JPH0115176Y2 - - Google Patents
Info
- Publication number
- JPH0115176Y2 JPH0115176Y2 JP663683U JP663683U JPH0115176Y2 JP H0115176 Y2 JPH0115176 Y2 JP H0115176Y2 JP 663683 U JP663683 U JP 663683U JP 663683 U JP663683 U JP 663683U JP H0115176 Y2 JPH0115176 Y2 JP H0115176Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal
- cathode terminal
- polyphenylene sulfide
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 239000003990 capacitor Substances 0.000 claims description 19
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 13
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 13
- 239000011888 foil Substances 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 12
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 7
- 230000006378 damage Effects 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 229920006389 polyphenyl polymer Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
本考案は保安機能を有する固体電解コンデンサ
に関するものである。[Detailed Description of the Invention] The present invention relates to a solid electrolytic capacitor having a safety function.
タンタル等の弁作用金属の粉末からなる焼結体
を用いた固体電解コンデンサは、一般的に、アル
ミ電解コンデンサやフイルムコンデンサ、MPコ
ンデンサ等のコンデンサに比べて、使用中の不良
が少なく、また、破壊してもエネルギーが小さい
ために他の電子部品を損傷するような事故も少な
い。それ故、保安機能が必要とされることがほと
んどなかつたが、最近、電気製品が複雑になり精
密な電子部品が数多く使われるようになるに従つ
て、固体電解コンデンサが破壊され短絡した際に
流れる短絡電流によつて他の電子部品を損傷する
事故が発生することが多くなつてきた。そしてこ
のような事故を防止するため保安機能を有する固
体電解コンデンサが要求されるようになつてき
た。 Solid electrolytic capacitors that use sintered bodies made of powdered valve metals such as tantalum generally have fewer defects during use than capacitors such as aluminum electrolytic capacitors, film capacitors, and MP capacitors. Even if they are destroyed, the energy is small, so accidents that damage other electronic components are rare. Therefore, safety functions were rarely needed, but recently, as electrical products have become more complex and many precision electronic parts are used, solid electrolytic capacitors have become more susceptible to damage and short circuits. Accidents that damage other electronic components due to flowing short-circuit current are becoming more common. In order to prevent such accidents, solid electrolytic capacitors having safety functions have become required.
従来、このような要求を満たすために、例え
ば、焼結体から引き出されているタンタル線等に
電流ヒユーズや温度ヒユーズを接続して大電流が
流れた際あるいは焼結体の発熱によつてこれ等の
ヒユーズを溶断するようにしたものや、陰極端子
をバネ状にして金属層に接続し、焼結体の発熱に
より金属層が溶け陰極端子が外装の薄い部分から
飛び出すようにした構造のもの等が用いられてい
る。しかしながら、前者の場合はタンタル線等が
非常に細いために非常にヒユーズの接続が困難で
量産に適さない欠点があり、また、後者の場合に
は、陰極端子がバネ性を維持したままでこの陰極
端子を金属層に接続し外装を施すことが困難であ
る欠点がありしかもデイツプ型の場合のように外
装の厚みにムラが生じるようなものについてはそ
の保安機能の作動条件がバラつき一定しない欠点
もあつた。 Conventionally, in order to meet these requirements, for example, a current fuse or a temperature fuse was connected to a tantalum wire drawn out from a sintered body, and this was done by connecting a current fuse or a temperature fuse to a tantalum wire drawn out from a sintered body. The cathode terminal is shaped like a spring and connected to the metal layer, and the heat generated by the sintered body causes the metal layer to melt and the cathode terminal to pop out from the thin part of the exterior. etc. are used. However, in the former case, the tantalum wire etc. are very thin, making it extremely difficult to connect the fuse and making it unsuitable for mass production.In the latter case, the cathode terminal maintains its springiness, making it difficult to connect the fuse. It has the disadvantage that it is difficult to connect the cathode terminal to the metal layer and apply the sheathing, and in addition, in cases where the thickness of the sheath is uneven, such as in the case of a dip type, the operating conditions of the safety function vary and are not constant. It was hot too.
本考案は、以上の欠点を改良し、製造が容易で
確実に作動しうる保安機能を有する固体電解コン
デンサの提供を目的とするものである。 The present invention aims to improve the above-mentioned drawbacks, and to provide a solid electrolytic capacitor that is easy to manufacture and has a safety function that ensures reliable operation.
本考案は、上記の目的を達成するために、金属
層と陰極層とを接続する金属箔と、前記金属層と
前記陰極端子との間に充填された熱硬化性樹脂層
と、該熱硬化性樹脂層と前記金属層を被覆してい
る前記金属層又は前記金属箔の融点付近で軟化す
るポリフエニレンサルフアイド層とを有すること
を特徴とする固体電解コンデンサを提供するもの
である。 In order to achieve the above object, the present invention provides a metal foil connecting a metal layer and a cathode layer, a thermosetting resin layer filled between the metal layer and the cathode terminal, and a thermosetting resin layer. The present invention provides a solid electrolytic capacitor comprising a polyphenylene sulfide layer that softens near the melting point of the metal layer or metal foil covering the metal layer.
以下、本考案の実施例を図面に基づいて説明す
る。 Hereinafter, embodiments of the present invention will be described based on the drawings.
第１図において、１はタンタル粉末を円筒状に
成形した焼結体に陽極酸化皮膜、二酸化マンガン
層、カーボン層、銀ペースト層及び半田層２を順
次形成したコンデンサ素子であり、タンタル線３
が引き出されている。４はタンタル線３に接続さ
れた陽極端子であり、端に突出部が設けられ樹脂
のデイツプ後のタレを防ぐようになつている。５
はスズや亜鉛、鉛等の半田付け可能な金属からな
る、厚さ数10μ程度の金属箔であり、一端が半田
層２に接続されている。６はＬ字状の陰極端子で
あり、金属箔５の他端が接続されている。７は半
田層の一部と陰極端子６の一部を被いかつ金属箔
５の先端を露出するようにして、半田層と陰極端
子６との間に充填されたエポキシ等の熱硬化性樹
脂層である。８は半田層２及び熱硬化性樹脂層７
を被覆しているポリフエニレンサルフアイド層で
あり、結晶性で溶融温度（270℃〜280℃）付近か
ら急速に軟化し粘性が低下するという性質を有し
ている。特に、半田層２の融点をこのポリフエニ
ルサルフエイド層の融点付近に設定している。 In FIG. 1, 1 is a capacitor element in which an anodized film, a manganese dioxide layer, a carbon layer, a silver paste layer, and a solder layer 2 are sequentially formed on a sintered body made of tantalum powder molded into a cylindrical shape, and a tantalum wire 3
is being brought out. 4 is an anode terminal connected to the tantalum wire 3, and a protrusion is provided at the end to prevent the resin from sagging after dipping. 5
is a metal foil made of a solderable metal such as tin, zinc, or lead, and has a thickness of about 10 μm, and one end is connected to the solder layer 2. 6 is an L-shaped cathode terminal, to which the other end of the metal foil 5 is connected. 7 is a thermosetting resin layer such as epoxy filled between the solder layer and the cathode terminal 6 so as to cover a part of the solder layer and a part of the cathode terminal 6 and expose the tip of the metal foil 5. It is. 8 is a solder layer 2 and a thermosetting resin layer 7
It is a polyphenylene sulfide layer that coats the polyphenylene sulfide layer, which is crystalline and has the property of rapidly softening and decreasing viscosity from around the melting temperature (270°C to 280°C). In particular, the melting point of the solder layer 2 is set near the melting point of this polyphenyl sulfide layer.
すなわち、外部回路から電圧が印加され、焼結
体の一部が劣化してその劣化部分を通して大電流
が流れ、発熱すると、融点の低い半田層２が溶け
る。半田層２の融点をポリフエニレンサルフアイ
ドの融点とほぼ同一にしてあるので、半田層２が
溶けた時点においては、熱硬化性樹脂層７は硬化
したままであるがポリフエニレンサルフアイド層
は溶融し始め急速に軟化し粘性が低下した状態に
なつている。そのために、半田層２が溶けて膨脹
しポリフエニレンサルフアイド層９を通つてコン
デンサ９外に放出され、同時にもとの半田層２の
場所にはポリフエニレンサルフアイドが流れ込
む。すなわち、金属箔５と銀ペースト層あるいは
カーボン層とがポリフエニレンサルフアイドによ
り絶縁されるので、コンデンサ９は外部回路から
開放され外部からの電流の流れが遮断され破壊が
未然に防止される。 That is, when a voltage is applied from an external circuit, a part of the sintered body deteriorates, a large current flows through the deteriorated part, and heat is generated, the solder layer 2 having a low melting point melts. Since the melting point of the solder layer 2 is made almost the same as the melting point of polyphenylene sulfide, when the solder layer 2 melts, the thermosetting resin layer 7 remains hardened, but the polyphenylene sulfide layer melts. begins to melt, rapidly softens, and becomes less viscous. Therefore, the solder layer 2 melts, expands, and is discharged from the capacitor 9 through the polyphenylene sulfide layer 9, and at the same time, the polyphenylene sulfide flows into the original solder layer 2. That is, since the metal foil 5 and the silver paste layer or the carbon layer are insulated by the polyphenylene sulfide, the capacitor 9 is disconnected from the external circuit, the flow of current from the outside is cut off, and destruction is prevented.
なお、ポリフエニレンサルフアイド層の内側に
適当な溶融温度の熱可塑性樹脂層を設けてもよく
同様な効果が得られる。 Note that a thermoplastic resin layer having an appropriate melting temperature may be provided inside the polyphenylene sulfide layer to obtain the same effect.
また、金属箔の融点をポリフエニレンサルフア
イド層の融点付近に設定し、金属箔が溶けた状態
にあつた際にポリフエニレンサルフアイド層が軟
化した状態になるようにしても同様な効果が得ら
れる。 The same effect can also be obtained by setting the melting point of the metal foil near the melting point of the polyphenylene sulfide layer so that the polyphenylene sulfide layer is in a softened state when the metal foil is in a melted state. is obtained.
以上の通り、本考案によれば、焼結体の発熱を
利用し、金属層を溶かし、熱可塑性樹脂を流し込
み金属箔を開放して、電流を遮断するものであ
り、製造が容易でしかも発熱により確実に作動可
能な保安機能を有する固体電解コンデンサが得ら
れる。 As described above, according to the present invention, the heat generated by the sintered body is used to melt the metal layer, pour the thermoplastic resin, and open the metal foil to interrupt the current, which is easy to manufacture and generates no heat. As a result, a solid electrolytic capacitor having a safety function that can be operated reliably can be obtained.
図は本考案の実施例の断面図を示す。
１……コンデンサ素子、２……半田層、５……
金属箔、６……陰極端子、７……熱硬化性樹脂
層、８……ポリフエニルサルフエイド層、９……
コンデンサ。
The figure shows a cross-sectional view of an embodiment of the invention. 1... Capacitor element, 2... Solder layer, 5...
Metal foil, 6... Cathode terminal, 7... Thermosetting resin layer, 8... Polyphenyl sulfide layer, 9...
capacitor.
Claims (1)
カーボン層、金属層が順次積層され、前記金属
層に陰極端子が接続され外装の施された固体電
解コンデンサにおいて、金属層と陰極端子とを
接続する金属箔と、前記金属層と前記陰極端子
との間に充填された熱硬化性樹脂層と、該熱硬
化性樹脂層と前記金属層を被覆している前記金
属層又は前記金属箔の融点付近で軟化するポリ
フエニレンサルフアイド層とを有することを特
徴とする固体電解コンデンサ。 ２ 熱硬化性樹脂層とポリフエニレンサルフアイ
ド層との間に熱可塑性樹脂層が設けられている
実用新案登録請求の範囲第１項記載の固体電解
コンデンサ。[Claims for Utility Model Registration] 1. Oxide film, semiconductor layer,
In a solid electrolytic capacitor in which a carbon layer and a metal layer are sequentially laminated, a cathode terminal is connected to the metal layer, and an exterior is provided, the metal foil connects the metal layer and the cathode terminal, and the metal layer and the cathode terminal are connected to each other. and a polyphenylene sulfide layer that softens near the melting point of the metal layer or metal foil that covers the thermosetting resin layer and the metal layer. A solid electrolytic capacitor characterized by: 2. The solid electrolytic capacitor according to claim 1, wherein a thermoplastic resin layer is provided between the thermosetting resin layer and the polyphenylene sulfide layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP663683U JPS59112930U (en) | 1983-01-20 | 1983-01-20 | solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP663683U JPS59112930U (en) | 1983-01-20 | 1983-01-20 | solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59112930U JPS59112930U (en) | 1984-07-30 |
| JPH0115176Y2 true JPH0115176Y2 (en) | 1989-05-08 |
Family
ID=30138182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP663683U Granted JPS59112930U (en) | 1983-01-20 | 1983-01-20 | solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59112930U (en) |
-
1983
- 1983-01-20 JP JP663683U patent/JPS59112930U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59112930U (en) | 1984-07-30 |
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