JPH01101686A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH01101686A JPH01101686A JP26004387A JP26004387A JPH01101686A JP H01101686 A JPH01101686 A JP H01101686A JP 26004387 A JP26004387 A JP 26004387A JP 26004387 A JP26004387 A JP 26004387A JP H01101686 A JPH01101686 A JP H01101686A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- insulating substrate
- printed wiring
- wiring board
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［技術分野１
本発明は、電子部品実装用に用いられるプリント配線板
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field 1] The present invention relates to a printed wiring board used for mounting electronic components.
［背景技術］
プリント配線板Ａは、樹脂積層板などの絶縁基板１に銅
箔のエツチングなどで導体回路２を設けると共に絶縁基
板１にスルーホール３を穿設してスルーホール３内にス
ルーホールメツキ７を施すことによって形成される。そ
して第６図に示すようにプリント配線板ＡをＩＣなど電
子部品８を実装するための基板として用いる場合、電子
部品８の発熱を放散するために絶縁基板１に金属板４を
埋め込んで取り付けることがなされている。すなわち、
Ｍ緑基板１に凹所９を加工してこの凹所９内に金属板４
をはめ込み、接着剤１０で金属板４を接着することによ
って金属板４を絶縁基板１に取り付けるようにしている
。そして放熱効果をさらに高めるために、金属板４より
も大きく形成し′た放熱器１２を接着剤１０で金属板４
の露出表面に接着することがなされている。[Background Art] The printed wiring board A includes a conductor circuit 2 provided on an insulating substrate 1 such as a resin laminate board by etching copper foil, etc., and a through hole 3 formed in the insulating substrate 1 to form a through hole in the through hole 3. It is formed by plating 7. As shown in FIG. 6, when the printed wiring board A is used as a board for mounting electronic components 8 such as ICs, a metal plate 4 is embedded and attached to the insulating substrate 1 in order to dissipate the heat generated by the electronic components 8. is being done. That is,
A recess 9 is formed in the M green substrate 1, and a metal plate 4 is placed inside this recess 9.
The metal plate 4 is attached to the insulating substrate 1 by fitting and bonding the metal plate 4 with an adhesive 10. In order to further enhance the heat dissipation effect, a heat sink 12 formed larger than the metal plate 4 is attached to the metal plate 4 using an adhesive 10.
It is intended to be adhered to exposed surfaces of
しかし、このように放熱器１２を金属板４の表面に接着
すると、放熱器１２のうち金属板４からはみ出す部分が
絶縁基板１の表面に接触し、金属板４が露出する側の面
において絶縁基板１に設けた導体回路２やスルーホール
３のランド１３に放熱器１２が接触してショートなどが
発生したりするおそれがあるという問題があった。However, when the heatsink 12 is bonded to the surface of the metal plate 4 in this way, the part of the heatsink 12 that protrudes from the metal plate 4 comes into contact with the surface of the insulating substrate 1, and the surface where the metal plate 4 is exposed becomes insulated. There is a problem in that the radiator 12 may come into contact with the conductor circuit 2 provided on the substrate 1 or the land 13 of the through hole 3, causing a short circuit or the like.
［発明の目的１
本発明は、上記の点に鑑みて為されたものであリ、金属
板に放熱器を取り付けてもシａ −）などが発生するよ
うなおそれのないプリント配線板を提供することを目的
とするものである。[Objective of the Invention 1] The present invention has been made in view of the above points, and provides a printed wiring board in which there is no risk of shearing occurring even when a radiator is attached to a metal plate. The purpose is to
［発明の開示］
しかして本発明は、絶縁基板１に導体回路２及１スルー
ホール３を設けると共に片面を露出させた状態で金属板
４を絶縁基板１に埋入して形成されるプリント配線板Ａ
においで、金属板４の露出面を絶縁基板１の表面から突
出させて成ることを特徴とするものであり、金属板４に
放熱器１２を取り付けても金属板４は絶縁基板１から突
出しているためにショートなどの発生するおそれがない
ようにしたものであって、以下本発明を実施例により詳
述する。[Disclosure of the Invention] The present invention provides a printed wiring formed by providing a conductor circuit 2 and a through hole 3 in an insulating substrate 1 and embedding a metal plate 4 in the insulating substrate 1 with one side exposed. Board A
The metal plate 4 is characterized in that the exposed surface of the metal plate 4 protrudes from the surface of the insulating substrate 1, and even if the heat sink 12 is attached to the metal plate 4, the metal plate 4 does not protrude from the insulating substrate 1. This invention is designed to eliminate the risk of short-circuits and the like due to the presence of the heat sink, and the present invention will be described in detail below with reference to Examples.
絶縁基板１はガラス基材エポキシ樹脂積層板など樹脂積
層板によって形成されるものであって、その片側の表面
に積層した銅箔のエツチングなどで導体回路２が形成し
てあり、またスルーホール３をパンチやドリルなどで加
工すると共にスルーホール３内周にスルーホールメツキ
７が施しである。このようにしてプリント配線板Ａを作
成することができるが、このプリント配線板ＡはＩＣな
どの電子部品８を実装する基板としてｍいることができ
、例えば半導体パッケージとして用いることができる。The insulating substrate 1 is formed of a resin laminate such as a glass-based epoxy resin laminate, and has a conductor circuit 2 formed on one surface thereof by etching a laminated copper foil, and a through hole 3. is processed using a punch or drill, and a through-hole plating 7 is applied to the inner periphery of the through-hole 3. The printed wiring board A can be created in this way, and this printed wiring board A can be used as a substrate on which electronic components 8 such as ICs are mounted, and can be used, for example, as a semiconductor package.
そして電子部品８を実装する位置に対応して絶縁基板１
の裏側には金属板４が埋め込んで取り付けである。金属
板４としては銅やアルミニウムなど熱伝導性に優れたも
ので形成するのが好ましいものであり、座ぐり加工など
で絶縁基板１に形成した凹所９に金属板４をはめ込んで
接着剤１０で接着することによって、絶縁基板１に金属
板４を取り付けるようにしである。ここで、金属板４は
絶縁基板１の裏側の面において露出されるが、ｖＪ１図
に示すようにこの露出面は絶縁基板１の表面から突出さ
せである。また、金属板４を露出させた絶縁基板１の裏
側の面には導体回路を形成しないようにしてあり、スル
ーホール３のランドも形成しないようにしである。Then, the insulating substrate 1 is placed corresponding to the position where the electronic component 8 is mounted.
A metal plate 4 is embedded and attached to the back side. The metal plate 4 is preferably made of a material with excellent thermal conductivity, such as copper or aluminum.The metal plate 4 is fitted into a recess 9 formed in the insulating substrate 1 by counterbore processing, etc., and then the adhesive 10 is applied. The metal plate 4 is attached to the insulating substrate 1 by bonding the metal plate 4 to the insulating substrate 1. Here, the metal plate 4 is exposed on the back surface of the insulating substrate 1, and this exposed surface protrudes from the surface of the insulating substrate 1, as shown in FIG. vJ1. Furthermore, no conductor circuit is formed on the back surface of the insulating substrate 1 where the metal plate 4 is exposed, and lands for the through holes 3 are also not formed.
そして第１図に示すように形成したプリント配線板Ａに
電子部品８を実装すると共に電子部品８を導体回路２と
ワイヤー１６などでボンディングし、さらに放熱器１２
を金属板４の露出する表面に接着して取り付ける。放熱
器１２は熱伝導性の良好な金属などで金属板４よりも大
かく形成されるものであり、多数の放熱用のフィン１１
が形成しである。このように放熱器１２を金属板４に取
り付けると、放熱器１２はスルーホール３の部分にまで
はみ出してくることになるが、金属板４が絶縁基板１の
表面から突出しているためにこの突出寸法分だけ放熱器
１２は絶縁基板１から離れることになり、スルーホール
３に放熱器１２が接触してショートを発生させるような
おそれはない。Then, electronic components 8 are mounted on the printed wiring board A formed as shown in FIG.
is attached to the exposed surface of the metal plate 4 by adhering it. The heat sink 12 is made of a metal with good thermal conductivity and is larger than the metal plate 4, and includes a large number of heat radiation fins 11.
is formed. When the heatsink 12 is attached to the metal plate 4 in this way, the heatsink 12 will protrude into the through hole 3, but since the metal plate 4 protrudes from the surface of the insulating substrate 1, this protrusion The heat sink 12 is separated from the insulating substrate 1 by the size, and there is no risk that the heat sink 12 will come into contact with the through hole 3 and cause a short circuit.
また放熱器１２を接着する側の面においては絶縁基板１
に導体回路やランドを設けていないために、これら絶縁
基板１の表面から突出する導体に放熱器１２が接触して
ショートを発生させるおそれもない。さらに、放熱器１
２を接着する金属板４の露出面は絶縁基板１がら突出し
ているために、放熱器１２の取り付けを容易に、おこな
うことができるものである。尚、プリント配線板Ａを半
導体バフケージなどとして用いる場合、スルーホール３
は例えば外部への接続端子を取り付けるために等に利用
される。In addition, on the side where the heat sink 12 is bonded, the insulating substrate 1
Since no conductor circuit or land is provided on the insulating substrate 1, there is no risk that the heat sink 12 will come into contact with the conductors protruding from the surface of the insulating substrate 1 and cause a short circuit. Furthermore, radiator 1
Since the exposed surface of the metal plate 4 to which the metal plate 2 is bonded protrudes from the insulating substrate 1, the heat sink 12 can be easily attached. In addition, when using the printed wiring board A as a semiconductor buff cage etc., the through hole 3
is used, for example, to attach external connection terminals.
第２図の実施例では、金属板４を露出させる側の面にお
いて絶縁基板１の表面の全面に絶縁樹脂層５が形成しで
ある。この絶縁樹脂層５はエポキシ樹脂などを塗布して
硬化させることによって形成することができ、金属板４
に放熱器１２を取り付けたときにスルーホール３などに
放熱器１２が接触することを確実に防ぐことができる。In the embodiment shown in FIG. 2, an insulating resin layer 5 is formed on the entire surface of the insulating substrate 1 on the side where the metal plate 4 is exposed. This insulating resin layer 5 can be formed by applying and curing epoxy resin, and the metal plate 4
When the heat radiator 12 is attached to the radiator, it is possible to reliably prevent the radiator 12 from coming into contact with the through hole 3 or the like.
第３図の実施例は、絶縁基板１にさらに他の絶縁基板１
ａを接着剤１４で積層してプリント配線板Ａを多層に形
成するようにしたものであり、このものでは絶縁基板１
ａに穴１５を設けて穴１５内において金属板４に直接電
子部品８を実装するようにしである。また第４図の実施
例は、絶縁基板１にさらに他の二枚の絶縁基板１ ｂ、
１ ｃを接着剤１４で積層してプリント配線板Ａを多
層に形成するようにしたものであり、各絶縁基板１ ｂ
、 １ ｃにそれぞれ穴１５．１５を設けて各絶縁基板
１ｂ。In the embodiment of FIG. 3, an insulating substrate 1 is further provided with another insulating substrate 1.
A is laminated with an adhesive 14 to form a multilayer printed wiring board A.
A hole 15 is provided in the hole 15, and the electronic component 8 is mounted directly on the metal plate 4 within the hole 15. Further, in the embodiment shown in FIG. 4, the insulating substrate 1 is further provided with two other insulating substrates 1 b,
1c are laminated with an adhesive 14 to form a multilayer printed wiring board A, and each insulating substrate 1b
, 1c with holes 15.15 in each insulating substrate 1b.
１ｃの導体回路２，２に電子部品８をワイヤー１６など
でボンディングするようにしである。第５図の実施例は
、−枚の絶縁基板１でプリント配線板Ａを形成するよう
にすると共に、絶縁基板１に穴１５を設けて穴１５内に
おいて金属板４に直接電子部品８を実装するようにした
ものである。The electronic component 8 is bonded to the conductor circuits 2, 2 of 1c using wires 16 or the like. In the embodiment shown in FIG. 5, a printed wiring board A is formed using - number of insulating substrates 1, a hole 15 is provided in the insulating substrate 1, and an electronic component 8 is mounted directly on the metal plate 4 within the hole 15. It was designed to do so.
［発明の効果ｊ
上述のように本発明にあっては、片面を露出させた状態
で金属板を絶縁基板に埋入してプリント配線板を形成す
るにあたって、金属板の露出面を絶縁基板の表面から突
出させるようにしたので、放熱器を金属板に取り付ける
にあたっては金属板が絶縁基板の表面から突出している
寸法分だけ放熱器は絶縁基板の表面から離れることにな
り、スルーホールなどに放熱器が接触してショートを発
生させるようなおそれはないものである。[Effect of the invention j As described above, in the present invention, when a printed wiring board is formed by embedding a metal plate in an insulating substrate with one side exposed, the exposed surface of the metal plate is buried in the insulating substrate. Since it is made to protrude from the surface, when attaching the heatsink to the metal plate, the heatsink will be separated from the surface of the insulating board by the distance that the metal plate protrudes from the surface of the insulating board, and the heat will be dissipated through the through hole etc. There is no risk that the devices will come into contact with each other and cause a short circuit.
第１図は本発明の一実施例の一部の断面図、第２図乃至
第５図はそれぞれ他の実施例の一部の断面図、第６図は
従来例の断面図である。
１は絶縁基板、２は導体回路、３はスルーホール、４は
金属板である。FIG. 1 is a sectional view of a part of one embodiment of the present invention, FIGS. 2 to 5 are sectional views of a part of other embodiments, and FIG. 6 is a sectional view of a conventional example. 1 is an insulating substrate, 2 is a conductive circuit, 3 is a through hole, and 4 is a metal plate.
Claims (1)
共に片面を露出させた状態で金属板を絶縁基板に埋入し
て形成されるプリント配線板においで、金属板の露出面
を絶縁基板の表面から突出させて成ることを特徴とする
プリント配線板。(1) In a printed wiring board that is formed by providing a conductor circuit and through holes on an insulating substrate and embedding a metal plate in the insulating substrate with one side exposed, the exposed surface of the metal plate is placed on the surface of the insulating substrate. A printed wiring board characterized by being made to protrude from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26004387A JPH01101686A (en) | 1987-10-15 | 1987-10-15 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26004387A JPH01101686A (en) | 1987-10-15 | 1987-10-15 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01101686A true JPH01101686A (en) | 1989-04-19 |
Family
ID=17342508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26004387A Pending JPH01101686A (en) | 1987-10-15 | 1987-10-15 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01101686A (en) |
-
1987
- 1987-10-15 JP JP26004387A patent/JPH01101686A/en active Pending
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