JPH01100444U - - Google Patents
Info
- Publication number
- JPH01100444U JPH01100444U JP1987195653U JP19565387U JPH01100444U JP H01100444 U JPH01100444 U JP H01100444U JP 1987195653 U JP1987195653 U JP 1987195653U JP 19565387 U JP19565387 U JP 19565387U JP H01100444 U JPH01100444 U JP H01100444U
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- electronic component
- film
- coated
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987195653U JPH0525241Y2 (en, 2012) | 1987-12-23 | 1987-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987195653U JPH0525241Y2 (en, 2012) | 1987-12-23 | 1987-12-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01100444U true JPH01100444U (en, 2012) | 1989-07-05 |
| JPH0525241Y2 JPH0525241Y2 (en, 2012) | 1993-06-25 |
Family
ID=31486322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987195653U Expired - Lifetime JPH0525241Y2 (en, 2012) | 1987-12-23 | 1987-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525241Y2 (en, 2012) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156560A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Semiconductor device and its production |
| JPS58197758A (ja) * | 1982-05-12 | 1983-11-17 | Sharp Corp | テ−プキヤリア装置及びその実装方法 |
-
1987
- 1987-12-23 JP JP1987195653U patent/JPH0525241Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156560A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Semiconductor device and its production |
| JPS58197758A (ja) * | 1982-05-12 | 1983-11-17 | Sharp Corp | テ−プキヤリア装置及びその実装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525241Y2 (en, 2012) | 1993-06-25 |
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