JPH01105327U - - Google Patents

Info

Publication number
JPH01105327U
JPH01105327U JP20050187U JP20050187U JPH01105327U JP H01105327 U JPH01105327 U JP H01105327U JP 20050187 U JP20050187 U JP 20050187U JP 20050187 U JP20050187 U JP 20050187U JP H01105327 U JPH01105327 U JP H01105327U
Authority
JP
Japan
Prior art keywords
electric wire
groove
bundle
wire bundle
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20050187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20050187U priority Critical patent/JPH01105327U/ja
Publication of JPH01105327U publication Critical patent/JPH01105327U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Installation Of Indoor Wiring (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案よりなる電線束取付装置の実施
例を示した説明図、第2図はその要部縦断面拡大
図である。 1……インストルメントパネル、2……凹溝、
3……電線束、4……発泡性樹脂材料。
FIG. 1 is an explanatory view showing an embodiment of the wire bundle attachment device according to the present invention, and FIG. 2 is an enlarged vertical cross-sectional view of the main part thereof. 1...Instrument panel, 2...Concave groove,
3... Electric wire bundle, 4... Foaming resin material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 横断面がU字状した凹溝2内に、電線束3を配
置するとともに発泡性樹脂材料4を充填発泡して
、前記凹溝2内に前記電線束3を固定したことを
特徴とする電線束の取付装置。
An electric wire characterized in that an electric wire bundle 3 is placed in a groove 2 having a U-shaped cross section, and a foamable resin material 4 is filled and foamed to fix the electric wire bundle 3 in the groove 2. Bundle mounting device.
JP20050187U 1987-12-28 1987-12-28 Pending JPH01105327U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20050187U JPH01105327U (en) 1987-12-28 1987-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20050187U JPH01105327U (en) 1987-12-28 1987-12-28

Publications (1)

Publication Number Publication Date
JPH01105327U true JPH01105327U (en) 1989-07-17

Family

ID=31490905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20050187U Pending JPH01105327U (en) 1987-12-28 1987-12-28

Country Status (1)

Country Link
JP (1) JPH01105327U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020162147A1 (en) * 2019-02-08 2020-08-13 株式会社オートネットワーク技術研究所 Door wiring module and door wiring module production method
JP2021013274A (en) * 2019-07-09 2021-02-04 矢崎総業株式会社 Structure for routing wiring harness on panel, harness module, and method for routing wiring harness on panel

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039566U (en) * 1973-08-10 1975-04-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039566U (en) * 1973-08-10 1975-04-23

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020162147A1 (en) * 2019-02-08 2020-08-13 株式会社オートネットワーク技術研究所 Door wiring module and door wiring module production method
CN113382890A (en) * 2019-02-08 2021-09-10 株式会社自动网络技术研究所 Vehicle door wiring module and method for manufacturing vehicle door wiring module
JP2021013274A (en) * 2019-07-09 2021-02-04 矢崎総業株式会社 Structure for routing wiring harness on panel, harness module, and method for routing wiring harness on panel

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