JPH01104024U - - Google Patents
Info
- Publication number
- JPH01104024U JPH01104024U JP19764187U JP19764187U JPH01104024U JP H01104024 U JPH01104024 U JP H01104024U JP 19764187 U JP19764187 U JP 19764187U JP 19764187 U JP19764187 U JP 19764187U JP H01104024 U JPH01104024 U JP H01104024U
- Authority
- JP
- Japan
- Prior art keywords
- etching
- solution
- semiconductor substrate
- potassium hydroxide
- silicon semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000000243 solution Substances 0.000 claims 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Weting (AREA)
Description
第１図は本考案の一実施例図である。
〈符号の説明〉、１……エツチング槽、２……
エツチング液、３……半導体基板、４……酸素ボ
ンベ、５……パイプ。
エツチング液、３……半導体基板、４……酸素ボ
ンベ、５……パイプ。
Claims (1)
- エツチング槽中にエツチング液となる水酸化カ
リウム水溶液を満たし、該水酸化カリウム水溶液
中にシリコン半導体基板を浸漬することによつて
エツチングを行なうシリコン半導体基板のエツチ
ング装置において、エツチング中に上記エツチン
グ槽中のエツチング液に酸素又はオゾンを注入す
る装置を備えたことを特徴とするエツチング装置
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19764187U JPH01104024U (ja) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19764187U JPH01104024U (ja) | 1987-12-28 | 1987-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104024U true JPH01104024U (ja) | 1989-07-13 |
Family
ID=31488185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19764187U Pending JPH01104024U (ja) | 1987-12-28 | 1987-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104024U (ja) |
-
1987
- 1987-12-28 JP JP19764187U patent/JPH01104024U/ja active Pending
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