JPH01101854U - - Google Patents

Info

Publication number
JPH01101854U
JPH01101854U JP1987197860U JP19786087U JPH01101854U JP H01101854 U JPH01101854 U JP H01101854U JP 1987197860 U JP1987197860 U JP 1987197860U JP 19786087 U JP19786087 U JP 19786087U JP H01101854 U JPH01101854 U JP H01101854U
Authority
JP
Japan
Prior art keywords
light emitting
heat sink
iron
submount
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987197860U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987197860U priority Critical patent/JPH01101854U/ja
Publication of JPH01101854U publication Critical patent/JPH01101854U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
JP1987197860U 1987-12-25 1987-12-25 Pending JPH01101854U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987197860U JPH01101854U (enExample) 1987-12-25 1987-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987197860U JPH01101854U (enExample) 1987-12-25 1987-12-25

Publications (1)

Publication Number Publication Date
JPH01101854U true JPH01101854U (enExample) 1989-07-10

Family

ID=31488393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987197860U Pending JPH01101854U (enExample) 1987-12-25 1987-12-25

Country Status (1)

Country Link
JP (1) JPH01101854U (enExample)

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