastly,
The window frame portion of the cathode external terminal 6 is cut and separated by the cutting/separating section 9;
The exterior is covered with exterior resin 10.
次に、具体的な実施例を示す。Next, specific examples will be shown.
タンタル粉末を成形、焼結してなる電極体上に、陽極酸
化により誘電体皮膜を形成する1次に、硝酸マンガンの
水溶液を熱分解し、固体電解質である二酸化マンガンを
被覆したのち、コロイダルグラファイト、銀ペイントを
塗布して得られるコンデンサ素子を100個準備した。A dielectric film is formed by anodic oxidation on an electrode body made by molding and sintering tantalum powder.The first step is to thermally decompose an aqueous solution of manganese nitrate and coat it with manganese dioxide, which is a solid electrolyte, followed by colloidal graphite. , 100 capacitor elements obtained by applying silver paint were prepared.
これを2分割し、一方を従来方法で、他方を本発明方法
で組立外装した。第3図(A)は本発明によるヒユーズ
付電子部品の外形寸法を示し、同図(B)は従来法によ
る外形寸法を示したものである。同図より明らかなよう
に、同じ外形寸法内に収納できるコンデンサ素子は、本
発明法を採用することにより約25%大きくとれるが、
試作では同一のコンデンサ素子を用いた。This was divided into two parts, and one was assembled and packaged using the conventional method and the other using the method of the present invention. FIG. 3(A) shows the external dimensions of the electronic component with a fuse according to the present invention, and FIG. 3(B) shows the external dimensions according to the conventional method. As is clear from the figure, the capacitor element that can be accommodated within the same external dimensions can be made approximately 25% larger by adopting the method of the present invention.
The same capacitor element was used in the prototype.
第4図に第3図(A)、(B)で示された従来法と本発
明法により組立外装された製品について、それぞれ20
個ずっ5Aの溶断電流を流し、ヒユーズの溶断に必要な
時間を測定した結果を示している。Figure 4 shows 20% of the product assembled and packaged by the conventional method and the method of the present invention shown in Figures 3 (A) and (B).
The graph shows the results of measuring the time required to blow the fuse by applying a blowing current of 5 A to each fuse.
(発明の効果)
本発明によれば、ヒユーズ取付けに際し、窓枠状に打ち
抜かれた端子部を用い、前もってヒユーズを取付ける工
法が可能なため、接続位置および寸法が安定し、溶断特
性のばらつきが小さくなる。(Effects of the Invention) According to the present invention, when installing a fuse, it is possible to install the fuse in advance by using a terminal part punched out in the shape of a window frame, so the connection position and dimensions are stable, and variations in fusing characteristics are reduced. becomes smaller.
また、L生加工によりヒユーズと部品の収納効率もよく
なり、小型のヒユーズ機構内蔵型電子部品が得られ、そ
の実用上の効果は大である。Furthermore, the L raw machining improves the storage efficiency of fuses and components, and provides a small electronic component with a built-in fuse mechanism, which has great practical effects.
第1図は本発明の一実施例によるヒユーズ付電子部品の
断面図、第2図(1)、(2)、(3)は本発明の工法
を示す概略図、第3図(A)、(B)は本発明の一実施
例と従来例の寸法図、第4図は従来法および本発明法で
組立外装された製品の溶断試験結果を示す特性図、第5
図は従来例の断面図である。
1・・・コンデンサ素子、 2・・・陽極リード。
3・・・陽極外部端子、 4・・・絶縁被覆層。
5・・・ヒユーズ部材、 6・・・陰極外部端子、7・
・・棧、 8・・・接続材、 9・・・切断分離部、1
0・・・外装樹脂。
特許出願人 松下電器産業株式会社
第1図
1、−コンデンサ系± 2・・・陽捗り−ト’
、L、、陽ノ※り側15端+4、、.71色L(右0百
5、− 仁、ユース゛邪4才 6.−戸
=hhyb昔βす面Eト8、−Jψオ才(剖]色性捧者
斧J’N−,ス、ト4人多を旧合金等)10 +外装樹
脂
第2図
3Jら檜タト部角沿+ 4−J色M好支覆層
520.ヒユーズ154才6、−陸柚外邦娼± 7
.−八 90.−切断分離部第3図FIG. 1 is a sectional view of an electronic component with a fuse according to an embodiment of the present invention, FIGS. 2 (1), (2), and (3) are schematic diagrams showing the construction method of the present invention, and FIG. 3 (A), (B) is a dimensional drawing of an embodiment of the present invention and a conventional example, Fig. 4 is a characteristic diagram showing the results of fusing tests of products assembled and packaged by the conventional method and the method of the present invention, and Fig. 5
The figure is a sectional view of a conventional example. 1... Capacitor element, 2... Anode lead. 3... Anode external terminal, 4... Insulating coating layer. 5... Fuse member, 6... Cathode external terminal, 7...
. . . 8 . . . Connecting material 9 . . . Cutting separation part 1
0...Exterior resin. Patent applicant: Matsushita Electric Industrial Co., Ltd.
, L, , positive side 15 end + 4, . 71 color L (right 0 hundred 5, - Jin, youth ゛ evil 4 years old 6. - door = hhyb old β surface E to 8, - Jψ O sai (autobiography) color dedicator ax J'N -, su, to 4 people (old alloy, etc.) 10 + Exterior resin Fig. 2 3J along the corners of the Japanese cypress tatto part + 4-J color M favorable support layer
520. Hughes 154 years old 6, - Rikuyu Gaiho prostitute ± 7
.. -8 90. - Cutting and separating section Figure 3
Claims (2)
を載置し、両端を端子部と連結すると共に、窓枠とヒュ
ーズ部材とを折り曲げ加工してL字状態とし、部品素子
を載置し、前記ヒューズ部材と接続し、前記窓枠を切り
裂き部品全体を外装してなることを特徴とするヒューズ
付電子部品。(1) Place the fuse member in the window of the terminal section provided with the cutout window, connect both ends to the terminal section, bend the window frame and fuse member to form an L-shape, and place the component element. 1. An electronic component with a fuse, characterized in that the electronic component is mounted on the fuse member, connected to the fuse member, and the entire component is exteriorized by cutting out the window frame.
ことを特徴とする特許請求の範囲第(1)項記載の電子
部品。(2) The electronic component according to claim (1), characterized in that a fuse is used which is insulated except for the connecting portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62260786A JP2631375B2 (en) | 1987-10-17 | 1987-10-17 | Manufacturing method of electronic parts with fuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62260786A JP2631375B2 (en) | 1987-10-17 | 1987-10-17 | Manufacturing method of electronic parts with fuse |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01105524A true JPH01105524A (en) | 1989-04-24 |
JP2631375B2 JP2631375B2 (en) | 1997-07-16 |
Family
ID=17352714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62260786A Expired - Fee Related JP2631375B2 (en) | 1987-10-17 | 1987-10-17 | Manufacturing method of electronic parts with fuse |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2631375B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06140290A (en) * | 1992-10-23 | 1994-05-20 | Rohm Co Ltd | Solid-state electrolytic capacitor structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63204611A (en) * | 1987-02-19 | 1988-08-24 | 日立エーアイシー株式会社 | Manufacture of solid electrolytic capacitor |
-
1987
- 1987-10-17 JP JP62260786A patent/JP2631375B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63204611A (en) * | 1987-02-19 | 1988-08-24 | 日立エーアイシー株式会社 | Manufacture of solid electrolytic capacitor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06140290A (en) * | 1992-10-23 | 1994-05-20 | Rohm Co Ltd | Solid-state electrolytic capacitor structure |
Also Published As
Publication number | Publication date |
---|---|
JP2631375B2 (en) | 1997-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |