JPH01100456U - - Google Patents
Info
- Publication number
- JPH01100456U JPH01100456U JP19548387U JP19548387U JPH01100456U JP H01100456 U JPH01100456 U JP H01100456U JP 19548387 U JP19548387 U JP 19548387U JP 19548387 U JP19548387 U JP 19548387U JP H01100456 U JPH01100456 U JP H01100456U
- Authority
- JP
- Japan
- Prior art keywords
- view
- lead frame
- lead
- semiconductor device
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19548387U JPH01100456U (de) | 1987-12-23 | 1987-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19548387U JPH01100456U (de) | 1987-12-23 | 1987-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100456U true JPH01100456U (de) | 1989-07-05 |
Family
ID=31486161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19548387U Pending JPH01100456U (de) | 1987-12-23 | 1987-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100456U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021190607A (ja) * | 2020-06-02 | 2021-12-13 | 三菱電機株式会社 | 半導体装置の製造方法、および、半導体装置 |
-
1987
- 1987-12-23 JP JP19548387U patent/JPH01100456U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021190607A (ja) * | 2020-06-02 | 2021-12-13 | 三菱電機株式会社 | 半導体装置の製造方法、および、半導体装置 |
| US11894291B2 (en) | 2020-06-02 | 2024-02-06 | Mitsubishi Electric Corporation | Manufacturing method of semiconductor device and semiconductor device |