JPH01105327U - - Google Patents
Info
- Publication number
- JPH01105327U JPH01105327U JP20050187U JP20050187U JPH01105327U JP H01105327 U JPH01105327 U JP H01105327U JP 20050187 U JP20050187 U JP 20050187U JP 20050187 U JP20050187 U JP 20050187U JP H01105327 U JPH01105327 U JP H01105327U
- Authority
- JP
- Japan
- Prior art keywords
- electric wire
- groove
- bundle
- wire bundle
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000005187 foaming Methods 0.000 description 1
Landscapes
- Installation Of Indoor Wiring (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20050187U JPH01105327U (no) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20050187U JPH01105327U (no) | 1987-12-28 | 1987-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01105327U true JPH01105327U (no) | 1989-07-17 |
Family
ID=31490905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20050187U Pending JPH01105327U (no) | 1987-12-28 | 1987-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01105327U (no) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020162147A1 (ja) * | 2019-02-08 | 2020-08-13 | 株式会社オートネットワーク技術研究所 | ドア用配線モジュール及びドア用配線モジュールの製造方法 |
| JP2021013274A (ja) * | 2019-07-09 | 2021-02-04 | 矢崎総業株式会社 | ワイヤハーネスのパネル配索構造、ハーネスモジュール、及びワイヤハーネスのパネル配索方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5039566U (no) * | 1973-08-10 | 1975-04-23 |
-
1987
- 1987-12-28 JP JP20050187U patent/JPH01105327U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5039566U (no) * | 1973-08-10 | 1975-04-23 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020162147A1 (ja) * | 2019-02-08 | 2020-08-13 | 株式会社オートネットワーク技術研究所 | ドア用配線モジュール及びドア用配線モジュールの製造方法 |
| CN113382890A (zh) * | 2019-02-08 | 2021-09-10 | 株式会社自动网络技术研究所 | 车门用配线模块及车门用配线模块的制造方法 |
| JP2021013274A (ja) * | 2019-07-09 | 2021-02-04 | 矢崎総業株式会社 | ワイヤハーネスのパネル配索構造、ハーネスモジュール、及びワイヤハーネスのパネル配索方法 |