JPS6320446U - - Google Patents
Info
- Publication number
- JPS6320446U JPS6320446U JP11410786U JP11410786U JPS6320446U JP S6320446 U JPS6320446 U JP S6320446U JP 11410786 U JP11410786 U JP 11410786U JP 11410786 U JP11410786 U JP 11410786U JP S6320446 U JPS6320446 U JP S6320446U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- molded
- molded resin
- side surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11410786U JPS6320446U (de) | 1986-07-24 | 1986-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11410786U JPS6320446U (de) | 1986-07-24 | 1986-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320446U true JPS6320446U (de) | 1988-02-10 |
Family
ID=30996537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11410786U Pending JPS6320446U (de) | 1986-07-24 | 1986-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320446U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340456A (ja) * | 1989-07-07 | 1991-02-21 | Matsushita Electron Corp | 樹脂封止半導体装置 |
-
1986
- 1986-07-24 JP JP11410786U patent/JPS6320446U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340456A (ja) * | 1989-07-07 | 1991-02-21 | Matsushita Electron Corp | 樹脂封止半導体装置 |