JPH01100457U - - Google Patents

Info

Publication number
JPH01100457U
JPH01100457U JP1987195253U JP19525387U JPH01100457U JP H01100457 U JPH01100457 U JP H01100457U JP 1987195253 U JP1987195253 U JP 1987195253U JP 19525387 U JP19525387 U JP 19525387U JP H01100457 U JPH01100457 U JP H01100457U
Authority
JP
Japan
Prior art keywords
outer frame
lead pattern
metal
insulating film
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987195253U
Other languages
English (en)
Japanese (ja)
Other versions
JP2516390Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987195253U priority Critical patent/JP2516390Y2/ja
Publication of JPH01100457U publication Critical patent/JPH01100457U/ja
Application granted granted Critical
Publication of JP2516390Y2 publication Critical patent/JP2516390Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/884
    • H10W74/00
    • H10W90/736
    • H10W90/756

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987195253U 1987-12-23 1987-12-23 半導体装置 Expired - Lifetime JP2516390Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987195253U JP2516390Y2 (ja) 1987-12-23 1987-12-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987195253U JP2516390Y2 (ja) 1987-12-23 1987-12-23 半導体装置

Publications (2)

Publication Number Publication Date
JPH01100457U true JPH01100457U (cg-RX-API-DMAC10.html) 1989-07-05
JP2516390Y2 JP2516390Y2 (ja) 1996-11-06

Family

ID=31485939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987195253U Expired - Lifetime JP2516390Y2 (ja) 1987-12-23 1987-12-23 半導体装置

Country Status (1)

Country Link
JP (1) JP2516390Y2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010097511A (ko) * 2000-04-24 2001-11-08 이중구 이층형 칩 스케일 반도체 팩키지 및, 그것의 제조 방법

Also Published As

Publication number Publication date
JP2516390Y2 (ja) 1996-11-06

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